Chemical Mechanical Planarization Liquid

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• MICRO: Critical Materials?Chemicals
  not only for many solvent and acid hoods, but also for chemical-mechanical polishing equipment, bulk-chemical delivery systems, and other process equipment. When measured flow rate information is not available, the equipment user must rely on inferred flow rates. Often, inferred flow rates are calculated...
• MICRO: Ultrapure Fluid/Slurry Delivery- McMillan (January 2001)
  other such facilities, Fab 25 has numerous chemical- mechanical planarization (CMP) tools, each of which uses a system of peristaltic pumps for process fluid delivery. At various times during each CMP process, these pumps may be delivering tungsten or oxide slurries, DI water, or ammonium hydroxide...
• Concentration Sensors Curb Rising CoO (.pdf)
  Developments in IC manufacturing are increasing the demand of in situ concentration measurement in liquid chemicals are consumed in significantly greater quantities for chemical mechanical planarization (CMP), photolithography, electrochemical deposition (ECD) and surface preparation....
• MICRO:Ultrapure Materials Fluids (Jan '99)
  developments in process technology such as chemical-mechanical planarization (CMP) also have increased the demand for UPW in the fab. It is common industry practice to install a water reclamation system that processes wastewater for use in a facility's evaporative cooling towers. This practice...
• Treating wastewater from CMP using ultrafiltration
  and Vivien Krygier, Joseph O'Sullivan, and Eric L. Sandstrom, from the clean technologies that characterize semiconductor manufacturing, chemical-mechanical planarization (CMP) is fast becoming the established technique for polishing multilevel devices. As wafer fabs add an increasing number...
• MICRO:Top 40 Product Allstars (Nov/Dec '98)
  the throughput of the previous model, the NovaScan 420 integrated thickness monitor permits wafer metrology and mapping operations during chemical mechanical planarization. The system gives operators rapid feedback during the CMP process, offering the accuracy and resolution of stand-alone monitors...
• MICRO:Industry News:Lead Story (Oct '99)
  on not inducing mechanical stresses on the low-k itself," says Michael West, SEZ's business and strategic technology director. "Allied was given the task of coming up with a turnkey application where its low-k porous material could be subsequently planarized or etched back and not damage that spongelike...
• MICRO:Process Equipment-CMP Consumables, by Douglas W. Cooper, p.53 (July '99)
  Douglas W. Cooper and Rob C. Linke, Whether used to remove excess metal or oxide from IC chips or thin-film data-storage disks, chemical-mechanical polishing or planarization (CMP) has become an increasingly important and rapidly growing technology. Most CMP combines chemical activity with abrasion...
• MICRO:Top 40 (Nov '00)
  . The 25-capacity, reduced-pitch box complies with I300I requirements, featuring a design that limits the amount of system material that comes in contact with each wafer. Wafer manufacturers can use the FOSB as many as four times before returning it to the company for recycling. A chemical-mechanical...
• MICRO:Top 40 (Nov '00)
  , featuring a design that limits the amount of system material that comes in contact with each wafer. Wafer manufacturers can use the FOSB as many as four times before returning it to the company for recycling. CMP System. SpeedFam-IPEC. Chandler, AZ. A chemical-mechanical planarization (CMP) system...

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