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  • Giga-snaP BGA SMT Adapters
    to fracture. socketing 1mm BGA chips. The product line. the substrate, which allows the solder ball to. consists of patent pending female sockets. flow up the pin and wick away - sometimes. with machined pins epoxy over-molded into. on the initial solder attachment. an assembly that matches a particular
  • BGA Socket Considerations - Prototype to Reality
    to substrate warping and wicking of solder into the contacts. These sockets require same space as the target IC device. Figure 6 - Small form factor, low-profile BGA SMT socketing system. Conclusion. BGA socketing systems perform important roles in the prototype, production, and end-use phases of many
  • Ball Grid Array (BGA)
    Ball-grid array (BGA) is an integrated circuit (IC) package type that places output pins in a solder-ball matrix. BGA traces are fabricated on polyimide-based films, or on laminated substrates such as bismaleimide triazine (BT). As a rule, BGA traces are designed to minimize crosstalk and potential
  • | Electronics Industry News for EEs & Engineering Managers
    accelerate the development of true system-in-packaging (SIP) products by several years, has learned. The company--Substrate Technologies Inc. (STI)--has begun producing what it calls "built-up " BGA substrates for high-performance chip-packaging applications. The Carrollton, Tex.-based company
  • Spring Pin Socket User Manual
    of the IC’s substrate. 3. Close the clamshell lid. 4. Turn the compression screw clockwise, until the compression plate makes contact with the BGA. package. 5. Turn the compression screw further so that BGA balls are compressed on the spring pins to make. contact. When turning becomes hard, full compression
  • Medical Device Link .
    various characteristics and options. Having such a variety available has contributed to the reasons CSP has not achieved the mainstream deployment enjoyed by kindred BGA devices. The options often confuse even the most knowledgeable product designers and systems developers. Interposer/Substrate
  • Medical Device Link .
    and, for some products, receive assurance of uninterrupted service. One package methodology that has been developed to miniaturize IC packages and improve their reliability in medical electronics is the micro ball-grid array (�BGA). This methodology provides a finished-component outline barely larger
  • Solder Powder: IPC
    for a guaranteed good quality BGA (ball-grid array) solder joint, but with reduced environmental impact. Our very quality-focused customer uses several different suppliers of organic FC-BGA substrates with copper OSP pads. The customer had serious concerns about occasional poor solderability of SAC305 solder

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