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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
BGA-NA Digi-Key OKI/Metcal Soldering, Desoldering, Rework Products ADAPTER FCR NOZZLES BGA/CSP-3500
BGA-SPY Digi-Key OKI/Metcal Soldering, Desoldering, Rework Products MIRROR REFLOW INSPECTION
BGA0009-S Digi-Key Chip Quik Inc Soldering, Desoldering, Rework Products STENCIL BGA-484 1.27MM
BGA0007-S Digi-Key Chip Quik Inc Soldering, Desoldering, Rework Products STENCIL BGA-100 1.27MM
BGA0001-S Digi-Key Chip Quik Inc Soldering, Desoldering, Rework Products STENCIL BGA-100 .8MM
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Conduct Research Top

  • Giga-snaP BGA SMT Adapters
    The new Giga-snaP line of BGA SMT adapters provide the most reliable interconnect to BGA SMT pads. These patent pending adapters remain attached through many solder cycles and will not warp as plastic molded parts. They also offer half the insertion force of other SMT adapters
  • BGA Socket Considerations - Prototype to Reality
    For many products designed with todays high-performance integrated circuits, BGA socketing systems are an essential option during the design, testing, and/or production phases of a new product development process. In response to these demanding needs, sockets featuring a wide variety of contacting
  • PCB Fabricators Collaborate, Innovate for Success
    across the site for proper component attachment, as BGA rework can be both time consuming and costly.
  • Thermal Profiling Optimizes Printed Circuit Board Assembly
    . 20 – Global SMT & Packaging - April 2008. Thermal profiling optimizes printed circuit board assembly. the volatiles evaporate, voids can form. inside the solder balls (in extreme cases a. ‘blowout’ on the ball could occur). BGA. rework, an elaborate and time-consuming. task
  • Medical Device Link .
    placement with x-ray inspection; BGA rework; mechanical/box build; and large, high-density printed circuit boards. We have customers for whom we manufacture circuit boards for prototyping of implantable equipment, and we deal a lot with prototypes for medical usage of circuit boards, says manager
  • Medical Device Link .
    that is attached to the PCB using BGA solder balls as snap-attachment features. The shell is removable. This technology offers a PCB-level shield that is applied to a populated board after it has gone through the solder reflow process. This enables manufacturers to inspect and rework the PCB unimpeded
  • Catch it Early - Guidelines for PCBA Designers (.pdf)
    with at least .015” or more of solder mask to serve as a solder. dam that separates the pad from the un-masked via. Un-masked vias or inadequate solder dams under BGA devices?. As mentioned earlier, un-masked vias tend to scavenge solder from the finished solder joint. BGA solder ball terminations
  • Methodical Socket Selection Speeds up Time-to-Market for IC Development Projects
    to accommodate tight tolerances and microscopic features of high-density BGA packages. Pin and socket interconnect can carry high current, but the technology is limited for packages with 0.8mm pitch spacing. Spring and probe contacts have been successfully used in the socket solution for fine pitch

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