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Product Technology News
transport conveyor level and at the operator or tool-cluster working level in the bay. Local random-access buffering of cassettes and pods directly on the conveyor. MICRO:Archive:January 1997:Products. MICRO Advertiser and Product Information Buyers Guide. Chip Shots blog. Greatest Hits of 2005
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Case Study: Virginia Tech
The Liebert XD system provides focused high-capacity cooling for an innovative supercomputer cluster. Liebert Case Study - Virginia Tech. Emerson.com. Careers. Contact Us. ENGLISH (UNITED STATES) [Change]. Trellis. Solutions. Products. Service and Support. Brands. Partners. About Us. By Industry
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MICRO: Process Equipment Control - Kinkead (October 2000)
variation found that exposure to contaminant levels of 15 ppb caused a CD change of 6 nm/ min. Thus, an intratool 15-ppb concentration spike in an interfaced lithography cluster could lead to a postdevelop CD growth of 6 nm (assuming a throughput of 60 wafers/hr), which would consume 40%
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MICRO:Facility Automation, by Ken Van Antwerp (Oct '99)
in Figure 1, a cluster of six-shelf-high, single-deep racks placed side by side against a wall has the capacity to store approximately 200 WIP boxes. Lots are created in this area and then await dispatch to the appropriate process tool. To track this material using long-range IR technology requires only
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MICRO: Editor's Page (April 2001)
implanters, to windowed wet benches reminiscent of streetcars, to a prodigious cluster tool called by one engineer "an Endura on steroids.". DMOS 6 will be a fully automated, computer-integrated manufacturing (CIM) facility. Every wafer will be tracked on the CIM system, with the overhead transport
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Implementing PCI Express Interconnects in xTCA (.pdf)
latency and very low CPU utilization. ters with each cluster serving one particular set of I/O devices. such as sensors, scanners, or cameras. The blades have an. AMC bay supporting one or more AMC CPUs per cluster. Note,. that the CPU AMC used could be any one of many standard. x4 PCle (up
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INDUSTRY NEWS
Logic, will install the equipment at its fab in Orlando, FL. The P4400 uses vacuum pressure transfer technology to circulate slurry, says FSI. Expansion of the fab will make Cirent the largest chipmaker in Florida. Cirent was formed in October 1995. GaAs fab buys cluster tools Vitesse Semiconductor
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Case Study: HESS Corporation
infrastructure technology to support oil exploration and production. When the company first transitioned from mainframe to blade server technology for its most intense processing tasks, the raised floor system provided adequate but limited data center cooling. When HESS added a second blade server cluster