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  • FOUR WAYS TO REDUCE VOIDS IN BGA/CSP PACKAGE
    Voids in BGA/CSP package to substrate connections can cause issues with thermal management, drop shock resistance, and signal interference. Zero voids are always the best solution, but this is not always easy to achieve. Solder paste printing, reflow, alloy and flux chemistry all have significant
  • Variables of Pin Transfer (.pdf)
    Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or ball-attach flux) onto a substrate. It is commonly used to apply flux to BGA (ball-grid-array) pads to promote subsequent solder sphere attachment. Pins are dipped into a reservoir of material so
  • Effect of Multiple Reflow Cycles on Solder Joint Formation and Reliability
    was investigated. In the first part of the study, small size BGA's were assembled with 12mil spheres of a number of low silver. lead-free solder alloys. Substrate surface finish used was Cu-OSP. Components were subjected to up to six Pb free reflow cycles. After reflows, joints were cross sectioned
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    accelerate the development of true system-in-packaging (SIP) products by several years, has learned. The company--Substrate Technologies Inc. (STI)--has begun producing what it calls "built-up " BGA substrates for high-performance chip-packaging applications. The Carrollton, Tex.-based company

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