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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
24FC64 Microchip Technology, Inc. Microchip Technology, Inc. Not Provided address space. The 24XX64 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, DFN, TDFN and MSOP packages. The 24XX64 is also available in the 5-lead SOT-23, and Chip Scale packages. Single-Supply with Operation down to 1.7V for 24AA64/24FC64 devices, 2.5V for 24LC64 devices. Low-Power...
24LC128 Microchip Technology, Inc. Microchip Technology, Inc. Not Provided in the standard 8-pin plastic DIP, SOIC (3.90 mm and 5.28 mm), TSSOP, MSOP, DFN, and Chip Scale packages. Single Supply with Operation down to 1.7V for 24AA128/24FC128 devices, 2.5V for 24LC128 devices. Low-Power CMOS Technology: - Write current 3 mA, typical - Standby current 100 nA, typical. 2-Wire...
TC850 Microchip Technology, Inc. Microchip Technology, Inc. Not Provided and manipulation of address lines is not required. Operating from ±5V supplies,the TC850 dissipates only 20mW.It is packaged in 40-pin plastic or ceramic dual-in-line packages (DIPs)and in a 44-pin plastic leaded chip carrier (PLCC),surface-mount package. 15-bit Resolution Plus Sign Bit. Up to 40...

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  • Chip Scale Package (CSP)
    Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies
  • Avago Introduces 18 GHz and 26.5 GHz Low-Noise E-pHEMT in 0402 Compatible Packages Produced by Advanced Wafer-Scale Packaging Technology (.pdf)
    Smaller, lower cost components are crucial to the devel¬opment of today's higher-performance, smaller and in¬creasingly price-competitive mobile devices. Since the introduction of chip scale packages (CSPs) they have be¬come a major trend in active device packaging. Chip scale packaging combines
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Applied Materials to add staff in Austin Scenix chairman dies from Beijing beating Tessera expands beyond BGA technology Remnants of VTC will become analog chip foundry MCT introduces test-handling system for chip-scale packages OnQ Technology opens backend packaging facility in Philippines Alcatel
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    , Genesis, IDT, Microchip post strong Q4 results KLA-Tencor posts strong quarter due to Asian orders Intel sees Netstructure boards as unifier for cellular, WiMax services Amkor to expand production of chip-scale packages Tower predicts losses up
  • Medical Device Link . Advanced Electronic Packaging Techniques Enhance Function, Performance, and Portability
    , as device complexities increase and I/O counts escalate, leaded SMT packages are becoming larger, with lead pitches shrinking as low as 0.3 mm. As a result, alternative packaging and assembly technologies are gaining in prominence, particularly ball-grid arrays, chip-scale packages, chip-on-board
  • Medical Device Link .
    electronic equipment manufacturers must address when adapting these miniature chip-scale IC packages (CSPs) are reliability and performance. To successfully qualify an IC component package technology for medical electronic applications, the OEM must establish confidence in end-product reliability
  • Smart Computing Article - Laplink to latency
    for their separate inventions in 1959. ICs are used in a variety of devices and are categorized by the number of transistors or active circuits they hold. LSI refers to a package of 100 to 5,000 transistors on one single chip. With this advancement from SSI (small-scale integration), which held 30 or fewer
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    , reverts to SDRAM 3Dfx president resigns, following market stumbles Intel builds up East Coast presence with new Boston-area development center Altera to acquire provider of DSP IP Irvine Sensors' patent allows stacking of different chips in one package Trikon to step up marketing of low-k system

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