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  • The Use of Inhibitors for Chmical Cleaning of Industrial Equipment (.pdf)
    adducts, proper hydrophobic/hydrophilic balance, chelating. functionality, metal reactivity, molecular weight control, resulting in a system having outstanding. corrosion resistance in both strongly acidic cleaning solvents as well as alkaline EDTA and Citric acid. systems.7. Graph A demonstrates
  • Activated Water (.pdf)
    Chemical Usage. New processes for wet cleaning. semiconductor surfaces have. recently been developed. The new cleaning processes. are designed to be more. environmentally friendly. and reduce the volume of. chemicals used. One such process(1) has been. developed in Japan by Professor. Ohmi and his
  • Characterizing organic impurities in semiconductor-grade hydrogen peroxide
    As the semiconductor industry moves toward the 256-Mb chip generation with 0.15-um feature sizes on 300-mm wafers, wet chemical cleaning remains essential to the removal of particles and metallic and organic impurities from the wafer surface. Since semiconductor-grade hydrogen peroxide
  • MICRO: Wet Surface Technology
    such as vias, contacts, deep trenches, and poly-Si features, where water spots form easily at hydrophilic/hydrophobic interfaces. Spots that are large enough to overlap more than one die will result in a definite yield loss, and even smaller water spots can cause killer defects, high leakage currents
  • Reference Electrodes
    reference electrolyte, such as in laboratory style electrodes), or in a diffusion style liquid junction (with a gelled electrolyte). Teflon liquid junctions are prominently found in industrial application electrodes. When combined with a polymer gel reference electrolyte, the hydrophobic nature of teflon

Engineering Web Search: Cleaning Chemical Hydrophobic Top