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Supplier: Indium Corporation
Description: The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D assembly) an interposer.
Supplier: PI (Physik Instrumente) L.P.
Description: Monolithic co-fired multi-layered piezoceramic material for stack actuators
Standards and Technical Documents - Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages -- J-STD-030
Description: ) and/or increase mechanical strength. Materials used in underfill applications should not adversely affect device reliability (e.g. ionic impurities, alpha emitters) nor degrade electrical performance. When correctly selected and applied, underfill material should increase the life of the assembled
Wire, Cable, and Connector Tools - Tweezers - SMD Paddle Tip - Chip Handling (Length: 4.5; Material: stainless, anti-magnetic) -- EXCELTA 123-SASupplier: R. S. Hughes Company, Inc.
Description: Tweezers - SMD Paddle Tip - Chip Handling (Length: 4.5; Material: stainless, anti-magnetic). 4 1/2" Chip Handling Paddle Tip Tweezers The smaller size tips will handle many types of S.M.D. resistors and capacitors. Stainless Steel Antimagnetic.
- Tool Type: Tweezers
Supplier: Coilcraft CPS
Description: This robust version of Coilcraft’s standard 1812LS series features high temperature materials that allow operation in ambient temperatures up to 155°C.
- Type: Chip Inductor
- Mounting Style: Surface Mount Technology (SMT)
- Core Material: Ferrite
- Packing Method: Tape Reel
Supplier: Newark / element14
Description: POWER CHIP FLASHLIGHT; Battery Size Code:AA; Body Material:Rubber; Length:5.4"; Light Source:LED; No. of Batteries:1
Supplier: LECO Corporation
Description: The Sulfur in Coal RM series has been refined to five discrete sulfur levels ranging from a low of ~0.5% sulfur to a high end of ~4.5% sulfur. Silicon Steel Chip (MIEC CE31)
Supplier: Cecor, Inc.
Description: Reinforced heavy gauge steel construction. Fully welded, leakproof seams. Removable push handle fits both ends of container. Product Details: Bin Dimensions: 36" long x 23" wide x 22" deep Color: Gray Height of Loading Lip: 29-3/4 inches Load Capacity: 9.4 cubic feet Load
- Type: Tilting / Dumping Cart
- Material: Steel
- Wheel Type: Solid / Cushion
Supplier: DME Company
Description: The Nissen Metal marker utilizes a specially-formulated polyurethane paint to provide permanent marking under almost any conditions. the marks will remain bright, clear, and legible even on material that will be stored outside for long periods of time or material that will receive heavy abuse
- Type: Heat Resistant / High Temperature
- Substrate / Surface: Metal, Plastic, Wood
- Chemistry: Resin Base / Polymer Binder, Polyurethane
- Features: Wear Resistant (Abrasion / Erosion)
Supplier: FUTEK Advanced Sensor Technology, Inc.
Description: PMP621 , 250 Bar , High Accuracy Pressure Sensor (mV/V) , w/ TEDS Auto Recognition Chip , Material - 17-4 PH S.S. , 1/4-18-NPT Thread , Relative , 28 Awg 6 Conductor Shielded Polyurethane Cable , 10 ft Long
- Device Category: Transducer
- Pressure Reading: Gauge
- Sensor Technology: Strain Gauge
- Media: Liquid, Gas
Supplier: Hitachi Metals America, Ltd.
Description: Unique high rake geometry reduces cutting forces 30% increased rigidity thanks to special steel material and chip pocket geometry TH & JX Coated Inserts improve effciency and tool life All tools feature coolant-thru the tool
- Cutter Type: Face Mill, Other
- Cutter Configuration: Holder and Inserts
- Tip / End Geometry: Radius Tip
- Finish Type (if applicable): Roughing / Hogging
Supplier: Epoxy Technology
Description: ; it can block out light in opto-electronic devices. • Semiconductor encapsulant for COB packaged die. It may be used as a glob top DAM around the chip. • SMD “staking” material or Surface Mount Adhesive (SMA). The SMA may be used for double-sided PCB bonding of components
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Resins & Compounds: Liquid
- Compound Type: Casting Resin
Supplier: Oak-Mitsui, Inc.
Description: When ultra-thin laminate, low impedance, low inductance and high capacitance are needed, FaradFlex® is the solution! Increase your speed while reducing impedance, power bus noise and EMI. Embed Capacitor Layers inside your PCB or Chip Package
- Materials of Construction: Metal Foil / Cladding, Copper Foil / Cladding, Plastic / Polymer
- Features: Embedded Passives (Capacitance / Resistance), Tested to IPC, UL Listed, Dielectric / Insulating, Other
- Type: Rigid
- Embedded Passives (Capacitance / Resistance): Yes
Supplier: Bobcat Company
Description: The Bobcat® chipper attachment grinds branches, trees, limbs, saplings, and other debris quickly, safely and easily and reduces the branch volume 10-to-1. With the ability to continuously chip materials up to 5-inches in diameter, the chipper attachment is ideal for tree removal, pruning
Standards and Technical Documents - GUIDELINES FOR THE SURFACE MOUNTING OF MULTILAYER CERAMIC CHIP CAPACITOR -- EIA CB 11
Description: and its use are the primary subjects of this document. Included is a review of the design and materials employed in the chip's construction, as well as the material and process requirements for their mounting and interconnection by soldering. Guidelines for the selection and use of these chips based
Supplier: Techno, Inc.
Description: Double Edge Solid Carbide Foam Cutters For Use On: Foam Foam cutters for thick material with upward chip flow.
- Product: Individual Drill
- Size Units: English / Fractional
- Drill Type: Standard / Twist Drill
- Construction: Solid Construction
Supplier: CeramTec North America
Description: Alumina Lids and Sensor Substrates CeramTec North America produces lids and substrates typically used as heat sinks and electronic packaging as well as chip carrier packages themselves. Our substrates are employed in such components as photoelectric and thermoelectric sensors. Our materials
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Featured Products for Chip Material Top
RF Chip Inductors
Coilcraft CPS RF Chip Inductors deliver high performance in the smallest possible size and are available in six SMD case sizes. Outgassing Compliant (AE) parts pass NASA outgassing specifications and feature materials that allow operation in ambient temperatures from -55 to +155°C. High-Reliability (ML) parts feature extended temperature range (-55 to+155°C). High-Reliability (MS) parts offer extended temperature capability (-55 to+155°C) and tin-lead terminations for the best possible board... (read more)
Browse Chip Inductors Datasheets for Coilcraft CPS
Heavy Duty Chip Hopper
Heavy-duty steel stands up to rough treatment. Cart has small footprint - holds up to 6.9 cubic feet. Fully loaded cart can be maneuvered by one person. Click here for a printable PDF catalog page. Read how one plant solved their chip collection and transport problem with CECOR Chip hoppers. (read more)
Browse Material Handling Carts and Trucks Datasheets for Cecor, Inc.
H.C. Starck Inc. - Fabricated Products Group
Semiconductor Materials for Thermal Management
gt;Wear plates. > >Heat spreaders / Heat sinks. Copper Moly Copper Clad. > >CTE match with semiconductor substrates and ceramics. > >Stable CTE (-55 °C through 900 °C). > >High Thermal Conductivity (see table on page 10). > >Good Surface adhesion characteristics – solder. > >Compatible with plating processes. > >Lightweight. > >HB-LEDS. > >Lids / Covers. > >Multi-Chip Modules. > >Military Defense... (read more)
Browse Semiconducting Materials Datasheets for H.C. Starck Inc. - Fabricated Products Group
Low Profile Chip Carts
CECOR Low-Profile Chip Carts stand only 15-1/2" from the floor and with a loading side of only 12 inches, easily fit under machine tool discharge. Heavy loads roll easily and can be dumped from a fork lift using the optional dumping frame. Cart bottom is only 2-3/8" inches from the floor. Cart can be easily manuevered by one person. Small footprint allows placement in tight spaces.  ... (read more)
Browse Material Handling Carts and Trucks Datasheets for Cecor, Inc.
Mini-Systems, Inc. (MSI)
High-Reliability Thick Film Chip Resistor
tinning for optimum shelf life and best solder wetting. Chip Attach Precisely screened on backside conductors provides a uniform clear space and prevents shorting. Reliability and Testing Processed materials are continuously tested for mechanical and electrical performance parameters to Mil-PRF-55342. Our current DESC failure rating is "S", which represents more than (91) million hours of life testing without a failure. Stray Capacitance Minimized and consistent by controlled dimensions... (read more)
Browse Chip Resistors Datasheets for Mini-Systems, Inc. (MSI)
Premium Chip Vacuums Available
EXAIR's new Premium Chip Vac ™ System comes complete with a 30, 55 or 110 gallon drum, ready to use for your specific application. The Chip Vac is used to clean chips or other dry materials from fixtures, floors and work surfaces of machining centers, lathes, saws, mills and other industrial equipment. It can easily be moved from drum to drum to keep different materials separate for recycling. The Premium Chip Vac is compressed air powered and attaches to the included drum... (read more)
Browse Vacuums (Industrial) Datasheets for EXAIR Corporation
Comchip Technology Corporation
Comchip's Flat Chip Advantages
bull; RoHS, Halogen-Free, and REACH compliant. • No Tin = No Tin Whiskers = Long-term reliability. • Copper/Nickel/Gold termination: reliable soldering in standard and RoHS reflow processes. • High temperature molding material: 3x at 260 degrees Celsius. • No lead-frame: improved structure improves reliability and lowers costs. • Flat-chip stays put: no rolling, shifting, or tomb-stoning. • Minimizing reworks lowers production costs. • Excellent... (read more)
Browse Diodes Datasheets for Comchip Technology Corporation
Wafer & Substrate Bumping with Solder Paste
from the stencil walls by the pseudoplastic/thixotropic solder paste material. What if you are NOT stencil printing? The Flip Chip International (FCI) "drive in" process, which uses a developed photomask as a kind of "in situ" stencil for solder paste, allows for 5 or 6 print strokes using a soft squeegee to ensure that each aperture is filled. There are no problems here with stencil release, so how do we go about thinking of what particle size is required in this and similar processes? Read more... (read more)
Browse Semiconducting Materials Datasheets for Indium Corporation
Conduct Research Top
Chip Testing for Cordless Phones
A customer makes 900MHz and 2.1GHz portable phones using a specific chip that they purchase from a chip manufacturer. To ensure the quality of their product, the company tests each chip to avoid repair and debugging later on in the quality control department. Gage Applied ::. Data acquisition
Cermet Chip-Breaker Designation
SPK offers a wide range of Cermet grades with chip breakers for indexable inserts for turning to give optimum chip control. The chipbreaking geometries are designed to ensure reliable chipbreaking under fully automated conditions. Cermets for Machining Applications. CeramTec International Close
Polymer Chip Drying - Spot Check Measurements (.pdf)
at this stage rapidly. hydrolyses the polymer, thereby reducing its molecular weight and damaging its physical properties. Polymer chip material is processed on a hopper load basis by a flow of heated and dried air from a desiccant dryer. The. recognized practice is to expose the chips to a dewpoint
ChIP/DNA Shearing (.pdf)
Sonicators are commonly used for ChIP Assay and DNA shearing. The most common method is to insert a microtip probe directly into a sample. At Qsonica, we call this direct probe sonication. Energy is transmitted from the probe directly into the sample and the sample is processed very >quickly. þÿ
Enhanced Imager Chip Packaging for Automotive Applications (.pdf)
provides the optical access to the. imager chip. The use of a transparent underfill material. reduces the rate of moisture infiltration and reduces. optical reflections within the package structure. The flex. may be extended beyond the package to allow surface. mounting of additional passive and active
AN0014 X2Y Balanced Line EMI Chip Reliability and Performance Data
The X2Y Balanced Line EMI Chip is a 3 terminal device with a revolutionary internal design, offering simultaneous line-to-line and line-to-ground filtering, using a single chip. The novel electrode structure provides a much reduced inductance when compared to conventional capacitors, which enhances
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient
Leadless Chip NTC Thermistor Reliabilty Report: Pump Laser Module (.pdf)
. The "New thermistor" referenced in Table 1 above is Cornerstone Sensors, Inc. T041D103.02.H Leadless Chip Thermistor with patented High Temperature Solder. Leach Resistant Gold Contacts. 2. TEST PLAN AND RESULTS. See Table 2 for the test plan and Table 3 for the test grouping. See Table 4 for test
Engineering Web Search: Chip Material Top
Links and Selected Readings - GNU Project - Free Software...
Chip Documentation The list below is based on the c4x Manufacturer: Texas Instruments Exact chip name: TMS320C4X DSP Manuals
Materials Science - Caltech
and Materials Science, and colleagues have laid the groundwork for an on-chip optical quantum network by showing that defects in diamond can be used
Current and reliable Materials & Material Processing news...
Material Handling and Storage Materials and Material Processing Materials & Material Processing Sub-Categories
Cornell Nanophotonics Group
numerous: on-chip light modulation (optically and electro-optically) and detection, networks on-chip, nonlinear phenomena, multi-material devices and
Vishay - Conformal Coated - Related Documents
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Error : Bad color Material Composition Declaration This document is a declaration of the substances within the manufacturer listed item.
FF1924/FFG1924 - Package Drawing (Flip-Chip BGA)(PDF, ver 1.0, 143 KB ) FF1154 - Package Drawing (1156 Ball Flip-Chip BGA)(PDF, ver 1.0, 139 KB )