Ceramic Laser Cutting Equipment

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• MICRO:Product Technology News (May '99)
  A laser cutting tool for flat-panel display glass makes high-quality cuts without creating particles. While glass has traditionally been cut using a mechanical scribe-and-break process that causes fragmentation, edge chips, and microcracks that may generate particles, the laser technique uses...
• Stronger and Lighter -- Composites Make Their Mark
  is not new. Bricks made from straw-reinforced mud are mentioned in the Old Testament. This material also has been widely used in the American Southwest for centuries, where it is known as adobe. In current terminology, these types of composites are called organic fiber-reinforced ceramic...
• MICRO:Top 40 (Nov '99)
  diameters of 1/8 to 1 in. With two-axis cutting capability, the tool enables weld sampling or coupon cutting of high-purity stainless tubing. The saw does not deform tube ends. Features include a clamping vise,. MICRO:Top 40 (Nov '99...
• MICRO:Top 40 (Nov '99)
  diameters of 1/8 to 1 in. With two-axis cutting capability, the tool enables weld sampling or coupon cutting of high-purity stainless tubing. The saw does not deform tube ends. Features include a clamping vise, a. MICRO:Top 40 (Nov '99). MICRO Advertiser and Product Information Buyers Guide. Chip Shots...
• LVP's Speed Capacity Pays for Machine
  . Where the LZ cuts 3/8" at 45-48 inches/minute, the LVP is cutting 3/8" at 80 inches/minute.". He adds, "Laser technology is evolving so fast that we have to continuously rotate in new equipment. Since I'm cutting three times faster than my competition, I'm can give customers better rates and better...
• MICRO:Product News
  configurations. (Semicon West, S.F., Esplanade, Booth 4129) A nanoindentation unit is suitable for materials characterization testing of full-size wafers up to 300 mm without cutting the wafer into smaller pieces. Full-size wafer testing saves time and keeps the wafer intact for other uses. The Nano...
• Meeting the challenge of submicron defect characterization on final-polished wafers
  processes, such as crystal growth, cutting, lapping, and etching, or result from stock and final polishing. COPs can be classified into three categories: point defects such as vacancies, interstitials, and impurity substitutes; line defects such as dislocations; and three-dimensional defects...
• MICRO:Archive:Back Issue TOC
  to enhance fab productivity Cleanroom Technologies: Using contamination and ESD tests to qualify and certify cleanroom gloves PRODUCT TECHNOLOGY NEWS Products: Laser cutting tool, wafer inspection station, membrane filtration, pneumatic valves, vacuum oven, solenoid valves, dummy wafers, fogger, ceramic...
• MICRO:Top 40 - Page 2 (Nov '99)
  , process connections, and mounting type can be customized. Power consumption is 11 W, and the valve operates at 100 psi in a maximum temperature of 104 F. Laser Cutting Tool Schott Yonkers, NY A laser cutting tool for flat-panel display glass makes high-quality cuts without creating particles. While...
• Broader appeal in narrow webs
  . The cellular engravings on the surface of the roll are analogous to a honeycomb. They are typically created by a laser. The roll material is generally ceramic. The special texture on the anilox roll provides a high degree of control when dispensing ink. This sort of control is necessary for handling...

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