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Chemical Mechanical Planarization Compound
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Product Announcements
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Saint-Gobain Surface Conditioning Group 
Competition Chemicals, Inc. 
Competition Chemicals, Inc. 
Competition Chemicals, Inc.
Competition Chemicals, Inc.
Competition Chemicals, Inc. |
Products/Services for Chemical Mechanical Planarization Compound
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Abrasive Compounds and Abrasive Slurries - (291 companies)Abrasive Compounds and Abrasive Slurries Information Abrasive compounds and abrasive slurries are used to improve surface finish or flatness. They consist of fine abrasives in slurry, bar, powder or paste form. There are many different types... Search by Specification | Learn More -
Laps and Lapping Tools - (64 companies)Laps and lapping tools are used for precision surface finishing, often in conjunction with loose abrasive compounds. Lap is a soft material that is charged with an abrasive and is used for cutting harder material. A lapping machine uses a charged... Learn More -
Buffs and Buffing Wheels - (108 companies)Buffs and buffing wheels are used to hold finishing compounds and polish parts made of metal, plastic, ceramic, glass, wood, stone, silicon, or optical materials. They are made of cotton, wool, animal hides, sisal, synthetic fiber, or specialty... Search by Specification | Learn More -
MEMS Processing Equipment - (44 companies)...laboratory settings, wafer fabrication facilities, and MEMS research and development facilities. MEMS processing equipment includes silicon etching tools, wafer grinders, lapping and polishing machinery, and planarization equipment. MEMS production... Search by Specification | Learn More -
Inorganic Chemicals and Compounds - (728 companies)...to the study of inorganic chemicals, has developed inorganic chemical compounds such as inorganic fertilizer compounds, inorganic phosphates, and inorganic pigments. An inorganic fertilizer compound is designed for agricultural applications... Search by Specification | Learn More -
Organic Chemicals - (1453 companies)Organic chemicals are chemical compounds that contain carbon in their molecular structure. How to Select Organic Chemicals. Organic chemicals are chemical compounds that contain carbon as part of their molecular structure. Other elements... Search by Specification | Learn More
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Nanomaterials - (266 companies)...mechanical planarization or polishing applications. The fine particle size and modified properties due to nanoscale sizing may enhance chemical surface activity and improve surfacing characteristics. As microelectronic structures reach into nanoscale ranges... Search by Specification | Learn More
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Mechanical Clutches - (165 companies)...such as hoists and cranes. Small mechanical clutches are actuated directly with cams or levers, while larger clutches are operated through compound linkages. Usually, mechanical actuation is feasible only when the lever or pedal can be located near... Search by Specification | Learn More
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Mechanical Brakes - (157 companies)Mechanical brakes are assemblies consisting of mechanical elements for the slowing or stopping of shafts in equipment drives. Mechanical power is required to activate the brake. Mechanical brakes are assemblies consisting of mechanical elements... Search by Specification | Learn More
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Mechanical Feedthroughs - (35 companies)Mechanical feedthroughs transmit mechanical motion through the walls of a vacuum system. Both linear and rotary feedthroughs are included in this grouping. Mechanical feedthroughs transmit mechanical motion through the walls of a vacuum system. Both... Search by Specification | Learn More
Product News for Chemical Mechanical Planarization Compound
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Custom Processing Services
Diamonds Shine in Chemical Mechanical SlurriesCustom Processing Services has equipment available for toll manufacturing of dispersions and slurries, including an HVS-TS disperser (Hydraulic Variable Speed Twin Shaft) unit. It is ideally suited for mixing medium to high viscosity products, utilizing high shear and vacuum feeding. Additionally, a PMD-VC disperser (Pre-mix variable capacity) automated disperser is avaialble for low to high viscosity dispersions using high shear and low speed agitation processing methods. Our experienced... (read more) -
Epoxies Etc...
Strong-bonding and Chemical Resistant CompoundsEpoxies, Etc has developed new chemical resistant epoxies. 20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. 20-3004 LV is a low viscosity self leveling system. 20-3004 HV is a high viscosity non-sag version. FEATURES: Excellent chemical resistance. Excellent water resistance. Excellent adhesion... (read more) -
Metal Cutting Corporation
Mechanical PolishingWhile many companies have been able to develop chemical and electro-chemical polishing techniques, many of the processes are problematic. Few facilities have been able to draw on Metal Cutting Corporation's 40+ year history of using abrasive methods in manufacturing to develop mechanical polishing techniques. Our abrasive techniques have long included abrasive cutting, grinding, and lapping. Thus, mechanical polishing to achieve specialized finishes on a variety of metal shapes and surfaces... (read more) -
Saint-Gobain Surface Conditioning Group
Fine Polishing Slurries for Electronic CMPChemical Mechanical Planarization (CMP) has become one of the vital processes in the production of semiconductor devices which use slurries and pads to polish/planarize the surface of wafers to near defect free surfaces. Saint-Gobain's Polycrystalline Alumina Polishing Slurries are extremely fine particle/slurries intended for semiconductor and electronic materials CMP processes. Products are designated Gen 2, Gen 3, Gen 4, and Gen 5 Polycrystalline Alumina. (read more) -
Savino Barbera SNC
Horizontal Pumps With Mechanical SealsSingle Seal. The horizontal OMA model pumps mount a special mechanical seal capable of guaranteeing a high standard of safety to protect against loss of pumped liquid. These are not the usual mechanical seals available on the market but a seal designed exclusively by Savino Barbera: individual, balanced and with cartridge installation for the greatest possible cooling of sliding parts. Years of excellent results have demonstrated their reliability and their easy maintenance and replacement... (read more)
Conduct Research
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INDUSTRY NEWS
., Pittsburgh, PA 15237; 412/367-3012; fax, 412/367-4373. IPEC, MEMC eye CMP deal MEMC Electronic Materials will use chemical-mechanical planarization tools from IPEC in a proposed joint program to develop ultraflat silicon wafers for advanced chip processes. In the program's initial phase MEMC...
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INDUSTRY NEWS
Lam Research has entered the fastest growing segment of the global chip equipment market by signing a definitive agreement to purchase OnTrak Systems, the world's leading supplier of chemical-mechanical planarization cleaning systems, for $225 million. Announced on March 24 and already approved...
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MICRO: Products
. A monitoring device for chemical-mechanical planarization applications provides rapid insight into the pressures applied during the polishing process and supplies data directly to personal computers. The easy-to-use I-Scan system measures the tactile force and pressure applied by a polishing head...
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MICRO: Wet Surface Technologies
Todd Buley, Yakov Epshteyn, and Mike Kulus, Rohm and Haas Electronic Materials CMP Technologies ; and Cuong Tran, Kyle Bartosh, Darryl Peters, and Chris Watts, The effectiveness of the copper chemical-mechanical planarization (CMP) process can be improved by establishing an efficient and complete...
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MICRO: Technical Viewpoint
Karey Holland, Ann Hurst, and Harvey Pinder Technologists and scientists working on chemical-mechanical planarization (CMP) have improved the technology's cost of ownership (COO) since it was first introduced into semiconductor chip manufacturing in the late 1980s. In conjunction with enhancements...
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Using surfactants in iron-based CMP slurries to minimize residual particles
During recent years, the use of chemical-mechanical planarization (CMP) to remove excess coating material from wafer surfaces has increased dramatically, as has the literature on CMP research. Basically, the CMP process involves polishing wafers using a slurry that combines a chemical component...
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MICRO:Industry News:Lead Story (Oct '99)
on not inducing mechanical stresses on the low-k itself," says Michael West, SEZ's business and strategic technology director. "Allied was given the task of coming up with a turnkey application where its low-k porous material could be subsequently planarized or etched back and not damage that spongelike...
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MICRO:Top 40 (Nov '00)
. The 25-capacity, reduced-pitch box complies with I300I requirements, featuring a design that limits the amount of system material that comes in contact with each wafer. Wafer manufacturers can use the FOSB as many as four times before returning it to the company for recycling. A chemical-mechanical...
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MICRO:Top 40 (Nov '00)
, featuring a design that limits the amount of system material that comes in contact with each wafer. Wafer manufacturers can use the FOSB as many as four times before returning it to the company for recycling. CMP System. SpeedFam-IPEC. Chandler, AZ. A chemical-mechanical planarization (CMP) system...
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MICRO:Building Copperopolis (Jan '99)
chemical-mechanical planarization (CMP) of dual-damascene copper structures therefore will require highly efficient removal of both the copper and barrier layers. But achieving this goal is a challenge because the barrier materials are typically more difficult than copper to planarize using standard polishing...
Engineering Web Search: Chemical Mechanical Planarization Compound
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Semiconductor device fabrication - Wikipedia, the free... Chemical-mechanical planarization (CMP) is also a removal process used between levels. |
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Surface finishing - Wikipedia, the free encyclopedia Chemical-mechanical planarization (CMP) |
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» Publications Luo, J. F., and Dornfeld, D., ?Optimization of Chemical-Mechanical Planarization (CMP) from the Viewpoint of Consumable Effects,? 2001 Proceedings of See Laboratory for Manufacturing and Sustainability Information |
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Optimizing polysilicon thin-film transistor performance with... Optimizing polysilicon thin-film transistor performance with chemical-mechanical polishing and hydrogenation |
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Self-aligned nanostructures by CMOS technology Such techniques include a combination of advance lithography and etching, chemical mechanical planarization (CMP), or metal lift-off. |
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Simultaneous (e.g., chemical-mechanical polishing, etc.)... Simultaneous (e.g., chemical-mechanical polishing, etc.) 438691000 - Combined mechanical and chemical material removal |
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Substrate polishing method, semiconductor device and... |
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JEM Abstracts: October 1996 Proceedings of the symposium on Engineering Science of Chemical-Mechanical Planarization and Regular Issue Papers from the 1996 TMS Annual Meeting, See Minerals, Metals & Materials Society (The) Information |
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New products for semiconductor applications unveiled manufacturing industry, a new line of chemical mechanical planarization (CMP) gaskets and membranes together with a perfluoroelastomer compound. |
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Electronics & Communications | The Dow Chemical Company CUSâ?¢ 1300 slurries Barrier slurries for copper chemical mechanical planarization (CMP) See Dow Chemical Company (The) Information |
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