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Supplier: Indium Corporation
Description: Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the flux is applied to the substrate via a jetting process. The assembly is then reflowed, and the epoxy flux acts to both clean
- Fluxes & Cleaners: Soldering Flux / Rosin
- Form / Shape: Paste
Supplier: KLA-Tencor Corporation
Description: . In addition, changeover time has been reduced to a minimum. The CI series provides high performance at a minimum cost of ownership. Inspection types: Gull Wing BGA, CSP LGA Leadless devices QFN, BCC Memory cards PGA FCBGA/LGA substrates Applications: Lead/ball/pad/bump geometry Lead/ball
- Form Factor: Other
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Packaged ICs / Ceramic Substrates
- Measurement Capability: Defects / ADC
Standards and Technical Documents - Spherical Bend Test Method for Characterization of Board Level Interconnects -- 9707
Description: , spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side
Description: Thickness BGA Profile Laser-Marking Depth
- Form Factor: Monitor / Instrument, Sensor / Sensing Element
- Mounting / Loading: Autoloading / In-line, Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers, Packaged ICs / Ceramic Substrates
- Measurement Capability: Shape / Flatness, Thickness - Film / Layer
Supplier: Advanced Technical Ceramics Company
Description: thermal analysis software and highly qualified engineering staff. Refractory Metal Standoffs For the ultimate in standoffs, AdTech can co-fire refractory metal "bumps" on BGAs or substrates that will retain their shape through multiple solder reflow operations. Materials Selection Multilayer
- IC Package Type: BGA, MCM, LCCC, Other
- Backend Processing: Soldering / Pasting, Hermetic Sealing, Dicing, Other
- Package Material: Ceramic, Other
- Location: North America, United States Only, Southern US Only
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Featured Products for BGA Substrate Top
OK International, Inc.
APR-5000 XL/XLS Array Package Rework System
and outer preheaters enabling fast and easy profiling. The total productivity of the unit has been measurably increased by reducing rework cycle time and protecting the component under rework from thermal damage. The new design permits a lower nozzle temperature to achieve the same required temperature at the solder joints or balls while reducing BGA lid temperatures, a significant source of failure by thermal damage. The APR-5000 XL/XLS improves its ability to manage the narrow lead-free process... (read more)
Browse SMT Manufacturing Equipment Datasheets for OK International, Inc.
Instrumentation Grade Reed Relays
together without having to deal with magnetic coupling effects between relays. This is the case whether you are designing a two dimensional or three dimensional relay matrix. A BGA option is offered for additional PCB attach methods. SIL RF Reed Relay Series. The SIL RF Series is configured in a standard SIL through-hole package with UL certification. Its internal coaxial shield offers a consistent 50 Ω impedance path for excellent RF characteristics at an economical cost. The insertion loss... (read more)
Browse RF Switches Datasheets for Standex-Meder Electronics
Conduct Research Top
Giga-snaP BGA SMT Adapters
to fracture. socketing 1mm BGA chips. The product line. the substrate, which allows the solder ball to. consists of patent pending female sockets. flow up the pin and wick away - sometimes. with machined pins epoxy over-molded into. on the initial solder attachment. an assembly that matches a particular
BGA Socket Considerations - Prototype to Reality
to substrate warping and wicking of solder into the contacts. These sockets require same space as the target IC device. Figure 6 - Small form factor, low-profile BGA SMT socketing system. Conclusion. BGA socketing systems perform important roles in the prototype, production, and end-use phases of many new
Ball Grid Array (BGA)
Ball-grid array (BGA) is an integrated circuit (IC) package type that places output pins in a solder-ball matrix. BGA traces are fabricated on polyimide-based films, or on laminated substrates such as bismaleimide triazine (BT). As a rule, BGA traces are designed to minimize crosstalk and potential
EETimes.com | Electronics Industry News for EEs & Engineering Managers
accelerate the development of true system-in-packaging (SIP) products by several years, has learned. The company--Substrate Technologies Inc. (STI)--has begun producing what it calls "built-up" BGA substrates for high-performance chip-packaging applications. The Carrollton, Tex.-based company
Spring Pin Socket User Manual
of the IC's substrate. 3. Close the clamshell lid. 4. Turn the compression screw clockwise, until the compression plate makes contact with the BGA. package. 5. Turn the compression screw further so that BGA balls are compressed on the spring pins to make. contact. When turning becomes hard, full compression
Medical Device Link .
various characteristics and options. Having such a variety available has contributed to the reasons CSP has not achieved the mainstream deployment enjoyed by kindred BGA devices. The options often confuse even the most knowledgeable product designers and systems developers. Interposer/Substrate
Medical Device Link .
and, for some products, receive assurance of uninterrupted service. One package methodology that has been developed to miniaturize IC packages and improve their reliability in medical electronics is the micro ball-grid array (�BGA). This methodology provides a finished-component outline barely larger
Medical Device Link .
: discretes (e.g., surface-mount multilayer chip capacitors, surface-mount tantalum capacitors, surface-mount resistors and surface-mount inductors); array packages (e.g., CSP, BGA); substrates and interconnects; and hybrids. "There are very high expectations for reliability in medical devices, especially
Engineering Web Search: BGA Substrate Top
Ball Grid Array (BGA) Packaging Technology
Ball Grid Array (BGA) Packaging Technology Ball Grid Array (BGA) Packaging Technology
Bga Package Having Substrate With Exhaust Hole invention
Bga package having substrate with exhaust hole -> Monitor Keywords Bga package having substrate with exhaust hole
Bga Package Substrate And Method Of Fabricating Same invention...
Bga package substrate and method of fabricating same -> Monitor Keywords Bga package substrate and method of fabricating same
Print board Die attach Solder balls Plastic BGA (mold type) Chip Resin Au wires Solder balls Printed substrate 6 DB81-10002-2E Package Lineup/ Forms/
What is the typical BGA substrate pad alloy
What is the typical BGA substrate pad alloy What is the typical BGA substrate pad alloy
Package Information for Stratix II & Stratix II GX Devices
outlines Tables 16?1 and 16?2 show which Altera Stratix II and Stratix II GX devices, respectively, are available in FineLine BGA? (FBGA) packages.
High Performance Coreless Flip-Chip BGA Packaging Technology
coreless flip chip BGA substrate showed higher insertion loss and lower return loss than standard (3/2/3) flip chip BGA substrate.
Advanced coreless flip-chip BGA package with high dielectric...
original core substrate has 12 layers (4-4-4) and the revised coreless substrate has 9 layers (8+1), the cost of flip-chip BGA substrate could be