Bonded Wafer Inspection

Conduct Research

• MICRO: The Hot Button
  , three to four times as many inspections are required to ensure defect-free substrates. The result of this is a significant rise in the inspection cost of ownership unless a corresponding increase in inspection throughput can also be achieved. For years, traditional wafer-surface inspection has...
• Evaluating chemical mechanical cleaning technology for post-CMP applications
  . This type of defect can be several microns wide and tens of microns long. The density of these defects is variable but seldom very large. The slurry that forms a Class B defect is strongly bonded to the wafer surface. Figure 2: Large-area Class B defects can be caused by agglomerated slurry particles...
• MICRO:Product Technology News (June '99)
  cell. (Semicon West, San Francisco, Esplanade, Booth 4141) Wafer Inspection System Topcon Technologies Paramus, NJ A universal defect classification system for 6- to 12-in. wafers, the WM-2500/3000 has 0.06-um sensitivity. It features simultaneous acquisition of multiple laser signals, which...
• MICRO: Wet Surface Technologies
  and are independent of each other. Each particle experiences a cleaning force that, on average, is the same as that for any other particle. However, cleaning efficiency varies widely depending on whether the particles have bonded to the wafer surface. Sedimentation. The number of particles that land...
• MICRO: Products
  of 3-D measurement data and generating a video of the device as it moves. The option includes a custom illumination source, electronics, and MEMS-focused analysis software. (Semicon Europa, Booths B1.222H and B1.334) Used in silicon quality and process control applications to perform noncontact wafer...
• MICRO: Defect/Yield Analysis
  of chemically and physically bonded slurry residuals on the wafer surface. Mechanical brush scrubbing was then performed using double-sided scrubbers in an aqueous environment. The cleaning efficiency of the rinse depends on process time and rinse media. This experiment compared a standard rinse (recipe...
• MICRO:March 1998:Product Technology News (p.122)
  The ViPRR variable-input pneumatic retaining ring produces uniformity to within 3 mm of the wafer's edge. For use on the company's Symphony-CMP and Model 6DS-SP CMP tools, the carrier can be employed for advanced planarization applications to 0.18 um. It is made of corrosion-resistant titanium...
• MICRO: Behind the Mask - Walker (February 2001)
  of silicon carbide. The wafer is bonded to a support ring that forms a rigid mechanical interface for processing and mounting in the x-ray stepper. A single large membrane, which is usually ~35 x 35 mm in size, contains the patterned regions. These opaque regions with the desired device patterns...
• MICRO:Top 40 (Nov '99)
  readers have chosen the annual Top 40 Product All-Stars for 1999. You have selected a wide range of products, from spin coating valves, CD-SEMs, and wafer inspection systems to high-purity connectors, dielectric etch systems, and resist removal tools. The winners, and Page Two of Product Allstars...
• MICRO:Top 40 (Nov '99)
  readers have chosen the annual Top 40 Product All-Stars for 1999. You have selected a wide range of products, from spin coating valves, CD-SEMs, and wafer inspection systems to high-purity connectors, dielectric etch systems, and resist removal tools. The winners, and Page Two of Product Allstars...

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