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Ceramic Thermal Treatment

 

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Heat treating services perform thermal treatments to modify the properties of metals and metal alloys. Common processes include annealing, austempering, case hardening, conventional hardening, homogenizing, hot isostatic pressing (HIP), martempering, normalizing, precipitation hardening, shot peening, solution treating, spheroidizing, stabilizing, and stress relieving.
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  • New Roles For Ceramic Parts
    new ceramic chemistries as well as improve forming and processing methods. Such efforts broaden the range of available materials and the types of applications they can handle. By adjusting factors such as porosity, grain size, and heat treatment, suppliers can tailor individual components to handle
  • Ceramic-Matrix Composites
    of applying thin coatings on fine whiskers. Studies at Oak Ridge National Laboratories have demonstrated that thermal treatments of whiskers prior to their incorporation into an alumina matrix can increase fracture toughness of the composite. In those materials, best toughness -- about 8.0 MPavm -- results
  • Advanced ceramics
    dependent on microscopic and macroscopic characteristics, such as crystal structure, orientation, and other properties. The nature and magnitude of porosity in a ceramic specimen, for instance, can affect thermal conductivity by a factor of two or three. The inherent brittleness of ceramics makes special
  • Process Creates Ceramics That Won't Shrink Or Change Shape
    ceramic composites -- another mixture of ceramic and metal. For these materials, some of the metal in the precursor is left unoxidized. For some applications, such residual metal can enhance the electrical conductivity, thermal conductivity, or toughness of the part. The idea of oxidizing precursors
  • FlexiCapTM - Reducing Mechanical Cracking on PCBs
    such. as atmospheric moisture. On individual boards, the electrical problem may be transient. As a result of thermal treatment,. often applied inadvertently, the board may function only to fail again, some time later. (Page 3). While the board manufacturer will isolate the problem to a single capacitor, more
  • Hard face for soft alloys
    . That is at least three times harder than hard anodizing. The dense nanoscale microstructure of the ceramic layer also makes treated aluminum parts candidates for applications where components are exposed to large-scale thermal shocks (of less than 2-sec duration) at temperatures to 2,000 C (3,632 F
  • How PTFE Can Compete With The Best In Thermosets
    - increasingly-competitive market. The RF Microwave Laminate industry has responded in recent years by for example using thermosetting plastics along with combined inorganic (ceramic) fillers. This paper describes a ceramic-filled PTFE laminate which was developed to meet the challenge
  • PTFE Microwave Substrates For Automotive Applications
    - increasingly-competitive market. The RF Microwave Laminate industry has responded in recent years by for example using thermosetting plastics along with combined inorganic (ceramic) fillers. This paper describes a ceramic-filled PTFE laminate which was developed to meet the challenge

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