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  • The Basics of Circuit Board Soldering
    Since we have done quite a few product reviews lately, we have decided a basic "how-to " article would be an appropriate post. The following is a series of steps to take when practicing the art of basic circuit board soldering. First of all, you need to make sure you have all of the equipment
  • Easier circuit-board assembly
    Printed-circuit-board assembly begins and ends when PCBs are moved out of and into carriers called magazines. As they travel through the line, the boards may be unloaded and loaded several times before assembly is complete. But building and operating these assembly lines can be expensive. Faster
  • Honey, I shrunk the circuit board
    of the conventional circuit board. A recent example of this trend is a technique called 3D CSP (chip-scale processing). 3D CSP builds on older miniaturization techniques by folding the circuit substrate to save space. Electronic-circuit-miniaturization techniques have evolved over the years. One
  • Printed Circuit Board Emission Control
    One of the world's largest printed circuit board (PCB) manufacturers was required to install air pollution abatement equipment to control the VOCs emitted during their soldering and coating process. Three main considerations were important to the customer: * The need for a system with a competitive
  • High-Speed Circuit Board Signal Integrity
    High-Speed Circuit Board Signal Integrity. Filled with on-the-job-proven examples, this hands-on reference offers you the knowledge needed to quickly pinpoint transmission problems that can compromise your entire circuit design.
  • The Use of Ion Chromatography in the Printed Circuit Board Industry
    analytical techniques, can shed significant light on process problems or even worse, application failures. Ionic cleanliness is a crucial aspect in the production of a "reliable" printed circuit assembly (PCA). Small clearances and tight spaces are plentiful on the surface of a printed circuit board (PCB
  • Thermal Profiling Optimizes Printed Circuit Board Assembly
    in more sizes, from 01005s to 50mm2 BGAs, and are being used side-by-side on the same circuit board. This can lead to problems when assemblies are thermally profiled for reflow. Layout, component size, package styles and thermal mass of the selected devices add to the challenge. Thermal issues
  • M2031: Printed Circuit Board Design for LSM1 VCOs
    To achieve the best performance from M/A-COM's LSM1 VCO series, it is critical that good design practices are used in the layout of the printed circuit board. This application note describes the pad footprint recommended for solder attachment and some of the electrical and thermal considerations
  • X-rays spot circuit-board flaws
    connections underneath. But lower power is needed to view the printed-circuit-board traces and lead carriers. 3D laminography, also called scanned-beam laminography, uses a steered X-ray source and a moving detector to create artifacts in the background of a 256-shade grayscale image. The area
  • Dissolution of Printed Circuit Board Copper Barrel Plating Found with Multiple/Extended Exposure Thermal Stress Testing (.pdf)
    Up to a 0.0008" reduction in copper (Cu) barrel plating was found with multiple exposure thermal stress testing in accordance with IPC-TM-650, Method 2.6.8, modified. A typical original equipment manufacturer (OEM) specification for printed circuit board specimens specifies 3 or 6 thermal stress

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