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Supplier: Seaward Group USA
Description: tester meets the general requirements of the majority of international test standards that relate to system earth continuity or ground bonding measurement.
- Testing Method: Manual
- Display: Analog Meter
- Safety Agency Rating: CE Conformity Marks
- Features: Warning Indicator Light, Buzzer or Annunciator
Supplier: Seaward Group USA
Description: The DO7010 micro ohmmeter is a practical instrument for low resistance and bonding resistance measurement, ideal for use in the workshop, field or test facilities. It is of rugged construction, contained in a sealed case. With a measuring range of 600µ? to 60? with 0.1 and 10m? resolution
- Testing Method: Automatic, Manual
- Display: Digital Meter
- Interfaces: RS232
- Safety Agency Rating: IEC
Supplier: Hitachi High Technologies America, Inc.
Description: 300mm Die Bonder - Engineered for High Speed Sip Assembling Laser length measurement combined with mechanical dispenser results in high percision paste application utilizing non-contact nozzle height control Thermo-pressure bonding is achieved by substrate heater/collet heater use Superb Thin Die
Supplier: Weschler Instruments
Description: The MIT400 Insulation/Continuity Testers offer outstanding performance and ease of use. Dual digital displays show test results and test voltage simultaneously. Hands free 200 & 20mA continuity test ranges ensure the accurate measurement of circuit conductors and bonding. An audible continuity
- Types of Measurements: Insulation Resistance
- Display: Analog Meter, Digital Meter
Supplier: Columbia Research Labs, Inc.
Description: block. The electrical isolation provided by the epoxy bonding permits accurate, repeatable measurements even in noisy industrial environments. This unit is equipped with the exclusive Columbia microminiature detachable cable assembly that is easily replaced. The Model 612-TXHT is a high temperature
- Number of Axes: Triaxial
- Technology: Piezoelectric
- Device Type: Sensor / Transducer
- Sensor Output: Acceleration
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Featured Products for Bonding Measurement Top
Columbia Research Labs, Inc.
Very Small 3Axis Sensor for Vibration Measurements
The Model 612-TX Triaxial Piezoelectric Accelerometer is designed to meet the most stringent space and mass loading requirements with a weight of only 8 grams and a volume of 0.082 cubic inches. The 612-TX incorporates miniature shear-type accelerometer inserts bonded into a machined aluminum block. The electrical isolation provided by the epoxy bonding permits accurate, repeatable measurements even in noisy industrial environments. This unit is equipped with the exclusive Columbia... (read more)
Browse Accelerometers Datasheets for Columbia Research Labs, Inc.
Innovative Sensor Technology IST USA Division
World’s Smallest Capacitive Humidity Sensor
World ’s Smallest Capacitive Humidity Sensor from IST. Innovative Sensor Technology has added the World ’s smallest capacitive humidity sensor to its line of thin-film sensors. Measuring just 1.85 mm x 1.85 mm, the P14 202 is capable of measuring from 0 to 100% relative humidity in a temperature range of -50 °C to +150 °C. The assembly of the sensor is fully automated, and the contacts are designed for soldering and bonding. Linearity Error and Hysteresis Less Than ±... (read more)
Browse Hygrometers and Humidity Measurement Instruments Datasheets for Innovative Sensor Technology IST USA Division
Parts by Number for Bonding Measurement Top
|Part #||Distributor||Manufacturer||Product Category||Description|
|CPF-50C||Digi-Key||Micro-Measurements (Division of Vishay Precision Group)||Sensors, Transducers||TERM BOND 8-TERM 1.27MM 1=50PCS|
|CPF-100C||Digi-Key||Micro-Measurements (Division of Vishay Precision Group)||Sensors, Transducers||TERM BOND 8-TERM 2.54MM 1=20PCS|
|CPF-50D||Digi-Key||Micro-Measurements (Division of Vishay Precision Group)||Sensors, Transducers||TERM BOND 8-TERM 1.27MM 1=30PCS|
Conduct Research Top
PREPARATION OF MEDICAL DEVICE SURFACE FOR ADHESIVE BONDING
The presence of foreign contamination on surfaces to be coated or adhesively bonded may interfere with both the initial and long term integrity of the bond. Significant effort is required to clean the surfaces prior to coating or bonding. ANALYZE. (480) 814-8200 | Contact Information. ISO 9001:2008
A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly (.pdf)
difficulty controlling stress produced by the CTE-mismatch. We will demonstrate how the NanoBond(R) process can be used to control stresses during the bonding and deposition processes. Modeling will be conducted to compare standard bonding processes to the NanoBond process, accounting for CTE mismatches
CISPR 17 Measurements
paths. across the filter. The proper application of bonding, grounding, cable routing and filter. positioning techniques will optimize filter performance. Fig. 2 shows the differential mode with a negative insertion loss, that is an insertion. gain! This happens relatively often in practice
Case Study: Bonding Integrity in Copper Clad Aluminum Wire
Problem: Manufacturer of drawn copper clad video cable could not inspect for unbonded areas. The cladding will fail at final manufacturing step by blistering away from the aluminum substrate. Currently available inspection techniques are not capable of making the measurement. Solution: Resonic ARIS
Stability of Silicon Photodiodes for Laser Emission Measurements (.pdf)
and regulatory purposes. lead bonding to the junction, and imperfect die bonding of the silicon. These instruments must be capable of being accurately calibrated and. wafer to the metal header. If the photodiode is operated with an. maintaining their calibrations over long periods and a fairly wide
Gloss Standards and Measurement
: * Company: * Email Address: * Telephone: * Comments: What is 7 + 3? *. * indicates a required field. Antiglare vs. Antireflection. GenFlectiveTM Technology. Gloss Standards and Measurement. PDF Format. Moisture Control in LCDs, OLEDs and Plasma Displays. Optical Bonding of LCDs, OLEDs
Zeta Potential Measurement (Aqueous and Non-Aqueous, Iso-Electric Point Determinations)
, Plastics & Rubber. Process Integrators. Specialty Chemicals. Sample type/form. Aerosols & sprays. Asphalt & bitumen. Bonding & curing systems. Colloids. Composites and engineered materials. Conjugates. Contaminants & foreign particles. Crystals & polymorphs. DNA/RNA & oligonucleotides
Non-contact Temperature Measurement and Control (.pdf)
thicker than 2.5 mm can. be measured using 8-14 micron. instruments, but thin films of. plastic are partial y transparent. in this waveband. However the. characteristics of molecular. bonding eliminate the. transmitted energy completely. at certain wavelengths. Polyethylene, polypropylene,. nylon
Engineering Web Search: Bonding Measurement Top
Contact Resistance Measurement of Bonded Copper Interconnects...
This test structure requires a simple fabrication process and eliminates the possibility of measurement errors due to misalignment during bonding.
Measurement Method of Bond Strength for Silicon Direct Wafer...
Measurement Method of Bond Strength for Silicon Direct Wafer Bonding
Turner, Kevin T.
K.V. Christ, K.B. Williamson, K.S. Masters, and K.T. Turner, "Measurement of Single-Cell Adhesion Strength using a Microfluidic Assay," Biomedical
ASTM D7490 - 08 Standard Test Method for Measurement of the...
ASTM D7490 - 08 Standard Test Method for Measurement of the Surface Tension of Solid Coatings, Substrates and Pigments using Contact Angle
ASTM B700 - 08 Standard Specification for Electrodeposited...
Method for Measurement of Metal and Oxide Coating Thickness by Microscopical Examination of Cross Section B499 Test Method for Measurement of Coating
Friction - Wikipedia, the free encyclopedia
11.2 Measurement 11.3 Household usage 12 Instances where friction is advantageous
Electric current - Wikipedia, the free encyclopedia
6 Current measurement 7 Resistive heating
Trioptics - Optical Measurement, Autocollimators and visual...
The OptiCentric® family comprises tools for precise and fully automatic alignment, cementing, bonding, and assembly of lenses and optical systems.