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  • Chip Scale Package (CSP)
    Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies
  • Avago Introduces 18 GHz and 26.5 GHz Low-Noise E-pHEMT in 0402 Compatible Packages Produced by Advanced Wafer-Scale Packaging Technology (.pdf)
    Smaller, lower cost components are crucial to the devel¬opment of today's higher-performance, smaller and in¬creasingly price-competitive mobile devices. Since the introduction of chip scale packages (CSPs) they have be¬come a major trend in active device packaging. Chip scale packaging combines
  • | Electronics Industry News for EEs & Engineering Managers
    Applied Materials to add staff in Austin Scenix chairman dies from Beijing beating Tessera expands beyond BGA technology Remnants of VTC will become analog chip foundry MCT introduces test-handling system for chip-scale packages OnQ Technology opens backend packaging facility in Philippines Alcatel
  • | Electronics Industry News for EEs & Engineering Managers
    , Genesis, IDT, Microchip post strong Q4 results KLA-Tencor posts strong quarter due to Asian orders Intel sees Netstructure boards as unifier for cellular, WiMax services Amkor to expand production of chip-scale packages Tower predicts losses up
  • Medical Device Link . Advanced Electronic Packaging Techniques Enhance Function, Performance, and Portability
    , as device complexities increase and I/O counts escalate, leaded SMT packages are becoming larger, with lead pitches shrinking as low as 0.3 mm. As a result, alternative packaging and assembly technologies are gaining in prominence, particularly ball-grid arrays, chip-scale packages, chip-on-board
  • Medical Device Link .
    electronic equipment manufacturers must address when adapting these miniature chip-scale IC packages (CSPs) are reliability and performance. To successfully qualify an IC component package technology for medical electronic applications, the OEM must establish confidence in end-product reliability
  • Smart Computing Article - Laplink to latency
    for their separate inventions in 1959. ICs are used in a variety of devices and are categorized by the number of transistors or active circuits they hold. LSI refers to a package of 100 to 5,000 transistors on one single chip. With this advancement from SSI (small-scale integration), which held 30 or fewer
  • | Electronics Industry News for EEs & Engineering Managers
    , reverts to SDRAM 3Dfx president resigns, following market stumbles Intel builds up East Coast presence with new Boston-area development center Altera to acquire provider of DSP IP Irvine Sensors' patent allows stacking of different chips in one package Trikon to step up marketing of low-k system

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