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Product Announcements
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Heat Transfer Plates for the OEM
MP Metal Products Arc Deposition Targets Synertech P/M Inc. SUPER PILOT SR-1029 Super Pilot Enterprise Co., Ltd. “Near Net Shape” PM HIP Synertech P/M Inc. Oval Gasket (O-108) MP Metal Products Lighting Components Elmet Technologies, Inc. |
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Effects of ball pad configuration on joint reliability in BGA... Effects of ball pad configuration on joint reliability in BGA chip-scale packages |
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Linear finite element stress simulation of solder joints on... been performed to simulate thermally induced stresses on 225 I/O plastic ball grid array (PBGA) packages under thermal cycling (TC) condition. |
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Xilinx UG112 Device Package User Guide Added CF1752 to heading in CF1509 column, and changed "Solder (ball) land pitch" to "Solder (column) land pitch" in Table 5-5, page 83. See Xilinx, Inc. Information |
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Factors affecting the long-term stability of Cu/Al ball bonds... Factors affecting the long-term stability of Cu/Al ball bonds subjected to standard and extended high temperature storage |
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ON Semiconductor: RoHS (Material Composition) Base part Part Status HF Excel CSV MOLD COMPOUND LEADFRAME DIE ATTACH DIE PLATING WIRE BOND HEAT SINK / HEAT SPREADER SUBSTRATE SOLDER BALL TOTAL See ON Semiconductor L.L.C. Information |
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IBM Technical Journals Attachment of Solder Ball Connect (SBC) packages to circuit cards |