Sites:
Search Electronics:
 
Page: 1

Parts by Number for Ceramic Chip Antenna Top

Part # Distributor Manufacturer Product Category Description
CERAMIC CHIP ANTENNA ASAP Semiconductor KYOCERA Not Provided new and in original
CERAMIC CHIP ANTENNA ASAP Semiconductor KYOCERA Not Provided Not Provided
CERAMIC CHIP ANTENNA ASAP Semiconductor KYOCERA Not Provided AVAILABLE
5775AT43A100E Newark / element14 JOHANSON TECHNOLOGY Not Provided JOHANSON TECHNOLOGY - 5775AT43A100E - CERAMIC CHIP ANTENNA; 5.77GHZ 50 OHM; FULL REEL
5250AT43A200E Newark / element14 JOHANSON TECHNOLOGY Not Provided JOHANSON TECHNOLOGY - 5250AT43A200E - CERAMIC CHIP ANTENNA; 5.25GHZ 50 OHM; FULL REEL
5400AT18A1000E Newark / element14 JOHANSON TECHNOLOGY Not Provided JOHANSON TECHNOLOGY - 5400AT18A1000E - CERAMIC CHIP ANTENNA; 5.4GHZ; 50 OHM; FULL REEL
More >>

Conduct Research Top

  • Medical Device Link .
    employ leadless packages that are considerably smaller than conventional ICs of the same type.) Traditional plastic or ceramic packaging used for off-the-shelf ICs wastes space, and the finished PCB will most likely be encapsulated anyway. Depending on the miniaturization method, the IC chip might
  • Medical Device Link . Avoiding Common EMI Problems in Medical Electronics
    characteristic of ceramic versions. Surface-mount and feed-through components have better high-frequency performance than through-hole capacitors. Leads and printed circuit board (PCB) traces should be as short as possible, and lead inductance can be minimized by using fat traces, if necessary. When
  • rfRXD0420 Receiver Module
    MODULE. C13. 1000 pF. RC1. muRata P/N. SFECV10M7GA00. C9. 33000 pF. Ω. R6. 1 k. 230 kHz. Bandwidth. C12. Ceramic IF Filter F2. 1000 pF. Ω. Freq. C4. 390. 10.7 MHz. C16. 330 pF. 330 pF. R2. F2. +V. C8. 330 pF. 10.7 MHz. +V. NC. NC. Ω. Ω. 16. 15. 14. 13. 12. 11. 10. 9. C5. 330 pF. 470. 470. SS. DD. C2
  • MEMS Motion Sensors, the Solution for Harsh Environments in Defence Applications
    the MEMS device and. make a high performance accelerometer. electronics in a hermetically sealed. are a highly stable MEMS sensor. ceramic package, qualified against. element, a good assembly and. MIL standards and insuring long term. packaging technology and high-. stability and reliability. The MEMS die
  • Digital Compass Reference Design with the SiRFstar2t GPS Chipset
    flow with both push and. processor. Spare GSP2t ADC pins (ADC2 and ADC3). pull methods. Pull data for telematics are. interface with the HMC6042 X and Y axis output pins. driver/passenger inquires for information up ahead that. Besides the IC packages, two low-ESR ceramic. the person has interest

More Information on: Ceramic Chip Antenna Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire