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Parts by Number for Chip Electronics Top

Part # Distributor Manufacturer Product Category Description
CAL-CHIP ELECTRONICS ASAP Semiconductor CALCHIP Not Provided Not Provided
PIC18F4682-I/P MICRO-CHIP Quist Electronics MISC Not Provided Not Provided
PIC18F4620-I/P CHIP CUSTO Quist Electronics NEXPUMP, INC. Not Provided MER S
K-202LF EMI CHIP Allied Electronics, Inc. LAIRD TECHNOLOGIES Not Provided Kit;EMI Suppression Ferrite Chip Bead Kit & Monolithic CMC - 0402 to 3312
GMC31CG561J50NT BRAND:CAL-CHIP ELECTRONICS INC. National Microchip 4K/RL Not Provided Not Provided
GMC31CG561J50NT BRAND:CAL-CHIP ELECTRONICS INC. National Microchip 4K/RL #140K-F87C Not Provided Not Provided
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Conduct Research Top

  • IC Chip Inspection System
    Search. Search. Products Search. Search. IC Chip Inspection System. Profile. usage. Measurement and Control. Products. Embedded Computer Digital I/O GPIB / IEEE488. Industry. Electronics, appliances. Objectives. Customer. COMPUTER AUTOMATION CORPORATION., LTD. http://www.cacgrp.co.jp/. COMPUTER
  • Flip Chip Bonder (Embedded)
    . Site Map. Site Search. Search. Products Search. Search. Flip Chip Bonder (Embedded). Profile. usage. Measurement and Control. Products. Rackmount / Desktop Computers. Industry. Electronics, appliances. Objectives. Customer. Embedding an Industrial PC with image processing board into a Flip Chip
  • Enhanced Imager Chip Packaging for Automotive Applications (.pdf)
    . 2005-01-0556. Enhanced Imager Chip Packaging for. Automotive Applications. John R. Troxell, Jeff H. Burns, A. K. Chaudhuri,. Binghua Pan, Chih Kai Nah, Kiat Choon Teo, David Ihms,. Stephen Fox, Timothy Garner and William A. Bauson. Delphi Electronics and Safety. Reprinted From: Systems Engineering
  • System-on -Chip: Next Generation Electronics
    System-on -Chip: Next Generation Electronics. Providing a comprehensive source of state-of-the-art information on existing and emerging SoC research areas, this book covers the general principles of designing, validating and testing complex embedded computing systems and their underlying tradeoffs
  • Keeping pace with systems on a chip
    typically tells them to pick two out of three. But, that was before the advent of FPGA (field-programmable gate arrays) and SoC (system-on-a-chip) technologies. Now, with these rapidly evolving silicon technologies, designers can sometimes have their cake and eat it too. Parker Hannifin, for instance
  • SOI CMOS Technology for RF System-on-Chip Applications (.pdf)
    CMOS technology is one of the most promising choices for RF applications. Its highly integrated nature provides true RF system-on-chip integration.Silicon-oninsulator (SOI) CMOS offers specific additional design advantages that include a significant reduction in cross-talk between RF and digital
  • TA028: GaAs MMIC Processes Enable Multi-Function Integration, Increasing Reliability While Reducing Chip Size and Cost
    , low-noise, or switching performance. M/A-COM ARTICLE FOR MICROWAVE PRODUCT DIGEST. GaAs MMIC PROCESSES ENABLE MULTI-FUNCTION INTEGRATION,. INCREASING RELIABILITY WHILE REDUCING CHIP SIZE AND COST. By Dr. Edward L. Griffin and D. Gary Lerude. Aerospace & Defense ICs. M/A-COM, a Tyco Electronics
  • Application in Automotive Electronics (.pdf)
    and stability while small size,. high capability and the provided PC/104 slot also meet the requirements of automotive. system. Characteristics: Onboard low-power TM5800 733MHz CPU. 128MB onboard DDR RAM. Onboard SM722 graphic display chip, supports CRT+LCD and LVDS. Onboard. CompactFlash. PC/104 Plus expansion

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