Bonding Metrology

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• The Role of Wafer Bonding in 3D Integration and Packaging (.pdf)
  , in the fabrication of 3D-IC. Additionally, the materials and. process flows used for these processes wil be examined in detail. I. Introduction. specification requirements for each bonding. technology are based on standard metrology metrics. 3D Integration and Packaging are currently...
• MICRO:New Technologies-Analysis & Metrology, by Patrick J. McCann, p.93 (July '99)
  bonding an epitaxial laser structure to an assembly of plates, removing the growth substrate by dissolving a water-soluble BaF2 buffer layer that was grown between the laser structure and the substrate, and then cleaving the epitaxial laser structure by releasing the plates. This procedure yields...
• MICRO: New Materials Integration
  discusses the Smart Cut method used by Soitec (Bernin, France) for high-volume manufacturing of Unibond SOI wafers. Volume production of these SOI wafers demonstrates that high yields can be achieved by controlling splitting and bonding steps at production levels. Taking advantage of the flexibility...
• MICRO: Defect/Yield
  of the outer-shell electrons of the measured material, and XPS is sensitive enough to differentiate among the material's bonding states. In this case, the lower- binding-energy peak corresponds to photoelectrons emitted from the the silicon substrate (Si-Si) bond, while the higher- binding-energy...
• MICRO: Prod Tech news
  a proprietary bonding system. Coriolis Mass-Flow Controller. Emerson Process Management. Hatfield, PA. A low-flow Coriolis meter and controller enables users to measure and control liquids and gases precisely at low and high flow rates. The Brooks Instrument Quantim Coriolis mass-flow controller (MFC...
• MICRO:Movin On (Nov/Dec '98)
  and the materials, processes, process controls, and equipment used in manufacturing them. Gehman joined ASTM in 1973 and has served as chairman of committees on wire bonding and sputtered thin films. He is vp of R&D at Leybold Materials. Alfred Honold, director of advanced technologies at Jenoptik...
• MICRO: 'Round the Circuit
  contamination from minienvironments, a specification for job deck data format for variable-shaped beam photomask writers, a guide to specifying wafer-wafer bonding alignment targets, a spec for SECS II protocols for substrate mapping, and a provisional spec for XML messaging for process control systems...
• MICRO:Movin' On (Oct. '98, p.162)
  in manufacturing them. Gehman joined ASTM in 1973 and has served as chairman of committees on wire bonding and sputtered thin films. He is vp of R&D at Leybold Materials. Alfred Honold, director of advanced technologies at Jenoptik Infab and chairman of the SEMI standards program in Europe, has...
• Keeping a tight focus on optics
  the decision about whether to design for custom-made or off-the-shelf optics, as depicted here. The best time to make such decisions is early in the design cycle. Recently a semiconductor capital-equipment maker was designing a new wire-bonding machine that included a vision system. Engineers...
• MICRO: Product Technology News
  implantation and wafer-bonding techniques. Thin-film wafers are produced in varying degrees of silicon-layer depletion to create uniform oxide layers that are very thin (down to 70 A), as required for advanced ICs and microprocessors. Available with top-layer thicknesses ranging from 50 150 nm...

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