Our Sites: GlobalSpec.com | GlobalSpec Electronics | CR4
Free Registration 
Welcome to GlobalSpec!
Find parts, products, suppliers, datasheets, and more for:

Cleaning Polishing Compound

 

Find Suppliers by Category

Abrasive compounds and abrasive slurries are used to improve surface finish or flatness. They often consist of fine abrasives in slurry, bar, powder or paste forms.
Search by Specification | Learn More

Products & Services

See also: Featured Products | Parts by Number | Technical Articles | Engineering Web Results

Parts by Number for Cleaning Polishing Compound Top

Partb # Distributor Manufacturer Product Category Description
5UKA4 Grainger Industrial Supply RAYTECH IND A DIV OF LYMAN PRODUCTS Tumbler Media Additives and Polish Liquid Cleaning Compound B, Size 1 gal., Flo-Thru Concentrate Cleans Media and Parts, For all Metals and Plastics, Non-Foaming Compound

Conduct Research Top

  • 9 Tips from OSHA to Help Reduce Silica Hazards
    Crystalline silica is a mineral compound made up of silicon and oxygen, the two most abundant elements on earth. It is commonly found in sand, stone, concrete, plastics, polishing compounds, filtering media and soil, among many other products. Although it is typically not hazardous as part
  • MICRO: Wet Surface Technologies
    rinse after the barrier polish to protect the copper surface while it is being transferred from the barrier polishing platen to the cleaning system. However, if the resulting BTA-copper complex is not removed effectively, high levels of organic residues can form on the copper. MICRO: Wet Surface
  • Coating helps P/M tooling beat the heat
    . It consists of a petrochemical wax combined with a polishing agent and other ingredients that promote polymer impregnation into the chrome. After thoroughly cleaning tool surfaces, the coating goes on as the tool sees a high-amperage charge. The charge helps promote good bond strength between
  • MICRO: Products
    The LuminaCu RL-CMP, a 300-mm system for copper planarization processes at the 90-nm technology node and below, is a single-wafer processing tool for polishing copper on soft ultra-low-k dielectrics. Combining a high-linear-velocity component that provides high polishing rates with a low-downforce
  • MICRO:Top 40 (Nov '00)
    independent polishing platens, cleaning capability, advanced metrology, and automation. The single tool accommodates simultaneous process development and production operation and supports hot-lot processing. It is designed to ease the transition among oxide, tungsten, shallow-trench isolation, and copper
  • MICRO:Top 40 (Nov '00)
    independent polishing platens, cleaning capability, advanced metrology, and automation. The single tool accommodates simultaneous process development and production operation and supports hot-lot processing. It is designed to ease the transition among oxide, tungsten, shallow-trench isolation, and copper
  • MICRO:Building Copperopolis (Jan '99)
    line structures on the wafer. Post-CMP Cleaning Issues Once the polishing process is complete, a post-CMP cleaning process must not only remove residual slurry particles but also trace levels of metal ions, which otherwise could significantly decrease product yield. As mentioned earlier, the metal
  • MICRO: Products
    . A monitoring device for chemical-mechanical planarization applications provides rapid insight into the pressures applied during the polishing process and supplies data directly to personal computers. The easy-to-use I-Scan system measures the tactile force and pressure applied by a polishing head

Engineering Web Search: Cleaning Polishing Compound Top