Products & Services
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Supplier: Advanced MicroSensors, Inc.
Description: No Description Provided
- Materials: Silicon, Ceramic, Compound Semiconductor, Glass, Quartz, SOI, Specialty / Other
- Services: Design / Engineering, Prototyping, Pilot / Scale-Up, Production, R & D / Development, Specialty / Other
- Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, Metallization - Electroplating, Metallization - PVD Thin Film, Photolithography, Wet / Chemical Etching, Other
- Location: North America, United States Only, Northeast US Only
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Supplier: Universal Semiconductor, Inc.
Description: No Description Provided
- Materials: Silicon, Ceramic, Compound Semiconductor, Glass, Metal / Nickel, Quartz, Polymer / Organic, SOI
- Services: Design / Engineering, Prototyping, Pilot / Scale-Up, Production, R & D / Development, Specialty / Other
- Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, LIGA, Metallization - Electroplating, Metallization - PVD Thin Film, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Wafer Bonding, Wet /
- Location: North America, United States Only, Southwest US Only
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Supplier: Merit Sensor Systems
Description: Design and Manufacturing Services One size does not fit all. Whether it is design assistance, custom products or smaller volumes, clients need flexible solutions instead of rigid excuses. In addition to our standard products, we offer an array of design and manufacturing services. As the
- Materials: Silicon, Ceramic, Glass, Metal / Nickel, Polymer / Organic, Specialty / Other
- Services: Design / Engineering, Prototyping, Pilot / Scale-Up, Production, R & D / Development, Specialty / Other
- Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Inspection / Testing, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Wafer Bonding, Wet / Chemical Etching, Other
- Location: North America, United States Only, Southwest US Only
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Supplier: Rogue Valley Microdevices, Inc.
Description: Founded in 2003, Rogue Valley Microdevices is the first company to establish a microelectronics manufacturing facility in beautiful Southern Oregon. Headquartered in Medford Oregon, we have quickly established ourselves as one of the premier MEMS Foundries in the United States. Our manufacturing
- Materials: Silicon, Ceramic, Compound Semiconductor, Glass, Quartz, SOI, Specialty / Other
- Services: Design / Engineering, Prototyping, Pilot / Scale-Up, Production, R & D / Development, Specialty / Other
- Capabilities: Dielectric / CVD Thin Film, Metallization - PVD Thin Film, Oxidation / Doping
- Location: North America, United States Only, Northwest US Only
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Supplier: American Microsemiconductor, Inc.
Description: Mem Addr; Clock; Bus Driver; Ceramic pkg
- Gate Type: Inverter
- Supply Voltage: 5 V
- Output Type: Other
- Logic Family: Standard CMOS / CMOS 4000
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Supplier: Lapmaster International
Description: Designated the LLCD series, a typical machine consists of a heavy duty, structural steel base housing a drive system linked to a lapping plate. A polishing pad (type dependent on material to be processed) is bonded directly to the plate.
- Applications & Materials Processed: Semiconductor Manufacturing, Flat Panel Display, Optical Coatings, Magnetic Storage, MEMS, Other
- Coating System Type: Batch System (Single Chamber / Multiple Wafers), Continuous / Web System, Inline System (Semi-continuous)
- Technology / Process: Other
- Materials Processed (Deposit or Substrate): Metal, Dielectric / Ceramic, Silicon, Oxides, Other
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Supplier: All Sensors Corp.
Description: The BASIC Serices of pressure sensors use a silicon micromachined (MEMS) pressure sensor in the most basic configuration. The package is a ceramic surface mount configuration to provide the smallest footprint possible. Best temperature compensation is realized when the sensor has a constant current
- Device Category: Sensor
- Pressure Reading: Gauge
- Sensor Technology: Other
- Media: Gas, Other
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Supplier: Siargo Ltd.
Description: The FPX4008 proximity switch with mass flow sensing is manufactured using Siargo's proprietary MEMS sensor process that ensures reliability, performance and low cost. The sensors are specially designed for fast response to the air/oil lubricator applications. The surface of the sensor is passivated
- Mounting Type: In-line
- End Fittings: Threaded
- Process Media Type: Gas
- Electrical Output: Analog Voltage
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Featured Products for Ceramic MEMS Top
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Colibrys
Single Axis Class B Seismic Accelerometer
The SiFlex SF2006SN.A products combines a MEMS capacitve accelerometer, based ona a bulk micro-machined silicon element in a ceramic package attached through an interconnect board to a custom mixed-signal ASIC to enable analog closed-loop force-feedback operation of the accelerometer. The multi-chip assembly is mounted to a printed circuit board consisting of power conditioning electronics employing linear regulators, output amplifiers and other support electronics. (read more)
Browse Accelerometers Datasheets for Colibrys -
Colibrys
New Tilt Sensor for Industrial and Aerospace
coefficient or high reliability under harsh environments on top of low power and low noise, generally required for precise measurements.". It is available worldwide through the Colibrys distribution network in a standard small LCC 20 ceramic package configuration of 8.9mm x 8.9mm. Click Here to Learn More... (read more)
Browse Tilt Sensors Datasheets for Colibrys
Conduct Research Top
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MEMS Motion Sensors, the Solution for Harsh Environments in Defence Applications
the MEMS device and. make a high performance accelerometer. electronics in a hermetically sealed. are a highly stable MEMS sensor. ceramic package, qualified against. element, a good assembly and. MIL standards and insuring long term. packaging technology and high-. stability and reliability. The MEMS
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High performances MEMS accelerometers are used in railway applications
of few hundreds microns,. ceramic package, qualified against. MEMS accelerometers penetrate. attached by a silicon spring to a frame. MIL standards and insuring long term. more and more railway applications. and separated from the detection plates. stability and reliability. The MEMS die. The driving
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Gun Hard Inertial Measurement Unit Based on MEMS Capacitive Accelerometer and Rate Sensor (.pdf)
is normally severed from its underlying ceramic. early 80's [1]. Building on this knowledge, Colibrys has position. Using hard glue increases the stress field and hence. constantly improved this accelerometer over the years and it increases the initial bias stability of the device. Knowing this,. now
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Sensing the motion
;. · Health and Usage Monitoring System (HUMS);. · Shock monitoring during transportation;. · Precise train positioning;. · Railway track monitoring system for safety and maintenance. loop electronics, and high-grade. extensively in inertial measurement. assembly in hermetic ceramic. units (IMU
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Designing Products that require Angle Meaurement: Have you considered Electrolytic Tilt Sensors
tilt sensor. Furthering their simplicity and ease of use, tilt sensors come in a variety of packaging options, such as The Fredericks Company’s patented metal can electrolytic sensors. Some new ceramic sensors are designed with mounting holes to facilitate attachment into a rugged mechanical
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Vibrating Gyroscopes
direction. By sensing the secondary vibration, the gyro can detect the rate of turn. Some vibrating gyroscopes are called piezo, ceramic or quartz gyros because they use the piezo-electric effect to exert and detect vibration. Note, however, that vibration and detection do not necessarily use the piezo
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The Small Fuel Cell Conference | by Dennis Sieminski | September 2003 FCT | 7MS.com
M E E T I N G R E P O R T The Small Fuel Cell Conference Companies Developing Small Fuel Cells (cont.) The micro fuel processor converts liquid methanol (MeOH) to hydrogen and will feed an elevated temperature PEM FC. Multi-layer ceramic technology is used for fabrication. They don t use Si MEMs
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Coarse and fine combined
New actuators can traverse both long distances and subnanometer increments with equal ease. Among the applications for ceramic servomotors are hard-disk certification tools (top). Here a ceramic servo moves a singleaxis stage controlling a read/write head. The motors are also widely applied
Engineering Web Search: Ceramic MEMS Top
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CBGA (Ceramic) FCBGA PBGA (Plastic) SBGA (w/Heatsink) CerDIP (Ceramic) CerDIP - Side or Bottom Brazed
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IMAPS - International Microelectronics Assembly and Packaging...
& Silicon Interposers PDC3: High Temp Electronics PDC4: Hermetic Sealing MEMS PDC5: Fail Analysis Flip Chip PDC6: Glass Tech for Semicond PDC7:
- Capacitor - Wikipedia, the free encyclopedia
- Materials science - Wikipedia, the free encyclopedia
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Ultrasonic Machining | Ceramic Substrates | Bullen Ultrasonics
Ceramic Machining Products Polished Glass Substrates MEMS Glass Wafers Microfluidic Glass Semiconductor Ceramics
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Ceramic Package Solutions for MEMS Sensors
Electronic Manufacturing Technology Symposium Item Title: Ceramic Package Solutions for MEMS Sensors Publisher Name: IEEE Meeting Location: San Jose,
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Profiled Ceramic Micropackages for MEMS Application
on Signals, Systems and Electronics Item Title: Profiled Ceramic Micropackages for MEMS Application Publisher Name: IEEE Meeting Location: Montreal,
- L3G4200D STMicroelectronics | Mouser