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  • AN0010 Lead-free Soldering and Bend Test Performance
    Due to its brittle nature, multilayer ceramic capacitors are more prone to excesses of mechanical stress than other components used in surface mounting. One of the most common causes of capacitor failures is directly attributable to the bending of the printed circuit board (PCB) after solder
  • AN0002 Bend Testing
    Due to its brittle nature, multilayer ceramic capacitors are more prone to excesses of mechanical stress than other components used in surface mounting. One of the most common causes of capacitor failures is directly attributable to the bending of the printed circuit board (PCB) after solder
  • Medical Device Link .
    cost-effective, he notes.Suitable for stand-alone applications, the pumps can also be integrated into custom systems, such as lab-on-a-chip products. Various electronic controls, including some that can be operated from a PC, are available for testing purposes. Piezoelectric ceramic components reportedly
  • Diode Chips, Beam-Lead Diodes, Capacitors: Bonding Methods and Packaging
    . mechanical damage to the active junction area when handling. chips. In addition, if tweezers are used, care must be taken to. Ceramic. avoid excessive force which might result in nicks or cracks. Substrate. Special handling precautions are also required to avoid electrical. damage by static
  • The Hall Effect Gauss / Tesla Meter
    or film of GaAs or InAs. A ceramic substrate is often used for mechanical support, thermal stability, and wiring nodes. Alternatively, the devices can be wire bonded to a nonmagnetic lead frame and encapsulated in a dielectric material. In this photo, the Hall generator is shown with a pencil point
  • to top of page 1. Place about 5 drops of blue food color in a disposable plastic cup, a small glass container or on a glass or ceramic plate. 2. Cut off one end of a toothpick. Dip the fresh cut end into the food coloring. 3. Use the toothpick to place a dot of blue food color on the pencil
  • AN0007 Stack Chip Components Handling and Usage
    of the. soldering iron to the ceramic capacitors. If hand soldering is necessary, a hot air pencil should. be carefully used, following the guidelines below. ‘S’ leaded components may be suitable for. assembly with a soldering iron, provided the iron is applied to the opposite side of the boards
  • Measuring Static Overpressures in Air Blast Environments
    exceptions: (1) the probe material was changed from. ceramic to quartz and (2) ICP® electronics [3] were integrated into the. probe enabling five volts full scale output for each of its various. pressure ranges (50 to 1,000 psi maximum). The current PCB probe. model number is 137. The resonant frequency

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