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  • Airlines Grapple with A380 Delays
    arriving as much as two years late. There are not enough widebody aircraft of the type a carrier would need in the leasing world that will be available during that time period, notes an official for one leasing company. Instead, carriers will have to look for other methods, he says, such as deferring...
  • APU Arithmetic
    Airlines today see how reduced auxiliary power unit (APU) use reflects positively on fuel costs. A Delta Air Lines APU reduction initiative, discussed in last month's "Fueling Force" feature (O&M, Nov. 2008, p.35), for example, aims to save the carrier $30 million this year through working...
  • Containment Technologies Group
    that are available to pharmacists. To provide a quality, cost-effective i.v. area, it is essential to understand the basic components of a cleanroom and a carrier isolator system. The technology for each has several elements that directly affect the cost, efficiency, and dependability of the system...
  • MICRO:February 1998:Product Technology News
    thickness, and p-n type. Sheet resistivity is displayed in ohm per square from 1.1 M /sq to 450 k /sq. The reading is retained for data logging until the next test is begun. Probe tips remain below the meter's stage until the cover is lowered in order to reduce the possibility of wafer damage...
  • A New Breed of VXIbus Microwave Signal Generator Architecture (.pdf)
    referred. use of DSP and Digital Modulation (DM). Phase-Locked Loop (PLL) frequency syn-. to as Arbitrary Waveform Generators. concepts. This new class/type of Unit. thesizers, Direct Analog (DA) frequency. (AWG). As the name implies, the output. Under Test (UUT) cannot be adequately. synthesizers...
  • MICRO: EUV litho
    , OR, and established an EUV photomask pilot line at its Santa Clara, CA, mask house. EXTREMELY UPBEAT: Program manager Melissa Shell (shown here with EUV tool) says she's encouraged by early test-wafer results. "We are making progress toward implementing EUV lithography technology in manufacturing...
  • MICRO: Product Technology News (June '2000)
    field-replaceable subassemblies for easy maintenance, while the reduced number of parts makes possible an MCBF of >10 million cycles. Compatible with better than Class 1 environments, it can move either 200- or 300-mm wafers from any position in a wafer carrier into the process station or loadlock...
  • MICRO: Product Technology News (September 2000)
    , shallow-trench isolation, and copper applications. The system's front-referenced carrier technology features an edge-tuning design to ensure within-wafer uniformity. A multiprobe, broadband optical end point assures complete copper removal over 100% of the wafer surface. A family of dry pumps is suitable...
  • MICRO: Special Apps
    and the limited availability of GaN substrates. While diamond has the highest mobilities, large-area single-crystal diamond substrates are not available, and diamond has no n-type dopant. SiC, however, has the large band gap and high thermal conductivity necessary for elevated-temperature operation...
  • MICRO:Product Technology News (July '99)
    factory integration tester is an automated script-driven test tool for the SEMI E84 carrier-handoff enhanced parallel link. The tool is used in 300-mm fabs for front-opening unified pod handoff between automated material-handling systems and process or metrology equipment. The test unit includes...

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