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  • The Basics of Circuit Board Soldering
    Since we have done quite a few product reviews lately, we have decided a basic "how-to" article would be an appropriate post. The following is a series of steps to take when practicing the art of basic circuit board soldering. First of all, you need to make sure you have all of the equipment
  • Easier circuit-board assembly
    Printed-circuit-board assembly begins and ends when PCBs are moved out of and into carriers called magazines. As they travel through the line, the boards may be unloaded and loaded several times before assembly is complete. But building and operating these assembly lines can be expensive. Faster
  • Honey, I shrunk the circuit board
    of the conventional circuit board. A recent example of this trend is a technique called 3D CSP (chip-scale processing). 3D CSP builds on older miniaturization techniques by folding the circuit substrate to save space. Electronic-circuit-miniaturization techniques have evolved over the years. One
  • Printed Circuit Board Emission Control
    One of the world's largest printed circuit board (PCB) manufacturers was required to install air pollution abatement equipment to control the VOCs emitted during their soldering and coating process. Three main considerations were important to the customer: * The need for a system with a competitive
  • High-Speed Circuit Board Signal Integrity
    High-Speed Circuit Board Signal Integrity. Filled with on-the-job-proven examples, this hands-on reference offers you the knowledge needed to quickly pinpoint transmission problems that can compromise your entire circuit design.
  • Thermal Profiling Optimizes Printed Circuit Board Assembly
    in more sizes, from 01005s to 50mm2 BGAs, and are being used side-by-side on the same circuit board. This can lead to problems when assemblies are thermally profiled for reflow. Layout, component size, package styles and thermal mass of the selected devices add to the challenge. Thermal issues
  • X-rays spot circuit-board flaws
    connections underneath. But lower power is needed to view the printed-circuit-board traces and lead carriers. 3D laminography, also called scanned-beam laminography, uses a steered X-ray source and a moving detector to create artifacts in the background of a 256-shade grayscale image. The area
  • Circuit-board fasteners that won't let go
    and provide strong, reusable threads in metal sheets as thin as 0.019 in. Self-expanding fasteners sink knurled teeth into the board while a shank expands to ensure contact. No matter how sophisticated electronics get, circuit boards and other components must still be securely attached to their housings
  • Soldering 3 copper spacers to circuit board simultaneously
    A two-turn helical coil is used to heat 3 spacers at once. Power is supplied for 30 seconds to melt the solder preforms on the three spacers and create a solder joint without over-heating the board.
  • Printed Circuit Board Rinse Water Circulation
    Problem: The rinse water control was controlled by manually operating valves installed in the main and by-pass lines. Valve adjustments were required as the tank water level varied or the tank water was changed. If the operator incorrectly adjusted or sequenced the adjustment of the valves, the pump
  • Soldering 3 copper spacers to circuit board simultaneously [IH]
    A two-turn helical coil is used to heat 3 spacers at once. Power is supplied for 30 seconds to melt the solder preforms on the three spacers and create a solder joint without over-heating the board.
  • Heating an aluminum-backed circuit board to reflow solder [PFS]
    Given the significantly faster heating time, induction improves throughput in this process and is a more efficient heating method than hot plate heating...
  • Heating an aluminum-backed circuit board to reflow solder [IH]
    Given the significantly faster heating time, induction improves throughput in this process and is a more efficient heating method than hot plate heating...
  • Real-TimeVisualization and Prediction of Solder Paste Flow in the Circuit Board Print Operation
    Three studies are undertaken to understand the dependence of aperture fill and stencil release on solder paste print definition. The first study focuses on the role of pastes. Seven pastes are compared and ranked by release performance. Second, three stencil-forming techniques are compared. Chemical
  • Overview of XFdtd's Circuit Element Optimizer
    XFdtd 3D Electromagnetic Simulation Software analyzes antenna and matching circuit structures using the full wave Finite-Difference Time-Domain (FDTD) simulation method. XF's Circuit Element Optimizer utilizes full wave analysis to select the component values for a given printed circuit board (PCB

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