Carrier Type Metrology

Conduct Research

• MICRO: Defect/Yield Analysis & Metrology
  with the objective of determining which conditions yield the optimum (longest) length. The parameters that were varied included down force, carrier speed, table speed, slurry type, and pad type. Table I lists a few examples of the test results to illustrate the range of planarization lengths...
• MICRO: Critical Material-Wafers
  by vapor-phase decomposition, inductively coupled plasma mass spectrometry (VPD ICP-MS); minority carrier lifetime, measured by microwave photoconductive decay (u-PCD); microroughness, measured by scanning force microscopy (SFM); and particles added, measured as light-point defects (LPDs) using a Surfscan...
• MICRO: Industry News: Lead Story (September 2000)
  such as Bell Labs will have a profound effect on measurement methods. "All metrology changes if you go to vertical transistors," he says. Diebold explains that critical dimension (CD) methods for these new structures require measurement of film thickness "instead of a traditional CD-type measurement...
• MICRO:February 1998:Product Technology News
  The open design of the 300-mm Process Enhancement Carrier maximizes chemical flow and reduces wafer masking to enhance wet bench process results. Because it has approximately one-half the volume and one-fourth the surface area of traditional carriers, the PEC reduces the potential for chemical...
• MICRO:Product Technology News (April '99)
  red, blue, or green to differentiate wafer lots. End walls may also be a different color from the carrier's frame in order to extend color coding options. Additional identifying markers such as RF tags or adhesive bar code labels are also available. Designed for sub-0.15-um metrology, the VeraSEM...
• MICRO: Product Technology News
  in various materials, including Type 316L stainless steel, Vim-Var, and C-22. These fittings have a clean, smooth surface finish and include various types of glands, elbows, tees, crosses, bulkhead unions, nuts, and gaskets. The standard finish is 10 Ra or less, and a surface finish of less than 5 Ra...
• Investigation of the Influence of Transducer Electronic Data Sheets (TEDS) on Calibration Results
  The international standard IEEE 1451.4 [1] is the basis for transducer electronic data sheets (TEDS), where information related to the transducer like serial number or nominal sensitivity is stored into a chip inside the transducer. For bridge type sensors, with a novel circuit (patent pending [2...
• MICRO: Product Technology News (June '2000)
  field-replaceable subassemblies for easy maintenance, while the reduced number of parts makes possible an MCBF of >10 million cycles. Compatible with better than Class 1 environments, it can move either 200- or 300-mm wafers from any position in a wafer carrier into the process station or loadlock...
• MICRO: Product Technology News (September 2000)
  , shallow-trench isolation, and copper applications. The system's front-referenced carrier technology features an edge-tuning design to ensure within-wafer uniformity. A multiprobe, broadband optical end point assures complete copper removal over 100% of the wafer surface. A family of dry pumps is suitable...
• MICRO:Improving the results of post-CMP
  and a passive carrier ring on a 200-mm wafer is typified by a relatively flat region in the center of the wafer, a local maximum between the 60- and 80-mm radii, a sharp drop in rate beyond ~90 mm, and a severe increase in rate within a few millimeters of the wafer edge.1 3,7 This type of polish behavior...

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