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Part # Distributor Manufacturer Product Category Description
24FC64 Microchip Technology, Inc. Microchip Technology, Inc. Not Provided address space. The 24XX64 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, DFN, TDFN and MSOP packages. The 24XX64 is also available in the 5-lead SOT-23, and Chip Scale packages. Single-Supply with Operation down to 1.7V for 24AA64/24FC64 devices, 2.5V for 24LC64 devices. Low-Power...
24LC128 Microchip Technology, Inc. Microchip Technology, Inc. Not Provided in the standard 8-pin plastic DIP, SOIC (3.90 mm and 5.28 mm), TSSOP, MSOP, DFN, and Chip Scale packages. Single Supply with Operation down to 1.7V for 24AA128/24FC128 devices, 2.5V for 24LC128 devices. Low-Power CMOS Technology: - Write current 3 mA, typical - Standby current 100 nA, typical. 2-Wire...
TC850 Microchip Technology, Inc. Microchip Technology, Inc. Not Provided and manipulation of address lines is not required. Operating from ±5V supplies,the TC850 dissipates only 20mW.It is packaged in 40-pin plastic or ceramic dual-in-line packages (DIPs)and in a 44-pin plastic leaded chip carrier (PLCC),surface-mount package. 15-bit Resolution Plus Sign Bit. Up to 40...

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  • Chip Scale Package (CSP)
    Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies
  • Avago Introduces 18 GHz and 26.5 GHz Low-Noise E-pHEMT in 0402 Compatible Packages Produced by Advanced Wafer-Scale Packaging Technology (.pdf)
    Smaller, lower cost components are crucial to the devel¬opment of today's higher-performance, smaller and in¬creasingly price-competitive mobile devices. Since the introduction of chip scale packages (CSPs) they have be¬come a major trend in active device packaging. Chip scale packaging combines
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  • Medical Device Link . Advanced Electronic Packaging Techniques Enhance Function, Performance, and Portability
    , as device complexities increase and I/O counts escalate, leaded SMT packages are becoming larger, with lead pitches shrinking as low as 0.3 mm. As a result, alternative packaging and assembly technologies are gaining in prominence, particularly ball-grid arrays, chip-scale packages, chip-on-board
  • Medical Device Link .
    electronic equipment manufacturers must address when adapting these miniature chip-scale IC packages (CSPs) are reliability and performance. To successfully qualify an IC component package technology for medical electronic applications, the OEM must establish confidence in end-product reliability
  • Smart Computing Article - Laplink to latency
    for their separate inventions in 1959. ICs are used in a variety of devices and are categorized by the number of transistors or active circuits they hold. LSI refers to a package of 100 to 5,000 transistors on one single chip. With this advancement from SSI (small-scale integration), which held 30 or fewer
  • | Electronics Industry News for EEs & Engineering Managers
    , reverts to SDRAM 3Dfx president resigns, following market stumbles Intel builds up East Coast presence with new Boston-area development center Altera to acquire provider of DSP IP Irvine Sensors' patent allows stacking of different chips in one package Trikon to step up marketing of low-k system

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