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  • Description: which bonds are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents over the exceptionally wide temperature range of -60°F to more than 350°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, cement, wood

    • Use: Die Bonding Adhesive / Compound
    • Form: Grease / Paste
    • Chemical / Polymer System Type: Epoxy (EP)
    • Cure Type / Technology: Specialty / Other

  • Description: These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc.

    • Form: Liquid
    • Chemical / Polymer System Type: Epoxy (EP)
    • Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
    • Industry: Electronics, Electrical Power / HV

  • Description: High adhesive strength, textiles, threadlocking

    • Use: Die Bonding Adhesive / Compound, Gap Filling Compound
    • Form: Liquid
    • Cure Type / Technology: Thermosetting / Crosslinking
    • Industry: Electronics

  • Description: General Magnaplate's surface-enhancement coatings have been engineered to provide metal parts and other substrates with corrosion and chemical resistance, super-hardness and dry lubrication. These coatings impart properties that ensure longer life spans and greater reliability, consequently reducing

    • Plating Processes: Chrome Plating - Hard, Nickel Plating - Hard, Silver Plating, Titanium Plating
    • Electroless: Yes
    • Material / Substrate: Aluminum, Carbide, Ceramic, Composites, Copper / Copper Alloys, Iron / Cast Iron, Metal, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium, Specialty / Other
    • Additional Services: Electropolishing, Hydrogen Relief Baking, New / OEM Parts, Material Selection / Design Assistance, Passivation, Pickling / Chemical Deburring, Replating / Used Parts, Research & Development, Specialty / Other

  • Description: from brightfield, darkfield, DIC, 365nm UV and 248nm DUV with automated controls 150x/0.90 UV (365nm) objective with 130nm resolution Cement-free 150x/0.90 DUV (248nm) objective with 80nm resolution Long Working Distance L50x DUV cement-free objective for thorough pellicle inspection of masks

    • Application: Semiconductor Inspection
    • Grade: Benchtop
    • Microscope Type: Fluorescent / UV
    • Total Magnification: 1.6 to 150 X

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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
24KOHM9W5214.CEMENT ASAP Semiconductor VTM Not Provided Not Provided
27OHM 5W 10% CEMENT ASAP Semiconductor DRALORIC Not Provided Not Provided
220OHM 10W 5% CEMENT ASAP Semiconductor FIRST Not Provided Not Provided
43OHM 10W 5% CEMENT ASAP Semiconductor TAIWAN Not Provided Not Provided
200OHM 5W 10% CEMENT ASAP Semiconductor STETTNERG Not Provided Not Provided
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