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  • Bismaleimide (BMI) Resins
    Bismaleimide (BMI) resins are polyimides used in high-performance structural composites that require superior toughness and high-temperature resistance. BMI resins have processing characteristics similar to epoxy resins, and are used as laminating resins, prepregs, and adhesives. Epoxy blends
  • Ball Grid Array (BGA)
    Ball-grid array (BGA) is an integrated circuit (IC) package type that places output pins in a solder-ball matrix. BGA traces are fabricated on polyimide-based films, or on laminated substrates such as bismaleimide triazine (BT). As a rule, BGA traces are designed to minimize crosstalk and potential

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