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Chip Probing System

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Products/Services for Chip Probing System

  • IC Interconnect Components-Image
    IC Interconnect Components - (342 companies)
    IC interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device. IC interconnect interface or connect microelectronic semiconductor chips to printed circuit boards (PCB) or larger-scale devices... Search by Specification | Learn More
  • Automated Test Equipment-Image
    Automated Test Equipment - (417 companies)
    ...test components, printed circuit boards, and interconnections and verifications. Test types for components include logic, memory, linear or mixed signal, passive components and active components. Logic test systems are designed for handling... Search by Specification | Learn More
  • Semiconductor Metrology Instruments-Image
    Semiconductor Metrology Instruments - (179 companies)
    Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers... Search by Specification | Learn More
  • Wafer and Thin Film Instrumentation-Image
    Wafer and Thin Film Instrumentation - (347 companies)
    Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film... Search by Specification | Learn More
  • IC Package Converters and Adapters-Image
    IC Package Converters and Adapters - (43 companies)
    ...and shrink zigzag in-line package (SZIP). Features. IC package converters and adapters differ in terms of features. Solderless sockets can be mounted by compression. Zero insertion force (ZIF) sockets are used to plug in chips such as the central processing... Search by Specification | Learn More
  • Semiconductor Equipment Repair Services - (40 companies)
    Other semiconductor equipment repair services repair, rebuild or refurbish die bonders; cleaning and washing equipment; dicing equipment; die separators; lithography systems; packaging equipment; wafer coating equipment; wafer bonding systems... Learn More
  • System on a Chip (SoC) - (72 companies)
    System on a chip (SoC) devices are semiconductor chips with embedded components that make the chip a standalone system. System on a chip (SoC) devices are semiconductor chips with embedded components that enable the chip to function as standalone... Learn More
  • Electronic Manufacturing Services (EMS) - (1496 companies)
    ...visit PCB Fabrication Services on GlobalSpec. Microelectronics. As its name implies, microelectronics deals with the manufacture of very small semiconductor components and includes flip chips and chip on board devices. Flip chips are integrated... Search by Specification | Learn More
  • xDSL Chips - (18 companies)
    ...xDSL Chips Information. xDSL chips provide digital subscriber line (DSL) connectivity in a system-on-chip platform. The term xDSL refers collectively to all types of digital subscriber lines. An xDSL chip is a generic term for all forms of DSL... Learn More
  • LAN Chips - (49 companies)
    LAN chips provide wireless local area network (LAN) connectivity in a system-on-chip platform. A LAN chip is a device on an Ethernet network that broadcasts information and provides Ethernet functions, including PHYceivers and media access control... Search by Specification | Learn More
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Conduct Research

  • MICRO: Using an in-line measurement system for copper damascene process control
    produces a measurable change in the metal's reflectance; probing that reflectance change provides a measurement signal that correlates to the average resistance per unit length within the device features. Because peak temperature also is proportional to the resistivity per area, the measurement can...
  • Future Inspection Technologies
    as the first officer does at pre-flight, just before departure. But this walkaround would be far more probing. Armed with a wireless ultrasound device, "your technician walks past the airplane and a little chip beeps at him," envisions Michael Moles, senior technology manager for Olympus NDT. "He knows...
  • EXPANSIONS AND ACQUISITIONS
    manufactures software for yield enhancement and failure analysis. Santa Clara, CA-based Electroglas says that the combination of the company's wafer probing system and Knights' software will enable chipmakers to preemptively eliminate process- or particle-induced killer defects by leveraging data from all...
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    17.1 from Cimmetry Systems adds support for pc-board layout and schematic formats, along with features such as cross-probing. Outsourcing services put chip designers on edge The acceleration of overseas outsourcing of information technology services in recent years has some circuit designers...
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    , which scientists believe could lead to a process that extracts hydrogen directly from water using only solar energy. German tax authorities probing ex-Infineon boss Schumacher German tax authorities are investigating Infineon Technologies AG and its ex-chief Ulrich Schumacher, adding to the legal woes...
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    between digital televisions and the functions accessible via next-generation cable set-top boxes. Positrons probe quantum dots for defects A practical non-destructive test method for probing ultrasmall quantum dots may be the fallout from experiments at the U.S. Department of Energy's Idaho National...
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    in-circuit tests on them is nearly impossible without enough pad spacing to allow 50-mil or greater probing of the circuit. Fujitsu Ltd. has begun sampling a 42-inch, high-resolution color plasma display. venture capital, semiconductors, aerospace, manufacturing, computers, foundries, electronics...
  • Hyperbit: Patented New Technology Increases DAC Resolution and Provides Improved Positioning Resolution.
    . (Equation 1): HyperBitTM lends itself well to improving the. resolution of waveform actuation in scanning,. DAC _ rate. Resolution. Resolution. + log. (bits). DAC(bits). 2. probing and dithering applications. Figure 5 and. PWM _ Frequency. Figure 6 document real-time interferometric. ­ Available DAC rate...
  • MICRO:June 98:Semicon West Exhibitors - page 2
    Precision Contacts .....10823 Precision Technologies.....10641-5 Probe & Test.....12164 Probe Technology.....12063 Probe 2000.....13309 Probing Solutions.....11212-1 Professional Plastics/SPI.....12219 PS Systems.....11022-1 Pycon.....12221 QPL.....10135 Quantum Materials.....10536-1 Quantum...
  • MICRO: The MICRO Interview
    and the yield management systems, where we can integrate all the defects and the parametric and the probing data together. On top of the integration team in each fab, there is a product engineering team, which is separated from the fab, and they act as a central focus for the yield improvement by each...

Engineering Web Search: Chip Probing System

FIPS 140-2

FIPS 140-1, Security Requirements for Cryptographic Modules
Protection of a cryptographic module within a security system is necessary to maintain the confidentiality and integrity of the information protected
OpenBSD 4.4 Release
OpenBSD/socppc For machines based on the Freescale MPC8349E System-on-Chip (SoC) platform that use Das U-Boot as a boot loader.
Chip From LogicVision and National Semiconductor Enables...
Chip From LogicVision and National Semiconductor Enables Intranet-Based Circuit Board Probing
See National Semiconductor Information
Reverse engineering - Wikipedia, the free encyclopedia
which means that the only way to incorporate the functionality into new technology is to reverse-engineer the existing chip and then re-design it.
Speed of light - Wikipedia, the free encyclopedia

MSO/DPO4000B Mixed Signal Oscilloscope Series >...
Analyze analog and digital signals on a single instrument for system-level troubleshooting of complex designs.
See Tektronix, Inc. Information
Testing and measuring the TAMS 3011, Part 5: Porting NetBSD to...
The TAMS 3011 system this series uses is built around the AMCC PowerPC® 405GPr, which is a system-on-a-chip (SoC) design.
See International Business Machines Corp. Information
ATLAS PIXEL MODULE TE AT STING LAS PIXEL MODULE TE US AT US...

Small-Scale Multipath Measurements - Developer Zone - National...
probing pulse (see Equation (5.17)). If the oscilloscope is set on averaging mode, then this system can provide a local average power

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