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  • Avago Introduces 18 GHz and 26.5 GHz Low-Noise E-pHEMT in 0402 Compatible Packages Produced by Advanced Wafer-Scale Packaging Technology (.pdf)
    Smaller, lower cost components are crucial to the devel¬opment of today's higher-performance, smaller and in¬creasingly price-competitive mobile devices. Since the introduction of chip scale packages (CSPs) they have be¬come a major trend in active device packaging. Chip scale packaging combines
  • How to Reduce Voiding in Components with Large Pads
    As the electronics industry moves toward. miniaturization and multifunction,. smaller components with more functions,. such as quad-flat no-leads (QFNs) and. LGAs, are increasingly used in a variety. of products. QFNs, being a near chip-scale package,. have perimeter contacts on the package. bottom
  • | Electronics Industry News for EEs & Engineering Managers
    chip-scale package Intel set to complete purchase of DSP Communications Mattson Technology appoints two VPs Altera's Smith to retire in 2001 PRI records $5 million
  • | Electronics Industry News for EEs & Engineering Managers
    Applied Materials to add staff in Austin Scenix chairman dies from Beijing beating Tessera expands beyond BGA technology Remnants of VTC will become analog chip foundry MCT introduces test-handling system for chip-scale packages OnQ Technology opens backend packaging facility in Philippines Alcatel
  • Smart Computing Article - Laplink to latency
    for their separate inventions in 1959. ICs are used in a variety of devices and are categorized by the number of transistors or active circuits they hold. LSI refers to a package of 100 to 5,000 transistors on one single chip. With this advancement from SSI (small-scale integration), which held 30 or fewer
  • Medical Device Link .
    Reliability Qualification Testing of Chip-Scale IC Packages Miniature PCB-mounted components that passed tests for high-reliability portable applications provide an example of component qualification for medical electronics OEMs. New medical electronic products destined for wearable or portable
  • Medical Device Link .
    Chip-scale packaging is emerging as a desirable option for performance-driven small-form-factor medical devices. Among the many advanced electronics packaging forms introduced during the past few years, chip-scale packaging (CSP) has evolved as an increasingly suitable option for use
  • Medical Device Link . Advanced Electronic Packaging Techniques Enhance Function, Performance, and Portability
    , as device complexities increase and I/O counts escalate, leaded SMT packages are becoming larger, with lead pitches shrinking as low as 0.3 mm. As a result, alternative packaging and assembly technologies are gaining in prominence, particularly ball-grid arrays, chip-scale packages, chip-on-board

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