Chip Scale Packages

Description: BARE DIE AND CHIP SCALE PACKAGES TAPED IN 8 MM & 12 MM CARRIER TAPE FOR AUTOMATIC HANDLING

Description: Wafer Level Chip Scale Packaging (WLCSP) refers to the technology of packaging an integrated circuit at wafer level, resulting in a device practically the same size as the die. WLCSP technology allow devices to be integrated in the design using the smallest possible form factor.

Description: Avago Technologies has combined its industry leadingE-pHEMT technology with a revolutionary chip scale package. This product is easy to use since it requires only positive DC voltages for bias and no matching coefficients are required for impedance matching to 50 Ω systems.

• Transistor Type / Technology: PHEMT, Other
• Package Type: Other
• Transistor Grade / Operating Range: Commercial, Industrial

Description: Single Supply: 2.85 V to 5 V Low Total Supply Current = 4.5 mA (max) Low Power Mode: 5 µW (max) Integrated DAC Reconstruction Filters Video Line Driver Outputs with 6 dB Gain Rail-to-Rail Output RoHS Compliant 9-Pin Wafer Scale Package APPLICATIONS Personal Media Players

• RoHS Compliant: Yes
• Package Type: Other
• Rail-to-Rail Output: Yes
• Single Supply: Yes

Description: The VMMK-3413 is a small and easy-to-use, broadband, directional detector operating in various frequency bands from 25 to 45 GHz with typical insertion loss of 0.8 dB. It is housed in the Avago Technologies' industry-leading and revolutionary sub-miniature WaferCap chip scale package (GaAsCap wafer

• Package Type: Surface Mount Technology (SMT)

Description: Transients Port ESD Protection Capability Exceeds: 15-kV Human Body Model 2-kV Machine Model Available in a WCSP Chip-Scale Package Stand-Off Voltage . . . 6 V Min Low Current Leakage . . . 1 µA Max at 6 V Low Capacitance . . . 35 pF Typ APPLICATIONS USB 1.1 Host, Hub, or Peripheral Ports

Description: address space. The 24XX64 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, DFN, TDFN and MSOP packages. The 24XX64 is also available in the 5-lead SOT-23, and Chip Scale packages. Single-Supply with Operation down to 1.7V for 24AA64/24FC64 devices, 2.5V for 24LC64 devices

• Memory Category: EEPROM
• IC Package Type: SOIC, TSSOP, Other
• Supply Voltage: 1.8 V, 2.5 V, 2.7 V, 3 V, 3.3 V, 3.6 V, 5 V, Other
• Bus Type: I²C

Description: QFN Package Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline Near Chip Scale Package footprint, which improves PCB efficiency and has a thinner profile Pb-Free (RoHS Compliant) Description The ISL6131 and ISL6132 are a family of high-accuracy

• Number of Supplies: 2
• Features: Manual Reset
• Output Options: Active Low

Description: Product Features Ultra-low loss Single-ended operation Small size Usable bandwidth of 2.4 MHz Ceramic chip-scale Package (CSP) Hermetic RoHS compliant (2002/95/EC), lead-free

• Filter Category: SAW Filter
• Filter Type: Other
• Applications: General
• Package Type: Other

Description: is provided in a compact 15-bump, 1.6 x 2.0 mm Wafer Level Chip Scale Package (WLCSP) that meets requirements for board-level assembly.

• Applications: RF / Microwave Capacitors
• Configuration / Form Factor: Surface Mount / Chip Capacitor
• Lead / Termination Type: Surface Mount Technology (SMT)
• Mounting Style: Surface Mount Technology (SMT)

Description: LOW OFFSET VOLTAGE: 10µV (max) ZERO DRIFT: 0.05µV/°C (max) 0.01Hz to 10Hz NOISE: 1.1µVPP QUIESCENT CURRENT: 17µA SINGLE-SUPPLY OPERATION SUPPLY VOLTAGE: 1.8V to 5.5V RAIL-TO-RAIL INPUT/OUTPUT microSIZE PACKAGES: SC70 and SOT23 APPLICATIONS TRANSDUCER

• Device Type: Operational Amplifiers
• Package Type: SOIC, MSOP, Other
• RoHS Compliant: Yes
• Life Cycle Stage: Other

Description: -) +0.05V to (V+) -0.05V LOW QUIESCENT CURRENT: 50µA OPERATING TEMPERATURE: -40°C to +125°C RFI FILTERED INPUTS MSOP-8 AND DFN-8 PACKAGES APPLICATIONS BRIDGE AMPLIFIERS ECG AMPLIFIERS PRESSURE SENSORS MEDICAL INSTRUMENTATION PORTABLE INSTRUMENTATION WEIGH SCALES

• RoHS Compliant: Yes
• Package Type: Other
• Device Type: Instrumentation Amplifiers

Description: The SKY13383-000 is a GaAs pHEMT Single-Pole, Triple-Throw (SP3T) switch designed for 2.4 GHz WLAN applications. The SKY13383-000 is manufactured in a compact, 705 x 705 μm, 8-bump Chip Scale Package (CSP). The small footprint provides the industry’s smallest PCB area needed

• Actuator Type: Other

Description: electronics devices. Using an infrared microscope, the LEXT OLS3000IR enables features that cannot be seen visually -- such as SIP (System in Package), 3-dimensional mounting, and CSP (Chip Scale Package) -- to be inspected, measured and analyzed nondestructively.Ultra-fine subsurface resolution and clarity

• Application: Semiconductor Inspection
• Grade: Benchtop
• Microscope Type: Laser / Confocal
• Eyepiece Style: Monocular

Description: Packaged Flip Chip TVS Array FEATURES • IEC 61000-4-2 (ESD): Air - 15kV, Contact - 8kV • IEC 61000-4-4 (EFT): 40A - 5/50ns • Chip Scale Package 0.050” (1.270mm) x 0.030” (0.762mm) • ESD Protection > 25 kilovolts • Available in Voltages Ranging From 3.3V

• Diode Type: Transient Voltage Suppressor Diodes (TVS)
• Configuration: Array

Description: Include: 0402 and 0201 package types Chip Scale Package (CSP) BGA and uBGA double-sided/mirrored BGA assembly COB and MCM Direct and multiple chip attach High pin count press fit Gold and aluminum wedge-bonding Wire-bonding Flex Circuits Wave solder Selective soldering

• Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
• Testing Services: Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
• Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
• Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn

Description: Pressure Sensors IC; Full Scale Span:4.6V; IC Function:Pressure Sensor IC; Leaded Process Compatible:Yes; Operating Pressure Max:400kPa; Over Pressure:1600kPa; Package / Case:1317 - Basic Element; Pressure Measurement Type:Absolute

• Standards: RoHS Compliant
• Sensor Type: Pressure Sensor
• RoHS Compliant: Yes

Description: different screen sizes and performance needs. The TSC2004 is available in a miniature, 18-lead, 5 x 5 array, (2.554 ±0.54)mm x (2.554 ±0.54)mm wafer chip-scale package (WCSP), and a 20-pin, 4 x 4 QFN package. Both packages are characterized for the -40°C to +85°C industrial

• Type: Resistive
• Wire Type: 4 Wire
• Interface: I2C

Description: Key Features Drives N-Channel MOSFET Half Bridge SOIC, EPSOIC, QFN and DFN Package Options SOIC, EPSOIC and DFN Packages Compliant with 100V Conductor Spacing Guidelines of IPC-2221 Pb-free Product Available (RoHS Compliant) Bootstrap Supply Max Voltage to 114VDC On-Chip 1„

• Driver Type: Dual Gate Driver (Half-bridge)

Description: ) 1.8-V Device Power Supply Wide Temperature Range, –30°C to 85°C ESD Protection: 2 KV HBM, 750 V CDM, and 100 V MM Small 20-Pin Chip-Scale Package: 0.4-mm Pitch WCSP (1.6 mm × 2 mm) APPLICATIONS Cellular Phones Smart Phones Mobile Handsets Portable Systems

• Technology: I²C
• Device Type / Applications: Buffer
• RoHS Compliant: Yes
• Supply Voltage: 1.8 V

Description: No Leads - Package Outline Near Chip Scale Package footprint, which improves PCB efficiency and has a thinner profile Pb-Free Packaging Available Description The ISL6410, ISL6410A are synchronous current-mode PWM regulators designed to provide a total DC-DC solution for microcontrollers

• Regulator Category: Switching Regulator
• Configuration / Function: Step-down (Buck)

Description: The Model 1010 is a low-cost, integrated accelerometer for use in zero to medium frequency instrumentation applications. Each miniature, hermetically sealed package combines a micro-machined capacitive sense element and a custom integrated circuit that includes a sense amplifier and sigma-delta A/D

• Sensor Type: Acceleration Sensor, Other
• Sensor Grade / Operating Range: Automotive, Industrial, Military, Other
• Package Type / Mounting: Surface Mount (SMD)
• RoHS Compliant: Yes

Description: QFN Packages QFN Package: Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline Near Chip Scale Package footprint, which improves PCB efficiency and has a thinner profile Pb-free Available Description The ISL6292D is an integrated single-cell Li-ion

• Cell Type: Li-Ion

Description: Features Usable bandwidth of 20 MHz Typical 3 dB bandwidth of 35 MHz Low loss High attenuation Single-ended operation No impedance matching required for operation at 50O Chip Scale Package (CSP) Hermetic RoHS compliant (2002/95/EC), Pb-free Typical Applications For GPS

• Filter Technology: Passive Filter
• Filter Type: Bandpass
• Filter Design: SAW Filter, Other
• Package Type: Surface Mount Technology (SMT)

Description: for high-accuracy, user-programmable current Over-Current and Over-Temperature Protection Available in Wafer Chip-Scale Package or 2,5mm × 2,5mm SON-10 APPLICATIONS Keypad and Display Backlighting White and Color LEDs Cellular Handsets PDAs and Smartphones

• Device Type / Applications: LED Driver
• RoHS Compliant: Yes
• IC Package Type: Other
• Features: Over-Voltage Protection

Description: Shutdown Pin Integrated Microprocessor Reset Circuit Programmable Reset Delay Proven Reference Design for a Total WLAN System Solution QFN Package Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Product Outline Near Chip-Scale Package Footprint Improves PCB Efficiency

• Regulator Category: Linear Regulator

Description: mm × 2.44 mm 25-bump Wafer Level Chip Scale Package (WLCSP).

• Device Type / Applications: LED Driver
• Supply Voltage: 2.5 V, 3 V, 3.3 V, 3.6V, 5 V, Other
• IC Package Type: WLCSP