Products & Services
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Supplier: Kendu International Inc.
Description: BGA IC Testing Socket
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Supplier: Newark / element14
Description: BGA SOCKET, 388POS, SMD; Connector Type:BGA Socket; No. of Contacts:388; Pitch Spacing:1.27mm; Row Pitch:1.27mm; Contact Material:Beryllium Copper; Connector Type:BGA Socket; Leaded Process Compatible:Yes
- Package Type: BGA
- Product Type: IC Socket
- RoHS Compliant: Yes
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Description: PRODUCTION BALL GRID ARRAY (BGA) SOCKET TEST SPECIFICATION
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Supplier: Advanced Interconnections Corp.
Description: BGA Socketing Systems from Advanced offer an economical and dependable alternative to direct device attach. Our patented SMT designs are field-proven in production, development, programming and test applications. Compact designs and patented features offer you cost effective solutions for BGA, LGA
- Package Type: BGA, LGA, Receptacle, Test / Prototyping Socket
- Top (Input) Side Package: BGA, LGA
- Output (Bottom) Side Package: BGA, LGA
- Product Type: IC Socket, IC Headers
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Supplier: Vision Computers, Inc. - GA
Description: Experience energy-efficient computing in a miniature form factor with the ZOTAC NM10-DTX WiFi mini-DTX platform. The ZOTAC NM10-DTX WiFi platform delivers plenty of performance for everyday tasks such as web browsing and e-mail while consuming minimal amounts of energy for true eco-friendly
- Processor / CPU Type: Intel® AtomTM
- Processor Socket: Other
- Chipset Type: Intel® Chipset
- CPU Slot: Yes
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Supplier: Plastronics Socket Company, Inc.
Description: BGA design challenges at an enabling cost. BGA sockets with the H-Pin provide a high-performance socket that is affordable for all burn-in operations. The BGA platform serves package sizes from as small as 6.0mm X 6.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages
- Package Type: BGA
- Product Type: IC Socket
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood leads the industry in BGA probing systems. We have developed probing adapters for 0.75mm pitch BGA packages. Some of our BGA probing adaptors incorporate our own high performance GHz BGA sockets. Most of our BGA probing systems are modular and are called "carrier adapters". Typically
- Package Type: BGA, Other
- Product Type: IC Probing / Analysis Adapters
- RoHS Compliant: Yes
- Center Spacing: Gold Plating
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood leads the industry in BGA probing systems. Most of our BGA probing systems are modular. We have developed probing adapters for 0.75mm pitch BGA packages. Some of our BGA probing adaptors incorporate our own high performance GHz BGA sockets. Most of our BGA probing systems are modular
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Supplier: Aaeon Systems Inc.
Description: The HSB-910I supports Intel® Pentium® M/ Celeron® M processors up to 1.8GHz with a FSB of 400MHz. Designed for support of both BGA and socket processor packages, the HSB-910I can operate fanless with an Intel® Low Power CPU or can be configured with a socket to support end user
- Chipset Type: Intel® Chipset
- I/O Bus Specifications: ISA / EISA
- Ports: Serial Ports, Parallel Ports, USB
- Features: Watchdog Timer, RJ-45 Connectors
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Description: BGA775, IC SOCKET
- Package Type: BGA
- Product Type: IC Socket
- RoHS Compliant: Yes
- Contact Plating: Gold Plating
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Supplier: Kontron USA
Description: 886LCD-M/mITX(BGA) is low cost passive cooling Embedded Mini-ITX motherboard with many up to date industrial features. The board is a variation of 886LCD-M/mITX Pentium-M Mini-ITX board. The board is based on Intel® 855GME/6300ESB Pentium-M support embedded chipset and available for long-term
- Processor / CPU Type: Intel® Celeron®, Other
- Processor Socket: Socket 478, Other
- Chipset Type: Intel® Chipset
- On Board Features: Parallel Interface (PC printer port, Centronics®), Serial Interface (RS232, RS422, RS485), On-board IDE Channels, On-board Video Controller, On-board Ethernet Controller
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Supplier: e-Media Plus, Inc.
Description: Supermicro X7SPA-L Server Motherboard - Intel - Socket BGA-559 - x Bulk Pack Mini ITX - 1 x Processor Support - 4 GB DDR2 SDRAM Maximum RAM - Serial ATA/300 - Onboard Video The X7SPA-L comes integrated with the single-core Intel ATOM D410 (1.66GHz, 11.6W) processor while the X7SPA-H/X7SPA-HF
- Processor Socket: Other
- On Board Features: Serial Interface (RS232, RS422, RS485), On-board Video Controller, On-board Ethernet Controller
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Supplier: AAEON Electronics, Inc.
Description: Application Firewall IDP/IPS Load balancing Bandwidth manager Network Access Control Web filter Anti-spam/virus Desktop Intel Pentium M/ Celeron M Network Appliance With 4 LAN Ports Main Feature Desktop 4 LAN Network Appliance Intel Pentium M/ Celeron M Processor Up To 1.8 GHz (BGA/Socket
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Supplier: Aaeon Systems Inc.
Description: The FWS-7300 features 8 LAN & PCI expansion slots and is well suited for entry-level IDS/IPS, firewall, anti-virus gateway, and Unified Threat Management (UTM) applications. The condensed 1U FWS-7300 adopts the Intel® Pentium® M/ Celeron® M processor (up to 2.1 GHz - BGA/ socket co-lay
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Featured Products for BGA Socket Top
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Advanced Interconnections Corp.
Flip-Top™ BGA Socket
Advanced Interconnections' Flip-Top ™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. More information... Features: The compact Flip-Top ™ BGA Sockets require no external hold-downs and use less PC board space than most test sockets. The patent-pending pressure retention clamp, with integral heat sink, ensures a reliable connection... (read more)
Browse IC Interconnect Components Datasheets for Advanced Interconnections Corp. -
Advanced Interconnections Corp.
BGA Socket Adapter System
An economical and reliable alternative to soldering BGA devices directly to the motherboard, the Advanced ® molded BGA Socket Adapter System enables the BGA device to be plugged into a mating socket after soldering to a pinned adapter. More Information... Available from 0.50mm to 1.27mm pitch. Protects valuable PC boards and subjects device to lower thermal stress. Same footprint as BGA device. Value-added features such as eutectic SnPb and lead-free SnAgCu solder balls, and tape and reel... (read more)
Browse IC Interconnect Components Datasheets for Advanced Interconnections Corp. -
Advanced Interconnections Corp.
Flip-Top BGA Sockets Ease Device Test
The compact Flip-Top ™ Test Socket design matches your device footprint and uses less PC board space than typical test sockets because it requires no external screws, backing plates, or mounting holes in the PCB. The hinged clamp, with integral heat sink, makes insertion and removal of devices quick and easy while ensuring a reliable connection. A chip support plate, customized to your specific IC package, allows for inconsistencies in package coplanarity, thickness, or tolerance issues... (read more)
Browse IC Sockets and Headers Datasheets for Advanced Interconnections Corp. -
Advanced Interconnections Corp.
Flip-Top BGA Test Socket for 0.50mm Pitch Devices
The Mod5 Series Flip-Top ™ BGA Socket provides a compact, surface mount test solution for micro-BGA chipsets used in applications such as handheld, mobile, and wireless product development. Precision machined spring probes with industry proven solder balls ensure high reliability performance. More Information... Model shown accommodates BGA packages up to 12mm sq. (22 x 22 rows) with larger sizes available upon request. Precision machined spring probes offer high bandwidth with very low... (read more)
Browse IC Interconnect Components Datasheets for Advanced Interconnections Corp. -
Advanced Interconnections Corp.
Surface Mount Sockets
An economical and reliable alternative to soldering BGA devices directly to the motherboard, the Advanced ® molded BGA Socket Adapter System enables the BGA device to be plugged into a mating socket after soldering to a pinned adapter. More Information... Available from 0.50mm to 1.27mm pitch. Protects valuable PC boards and subjects device to lower thermal stress. Same footprint as BGA device. Value-added features such as eutectic SnPb and lead-free SnAgCu solder balls, and tape and reel... (read more)
Browse IC Interconnect Components Datasheets for Advanced Interconnections Corp. -
Advanced Interconnections Corp.
Low Insertion Force PGA Sockets
designer and manufacturer of innovative interconnect solutions with technologically advanced features. Their patented designs offer high reliability in development, test, validation, and production level device-to-board, cable-to-board, and board-to-board applications. Advanced Interconnections specializes in IC Sockets and Adapters for BGA, LGA, PGA, CSP, QFP, PLCC, SOIC, DIP, and SIP packages as well as IC Package Conversion Adapters and Board-to-Board Connectors. Standard and custom designs... (read more)
Browse IC Sockets and Headers Datasheets for Advanced Interconnections Corp. -
Advanced Interconnections Corp.
Peel-A-Way® - Removable Socket Terminal Carriers
reliability in development, test, validation, and production level device-to-board and board-to-board applications. Advanced Interconnections specializes in IC Sockets and Adapters for BGA, PGA, CSP, QFP, PLCC, SOIC, DIP, and SIP packages as well as IC Package Conversion Adapters and Board-to-Board Connectors. Standard and custom designs are available, all featuring screw-machined terminals for superior quality and field-proven performance. To comply with the RoHS Directive and the worldwide movement... (read more)
Browse IC Sockets and Headers Datasheets for Advanced Interconnections Corp. -
Advanced Interconnections Corp.
Peel-A-Way® DIP Socket Terminal Carriers
in development, test, validation, and production level device-to-board and board-to-board applications. Advanced Interconnections specializes in IC Sockets and Adapters for BGA, PGA, CSP, QFP, PLCC, SOIC, DIP, and SIP packages as well as IC Package Conversion Adapters and Board-to-Board Connectors. Standard and custom designs are available, all featuring screw-machined terminals for superior quality and field-proven performance. To comply with the RoHS Directive and the worldwide movement toward... (read more)
Browse IC Sockets and Headers Datasheets for Advanced Interconnections Corp. -
Advanced Interconnections Corp.
SIP Headers & Sockets for Power Modules/Converters
with technologically advanced features. Their patented designs offer high reliability in development, test, validation, and production level device-to-board and board-to-board applications. Advanced Interconnections specializes in IC Sockets and Adapters for BGA, PGA, CSP, QFP, PLCC, SOIC, DIP, and SIP packages as well as IC Package Conversion Adapters and Board-to-Board Connectors. Standard and custom designs are available, all featuring screw-machined terminals for superior quality... (read more)
Browse IC Sockets and Headers Datasheets for Advanced Interconnections Corp. -
Advanced Interconnections Corp.
Device to Adapter Mounting and BGA Rework Service
Data Sheet. About Advanced Interconnections: Advanced Interconnections Corp. is an ISO 9001 Certified designer and manufacturer of innovative interconnect solutions with technologically advanced features. Patented designs offer high reliability in development, test, validation, and production level device-to-board and board-to-board applications. Advanced Interconnections specializes in IC Sockets and Adapters for BGA, PGA, CSP, QFP, PLCC, SOIC, DIP, and SIP packages as well as IC Package... (read more)
Browse IC Package Converters and Adapters Datasheets for Advanced Interconnections Corp.
Parts by Number for BGA Socket Top
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| BGA SOCKET MGA352-636GG | National Microchip | Not Provided | Not Provided | Not Provided |
| STC BGA SOCKET SERIE | ASAP Semiconductor | TPM | Not Provided | Not Provided |
| 754 M BGA SOCKET | ASAP Semiconductor | FOXCONN | Not Provided | Not Provided |
| CUSTOM BGA | Digi-Key | 3M | Connectors, Interconnects | CUSTOM BGA SOCKETS |
Conduct Research Top
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GHz BGA Socket User Manual
BGA sockets provide 6.5 to 10 GHz bandwidth in a small, cost. effective ZIF socket for prototype and test applications. The GHz. BGA socket is a simple mechanical socket based on elastomer. connector technology. The GHz socket is a solder-less socket that. can be mounted onto a PCB using screws
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BGA Socket Considerations - Prototype to Reality
For many products designed with todays high-performance integrated circuits, BGA socketing systems are an essential option during the design, testing, and/or production phases of a new product development process. In response to these demanding needs, sockets featuring a wide variety of contacting
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BGA Socket with Heatsink for High Power Devices
Catalog. Tel: (800) 404-0204 U.S. Only or (952) 229-8200 Fax: (952) 229-8201 email: info@ironwoodelectronics.com. BGA Socket with Heatsink for High Power Devices. Introduction. The classic function of a socket is to provide a connection mechanism from the IC (Integrated Circuit) to the circuit
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BGA Socket Adapter System Provides Reliable Test Equipment Connection for Engine Performance Analysis (.pdf)
to assure optimum operation of such functions as ignition timing and fuel metering. AppNote_2003-01_SocketPac A P P L I C A T I O N N O T E 2007-02. BGA Socket Adapter System Provides Reliable. Test Equipment Connection for Engine Performance Analysis. T H E C H A L L E N G E. A major
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Spring Pin Socket User Manual
SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware
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Giga-snaP BGA SMT Adapters
to fracture. socketing 1mm BGA chips. The product line. the substrate, which allows the solder ball to. consists of patent pending female sockets. flow up the pin and wick away - sometimes. with machined pins epoxy over-molded into. on the initial solder attachment. an assembly that matches a particular
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Socket-Adapter Systems: A Practical Test Alternative (.pdf)
. BY GLENN GOODMAN, Advanced Interconnections Corp. Two-piece socket-adapt-. Device. Traditional one-piece, clam-. shell-design test sockets ers can be made only 2 mm. Reflow (solder) BGA. are useful diagnostic tools larger than a BGA device. device to adapter. for establishing or evaluating device Once
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Optimizing Insertion Extraction Force in a Pin-Socket Interconnect
extraction force in pin & socket interconnects. Giga-snaP BGA Socketing System. The system consists of two modules. The base module has socket pins arranged in FR4 substrate with solder balls on the backside for attaching to the target PCB. The top module has terminal pins arranged in FR4 substrate
Engineering Web Search: BGA Socket Top
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Recommended method of attaching QFP prototype sockets to a PCB
PCB Socket Alignment Pins Figure 1 QFP Socket Prototype BGA, FG, CS Socket Please check the drawing for each package configuration and their options
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Flip-Top? BGA Socket from Advanced Interconnections Corp.
Home > Company Directory > Advanced Interconnections Corp. > Flip-Top? BGA Socket Advanced Interconnections Corp. - Flip-Top? BGA Socket
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BGA Clamshell Socket operates at bandwidths up to 10 GHz.,...
June 2, 2010 - Designed for 8 x 8 mm package size, CG-BGA-5009 socket for 0.4 mm pitch BGA 400 pin ICs connects all pins with 10 GHz bandwidth on all
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BGA Socket accommodates devices up to 6.5 mm., Aries...
BGA Socket accommodates devices up to 6.5 mm?. BGA Socket provides accessibility for thermal control.
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High Performance IC Sockets and Adapters
Mar 2013 - 10 GHz BGA Socket for DDR4 Mar 2013 - Clamshell Spring Pin BGA Socket for SPIL's 36L UFBGA
- Ironwood Socket Technologies
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Qualmax provides BGA socket and LGA socket for semiconductor...
BGA Socket / LGA Socket RF Device Socket Special Socket QFN Socket / MLF Socket POP Socket / PIP Socket QFP Socket Memory Device Socket Elastomeric
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Intel Core - Wikipedia, the free encyclopedia
Codename (main article) Brand name (list) L2 Cache Socket TDP Socket M 31 W Core Duo L2xxx 15 W Core Duo U2xxx