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Chip Probing Equipment

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Products/Services for Chip Probing Equipment

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Parts by Number for Chip Probing Equipment

Part # Distributor Manufacturer Product Category Description
PVBS   Medit Videoscopes thanks to their 2-way tip articulation. The Articulated PhotonVideo Borescopes feature a narrow 5.5mm (0.22") diameter insertion probe with a small CMOS video camera chip located directly in the tip. The probes can be used remotely, but commonly they should be connected directly to the monitor...
TR210   InspectorTools Moisture Meters We match all prices PLUS an extra 10% of the difference - just call!. Standard Equipment Includes: Concrete CRH instrument. 2 Relative Humidity/Temperature probes with cable/RJ11 connectors. 13 Plastic hole liner insert kits for below surface RH measurements. PP3 Lithium Manganese battery. RS232...
70012603 Allied Electronics, Inc. GE General Eastern Instruments Temperature Sensors The DC95/EC95 thermistors have higher dissipation constants than glass-coated beads or probe-style thermistors and therefore can be used in circuits of moderate power levels. The thermal time constant of chip-style thermistors is comparable to that of large glass probes. This series chip thermistor...
70012600 Allied Electronics, Inc. GE General Eastern Instruments Temperature Instruments The DC95/EC95 thermistors have higher dissipation constants than glass-coated beads or probe-style thermistors and therefore can be used in circuits of moderate power levels. The thermal time constant of chip-style thermistors is comparable to that of large glass probes. This series chip thermistor...
70012600 Allied Electronics, Inc. GE General Eastern Instruments Thermistors The DC95/EC95 thermistors have higher dissipation constants than glass-coated beads or probe-style thermistors and therefore can be used in circuits of moderate power levels. The thermal time constant of chip-style thermistors is comparable to that of large glass probes. This series chip thermistor...
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Conduct Research

  • Photonic chips take a step towards practical applications
    nanoelectronics. LEDs light up semiconductor manufacturing equipment. iPhone Apps for Engineers. Electronic “Paper” Changes Shape to Let Blind People Read. Probing the realm of nanomovies. Advertisement. Advertisement. Advertisement. Related Sites. Design Engineer JOBZone. Marketing Resource Center...
  • Future Inspection Technologies
    as the first officer does at pre-flight, just before departure. But this walkaround would be far more probing. Armed with a wireless ultrasound device, "your technician walks past the airplane and a little chip beeps at him," envisions Michael Moles, senior technology manager for Olympus NDT. "He knows...
  • EXPANSIONS AND ACQUISITIONS
    to begin in 1999. Maximum capacity will be 6000 8-in. wafers/week. Electroglas, a supplier of automatic wafer probing equipment, has signed a definitive agreement to purchase Knights Technology of Sunnyvale, CA, for approximately $30 million in stock. Knights manufactures software for yield enhancement...
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    in-circuit tests on them is nearly impossible without enough pad spacing to allow 50-mil or greater probing of the circuit. Fujitsu Ltd. has begun sampling a 42-inch, high-resolution color plasma display. venture capital, semiconductors, aerospace, manufacturing, computers, foundries, electronics...
  • Movin'On
    ....John Livingston has been appointed vp and CIO of Electroglas, a manufacturer of automatic wafer probing and information-management products. Livingston most recently served as vp of information systems for Adaptec. The new CFO and vp of finance at Verteq is Preston Romm. Romm is the former CFO/ vp...
  • Movin'On
    chairman of the company's board of directors, replacing Neil Bonke. Bonke will continue to serve as a board member for the manufacturer of automated wafer-probing tools.... Dexter Electronic Materials has promoted George Collin to senior vp of finance and administration. Collin most recently served...
  • MICRO:Industry News: Expansions & Acquisitions (July '99)
    unit. He reports record bookings in the first quarter of this year, fueled primarily by demand for communications networks. In addition, the growing demand for higher on-wafer probing speeds are firing interest in the Pyramid Probe cards, Smith claims. Dow opens resin plant Dow Chemical has...
  • Multilayer Lamination Methods for PTFE-Based PCBs
    Download PDF. Experimental Observations of Distributed Nonlinearity in Printed Lines. PTFE laminate, pcb nonlinearity, passive intermodulation (PIM). Read Abstract Download PDF. Mapping of Passive Intermodulation Products on Microstrip Lines. RF-30, microstrip lines, near field probing, nonlinearities...
  • MICRO:New Technologies-Analysis & Metrology, by Patrick J. McCann, p.93 (July '99)
    In this work the v4 absorption lines in the 8.14-um spectral region were probed. Probing COF2 absorption lines in the shorter-wavelength v1 band, however, offers the advantage of higher signal-to-noise ratios, since mid-IR detectors have higher sensitivities at shorter wavelengths. Figure 1 shows...
  • MICRO: 'Round the Circuit
    of Engineering for Information Industry have teamed up to develop an RFID-based system that offers real-time wafer-lot identification and chip-probing information during the wafer sorting, with the goals of enhancing productivity and shortening total processing time. Customers participating in the project...

Engineering Web Search: Chip Probing Equipment

FIPS 140-2
cryptographic modules and provide Federal agencies with a security metric to use in procuring equipment containing validated cryptographic modules.
FIPS 140-1, Security Requirements for Cryptographic Modules
This standard supersedes FIPS 140, General Security Requirements for Equipment Using the Data Encryption Standard, in its entirety.
Emulation Technology, Inc. World Leader for IC Adapters, Test...
Probing Solutions Programming Adapters by Chip Package Product Registration Application Notes
See Emulation Technology, Inc. Information
DPO/DSA/MSO70000 Digital Phosphor Oscilloscopes/Digital Serial...
Analog/digital probing with a variety of connectivity support options
See Tektronix, Inc. Information
Reverse engineering - Wikipedia, the free encyclopedia
which means that the only way to incorporate the functionality into new technology is to reverse-engineer the existing chip and then re-design it.
Mirror - Wikipedia, the free encyclopedia

Agilent | Semiconductor Memory Markets, Standards and Test...
Semiconductor Memory Markets, Standards and Test Equipment Backgrounder
See Agilent Technologies, Inc. / Electronic Measurement Group Information
Tokyo Electron Limited Company Profile - Yahoo! Finance
TEL's chip-making systems include chemical vapor deposition, thermal processing, etching, cleaning, and probing equipment.
ST | Crolles2 Alliance Partners Pool Research Efforts in...
post-fabrication wafer processing including probing, grinding, sawing, die attach, wire-bonding, flip chip and package molding techniques as well as
Predictability in design and manufacturing PREDICTABILITY in...


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