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Supplier: Standex-Meder Electronics
Description: and different switching matrices. Standard with ball grid array (BGA). Designed in an FR-4 substrate and rugged thermoset overmold body able to withstand reflow temperatures.
- Mounting: PC Board
- Pole Specifications: Four Pole (4P)
- Throw Specifications: Single Throw
- Normally Open (NO): 1
Supplier: Indium Corporation
Description: Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the flux is applied to the substrate via a jetting process. The assembly is then reflowed, and the epoxy flux acts to both clean
- Fluxes & Cleaners: Soldering Flux / Rosin
Standards and Technical Documents - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test -- IEC 62137-1-4:2009
Description: The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also
Description: Thickness BGA Profile Laser-Marking Depth
- Form Factor: Monitor / Instrument, Sensor / Sensing Element
- Mounting / Loading: Autoloading / In-line, Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers, Packaged ICs / Ceramic Substrates
- Measurement Capability: Shape / Flatness, Thickness - Film / Layer
Supplier: Advanced Technical Ceramics Company
Description: AdTech prides itself on being the innovation leader in the ceramic package business. Co-fired ceramic technology was invented in our Chattanooga facility over 35 years ago, and numerous patents have been issued over the years. Today, the company remains the leading US-owned non-captive supplier of
- IC Package Type: BGA, MCM, LCCC, Other
- Backend Processing: Soldering / Pasting, Hermetic Sealing, Dicing, Other
- Package Material: Ceramic, Other
- Location: North America, United States Only, Southern US Only
Standards and Technical Documents - Spherical Bend Test Method for Characterization of Board Level Interconnects -- 9707
Description: , spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side
Supplier: KLA-Tencor Corporation
Description: The CI-T120 and -T130 Component Inspectors are configured for high-volume inspection of Gull Wing, BGA, CSP and QFN devices, as well as memory cards. With a default 10-head, pick-and-place handling system and a quadruple pick-and-place head for taping, the CI series offers extraordinary throughput
- Form Factor: Other
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Packaged ICs / Ceramic Substrates
- Measurement Capability: Defects / ADC
Supplier: Samsung Electro-Mechanics
Description: This substrate consists of a rigid substrate and a flex substrate, and the flexibility of the flex component allows for 3-D circuit connection to take place. As there is no need to use connectors between modules, this substrate is advantageous in terms of miniaturization. It is also possible
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Build-to-print or design-to-spec LTCC packaging
on yours. (Download our LTCC brochure, equipment list, and design guide). The solutions you need. Whether your project requires a high-density LTCC circuit with embedded components or an Integrated Microwave Assembly (IMA) – Anaren stands ready to make your vision a reality with an exacting build-to-print or custom-designed solution. Our experience includes: > Frequency generation/ sources. > Packaging for next-gen modules (BGA, flip chip, etc.). receiver and exciter. > High... (read more)
Browse Wireless Systems Datasheets for Anaren, Inc.
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FOUR WAYS TO REDUCE VOIDS IN BGA/CSP PACKAGE
Voids in BGA/CSP package to substrate connections can cause issues with thermal management, drop shock resistance, and signal interference. Zero voids are always the best solution, but this is not always easy to achieve. Solder paste printing, reflow, alloy and flux chemistry all have significant
EETimes.com | Electronics Industry News for EEs & Engineering Managers
accelerate the development of true system-in-packaging (SIP) products by several years, has learned. The company--Substrate Technologies Inc. (STI)--has begun producing what it calls "built-up " BGA substrates for high-performance chip-packaging applications. The Carrollton, Tex.-based company
Variables of Pin Transfer (.pdf)
Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or ball-attach flux) onto a substrate. It is commonly used to apply flux to BGA (ball-grid-array) pads to promote subsequent solder sphere attachment. Pins are dipped into a reservoir of material so
MICRO:Semicon Southwest '98 - Technical/Business Programs (Oct. '98, p.127)
. For a complete listing, log onto SEMI's Web site, Flip Chip, BGA, and Packaging I Chairs: Deborah Patterson, Flip Chip; and George Riley, Hycomp Performance of Evaporated and Plated Bumps on Organic and Ceramic Substrates Addi Mistry, Jim Kleffner, John Czarnowski, Tim Scanlon, Jerry Lozano, James Guajardo
Effect of Multiple Reflow Cycles on Solder Joint Formation and Reliability
was investigated. In the first part of the study, small size BGA's were assembled with 12mil spheres of a number of low silver. lead-free solder alloys. Substrate surface finish used was Cu-OSP. Components were subjected to up to six Pb free reflow cycles. After reflows, joints were cross sectioned
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Aluminum decal for transferring solder spheres during electronic package assembly
This paper introduces a novel method for transferring solder spheres to BGA substrates or flip chip wafers that uses a decal made from aluminum foil.
Advanced Flip Chip Packaging
They are Case42.5 with 42.5 mm square BGA substrate , Case35 with 35 mm square BGA substrate and Case10 with 10 mm square BGA substrate as a case that is a several times higher density than other two cases.
Effect of Reflow Profiles on the Board Level Drop Reliability of Pb-Free (SnAgCu) BGA Assemblies
The BGA components assembled to the board were daisy-chained packages that contained the actual active die, but the electrical path was only through the BGA substrate and the die was not a part of the circuit.
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
We will also discuss how the coefficients of thermal expansion of flip chip BGA substrates at different fabri- cation stages are measured using ESPI, and how the out-of-plane deformation of different types of flip chip packages is measured using the …
Advanced Wirebond Interconnection Technology
… Improve Wire Bond Reliability Non-conformance to Die Design Report 4.6.4: Assembly and Package Design Guidelines 18.104.22.168: 22.214.171.124: 126.96.36.199: Pad Design Rules on CSP and BGA Substrates The Cost Impact of …
Automated Solder Inspection Technique for BGA-Mounted Substrates by Means of Oblique Computed Tomography
Fig. 7 shows the result of the correction performed for the OCT image which captured the actual BGA substrate .
Wafer-Level Chip-Scale Packaging
Post the 3 M acquisition of the Gore & Associates’ IC substrate business, also located in Eau Claire, Wisconsin, he continued working on the manufacturing technol- ogy development of organic flip chip/BGA and wire bond/ BGA substrates .
Effect of Trace Diamond Nanoparticle Addition
on the Interfacial, Mechanical, and Damping
Properties of Sn-3.0Ag-0.5Cu Solder Alloy
Plain lead-free solder joints and solder joints containing diamond particles were characterized in terms of interfacial microstructures and hardness on ball grid array ( BGA ) substrates with different surface finishes as a function of the number of reflow cycles.
Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package
In this work, the interfacial reactions and shear properties of the In-48Sn solder joints with the differ- ent surface finishes of the BGA substrate after bonding were investigated for the application of the In-48Sn solder in MOEM packages.
Flip-chip BGA applied high-density organic substrate
The V1 indicates driver’s waveforms, the V3 indicates transmitted waveforms through BGA substrate , the V2 indicates chip end cross talk noise, and the V4 indicates hall end cross talk noise, In the case A, the large cross talk noise is caused that …
Reliability study of a flip-chip-on-silicon BGA (FSBGA) package
… of the package, Figure 4 shows a 3D finite element mesh o f the Flip-chip-on-Silicon BGA(FSBGA) package which has both the hole and an adhesive underfill beween the silicon substrate and the BGA substrate (used in subsequent sections …