Products & Services
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Supplier: Teledyne DALSA
Description: thinning, high speed read rates, low defects and advanced packaging techniques. DALSA is able to offer both CCD and CMOS detectors. CCDs are ideal where ultra low noise is preferred and CMOS where low power and high data/frame rates are more important. Typical requirements in hyperspectral imaging
- Image Sensor Type: Color
- Array Type: Linear Array
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Description: 4 DIFFERENTIAL OUTPUT CHANNELS 2 SETS OF 4 DIFFERENTIAL INPUTS 90MHz BANDWIDTH UP TO 3.5VPP OUTPUT GAIN OF 190V/V (No External Load) LOW 0.65nV/√Hz INPUT NOISE VOLTAGE 50mA QUIESCENT CURRENT (5V Supply) LOW CROSSTALK, TQFP-48 PACKAGING TTL/CMOS CHANNEL SELECT LINE APPLICATIONS
- RoHS Compliant: Yes
- Package Type: Other
- On-Chip ESD Protection: Yes
- Single Supply: Yes
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Supplier: Vision Research
Description: The Phantom® Miro® eX4 has everything you need in a digital high-speed imaging system. Whether you are researching the flight of a bumble bee, troubleshooting the fill/seal step of your packaging process, analyzing a golf swing, or drop-testing mobile appliances, there is a Phantom Miro
- Imaging Technology / Camera Type: CMOS, Digital
- Camera Function: Video
- Monochrome / Color: Monochrome, Color
- Specialty Camera Type: High Speed
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Supplier: Microchip Technology, Inc.
Description: The RE46C141 is low power CMOS photoelectric type smoke detector IC. With minimal external components this circuit will provide all the required features for a photoelectric type smoke detector. The RE46C141 was designed for use in smoke detectors that comply with Underwriters Laboratory
- Detector Style: Smoke Detector IC
- Technology: Photoelectric
- Alarm Type: Audible Alarm
- Power: DC
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Description: ) Typical Application: Host-Controller to Display-Module Interface Pixel Clock Range of 4 MHz-30 MHz Failsafe on All CMOS Inputs Packaging: 80-Terminal, 5-mm × 5-mm µBGA®
- Technology: Other
- Device Type / Applications: Transmitter
- RoHS Compliant: Yes
- Supply Voltage: 1.8 V
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Supplier: Universe Kogaku (America) Inc.
Description: C-mount adapters and other accessories – including mounts – are also in stock to help you integrate our lenses with your system. Other value-added services include special coatings, custom apertures, custom packaging, and anti-vibration assembly techniques. Please call applications
- Lens Type: Spherical Lens
- Lens Application: Visible
- Antireflection Coating: Yes
- Mounted: Yes
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Supplier: Skyworks Solutions, Inc.
Description: The AX508 device integrates a full quad band GSM/GPRS power amplifier function on a single Integrated Circuit (IC) using advanced 0.13 μm silicon CMOS process technology. Key benefits of the AX508 include improved performance, relative to its AX502 product, equating to a longer talk time
- Amplifier Type: Power Amplifier
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Supplier: Valtronic
Description: , CCGA, PGA* down to 250 micron pitch Passive Discretes down to 01005 CMOS and wafer level camera assembly * Ball Grid Array (BGA), Chip Scale Packaging (CSP), Ceramic BGA, Ceramic Column BGA, Programmable Gate Array (PGA)
- Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
- Testing Services: Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn, Cabling
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CMOS Image Sensors
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Featured Products for Cmos Packaging Top
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BAE Systems Imaging Solutions formerly Fairchild Imaging
Next Generation Sequencing
each other and know what it takes to execute a successful design. Our highly experienced technicians are experts in the field of focal plane packaging and testing. They routinely perform die attach and wire bonding on a variety of sizes of CCDs, fiber-optic attach as well as cleaning of sensitive die surfaces. At the forefront of technology, our ultra-low noise CMOS (sCMOS) technology provides yet another imaging choice for our customers and their specific markets and applications... (read more)
Browse CMOS Cameras Datasheets for BAE Systems Imaging Solutions formerly Fairchild Imaging -
BAE Systems Imaging Solutions formerly Fairchild Imaging
Sensors for Security & Surveillance applications
algorithms. Low cost packaging for high volume, price sensitive applications. Supports snapshot mode operation for still capture imaging. The Fairchild Imaging sCMOS Sensors offered for Security and Surveillance applications are listed below. Sensors – Scientific CMOS (sCMOS). CIS 1910F. 1920x1080, 6.5um pixels, monochrome or color. CIS 2521F. 2560x2160, 6.5um pixels, monochrome or color. See our Scientific CMOS (sCMOS) Sensors page for more information on these products. About Us... (read more)
Browse CMOS Cameras Datasheets for BAE Systems Imaging Solutions formerly Fairchild Imaging -
Teledyne DALSA
New High Speed Piranha4 Camera Family
semiconductor, solar cell, flat panel display, electronics, automotive, medical, packaging and general manufacturing. For more information, please visit www.teledynedalsa.com/mv. About Teledyne DALSA, Inc. Teledyne DALSA, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digital... (read more)
Browse CMOS Cameras Datasheets for Teledyne DALSA -
BAE Systems Imaging Solutions formerly Fairchild Imaging
For Low Light Imaging Applications
to the manufacture of electronic focal planes and electronic imaging systems. All of our sensor design and prototype engineering are done in our facility while wafer fabrication and higher volume packaging are outsourced for production efficiency and for lower costs. Resident manufacturing processes are maintained for specialty products and include semiconductor wafer dicing, packaging, device butting, fiber-optic element attachment, X-ray scintillator attachment, hybridization, and custom... (read more)
Browse CMOS Image Sensors Datasheets for BAE Systems Imaging Solutions formerly Fairchild Imaging -
Teledyne DALSA
Falcon2 Cameras now available in Color
industries including semiconductor, solar cell, flat panel display, electronics, automotive, medical, packaging and general manufacturing. For more information, visit www.teledynedalsa.com/mv. . About Teledyne DALSA, Inc. Teledyne DALSA, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops... (read more)
Browse CMOS Cameras Datasheets for Teledyne DALSA -
ROHM Semiconductor, USA LLC
CMOS LDO Regulators with Automatic Power-Saving
ROHM Semiconductor has introduced a new series of CMOS LDO regulators featuring ROHM's proprietary automatic power-saving (APS) function that dynamically switches performance characteristics based on operating conditions. The BHxxPB1 Series combines the benefits of LDOs - small packaging, minimal external components and simple design process - with very low average power consumption. During high-speed operation, with operating current of 20 µA, the output voltage is regulated to ±1% over step... (read more)
Browse IC Linear Voltage Regulators Datasheets for ROHM Semiconductor, USA LLC -
BAE Systems Imaging Solutions formerly Fairchild Imaging
Sensors for extremely high-resolution solutions
it takes to execute a successful design. Our highly experienced technicians are experts in the field of focal plane packaging and testing. They routinely perform die attach and wire bonding on a variety of sizes of CCDs, fiber-optic attach as well as cleaning of sensitive die surfaces. At the forefront of technology, our ultra-low noise CMOS (sCMOS) technology provides yet another imaging choice for our customers and their specific markets and applications. This technology complements the existing... (read more)
Browse CMOS Image Sensors Datasheets for BAE Systems Imaging Solutions formerly Fairchild Imaging -
Teledyne DALSA
Genie TS Camera selected as Award Finalist
the performance and operational requirements of a wide range of applications in the semiconductor, electronics, food, packaging and manufacturing industries, as well as intelligent transportation system applications.". Test & Measurement World - 2012 Best in Test Awards. This year's awards honor companies that introduced a new product representing a significant advancement in the test, measurement and inspection field. The Genie TS was chosen as one of the Machine Vision & Inspection finalist... (read more)
Browse CMOS Cameras Datasheets for Teledyne DALSA -
BAE Systems Imaging Solutions formerly Fairchild Imaging
Quality imaging under extremely low light levels
and electronic imaging systems. All of our sensor design and prototype engineering are done in our facility while wafer fabrication and higher volume packaging are outsourced for production efficiency and for lower costs. Resident manufacturing processes are maintained for specialty products and include semiconductor wafer dicing, packaging, device butting, fiber-optic element attachment, X-ray scintillator attachment, hybridization, and custom filter deposition. Additionally, our electronic imaging... (read more)
Browse CMOS Image Sensors Datasheets for BAE Systems Imaging Solutions formerly Fairchild Imaging -
Teledyne DALSA
Genie™ TS series cameras speeds up to 300 fps
including semiconductor, electronics, food, packaging and other manufacturing and assembly processes. All features are easily accessible with Teledyne DALSA's advanced software tools. The Genie TS is also the first machine vision camera platform engineered for Intelligent Traffic/Transportation Systems (ITS) applications. Integrated performance and operational capabilities include remarkable dynamic range to optimize image capture from sun-to-shade, motorized lens control with image-to-image aperture... (read more)
Browse CMOS Cameras Datasheets for Teledyne DALSA
Conduct Research Top
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Enhanced Imager Chip Packaging for Automotive Applications (.pdf)
The development of an automotive qualified packaging technology for CMOS and CCD imager chips is described. A flip-chip-on-flex solution was developed. This package solution was demonstrated using a 1/3 inch optical format imager chip that was designed for use with conventional ceramic leadless
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Pin-Compatible CMOS Upgrades to Bipolar LDOs
Bipolar low dropout regulators (LDOs) have become common place in a variety of portable applications, such as cell phones, pagers and PDAs. Their popularity stems from small packaging, high output current capability and precision output voltage specifications. However, the bipolar process
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CMOS LDO Regulators for Portable Devices (.pdf)
ROHM CMOS LDO (low drop-out) regulators are tailored for use in portable devices such as PDAs, mobile phones, digital cameras and camcorders. Lower in cost and small in packaging, ROHM CMOS LDOs offer designers a superior alternative to PWM regulators in many point-of-load regulation applications
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Pilot Plant Partnerships
blockbuster for a few years. They often expect contract manufacturing organizations (CMOs) to provide chemistry, separations and packaging expertise. Full-scale CMOs follow FDA-sanctioned recipes to the letter and ask few questions. At one time, large drug makers took on contract work
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Using Microchip's Micropower LDOs
1 23-6, SOT-223, and MSOP-8 packaging require will bezero), the tolerance of V OUT minimal board space. Shutdown capability, thermal approximately that of V . REF protection, and current limiting are standard in every is a function of both the2. The tolerance of V device. Adjustable output, error
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MICRO:February 1998:Industry News:World Beat
Amkor Technology is taking orders for customer prototypes at its newly opened fab in Buchon, South Korea. The foundry is owned and operated by Amkor affiliate Anam Semiconductor and is the first fab for Amkor, which specializes in contract assembly and test services in semiconductor packaging
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
to turnaround its Silicon Valley chip-packaging services business. Race heats up to merge image processing, CMOS sensor ) The competition in CMOS image sensors has turned ferocious, pitting established giants such as Agilent Technologies Inc. against such smaller upstarts as IC Media Corp. Intel protects
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Weigh the Risks in Outsourcing Decisions
, researchers, and manufacturing capacity," says David Sovello, Ph.D., regulatory vice president at Cardinal Health (Dublin, Ohio). Therefore, such firms typically look for specialized expertise or one-off manufacturing or packaging services to fill in for overworked in-house groups. By contrast
Engineering Web Search: Cmos Packaging Top
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National Semiconductor SOIC WIDE Package Products
8-Bit CMOS ROM Microcontroller with 1k Memory, 64 RAM, Power On Reset (POR), and Very Small Packaging
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Microelectronics & Electronic Devices : Fujitsu Malaysia
Wafer Foundry Services - High-end CMOS technology, normal CMOS technology, CMOS high voltage, Liquid Crystal on Silicon (LCOS)
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Fujitsu to Feature Industry-Leading Process Technology,...
Fujitsu to Feature Industry-Leading Process Technology, Packaging Services in Booth 535 at Annual Fabless Semiconductor Association Conference
- Texas Instruments Bus Transceivers | Mouser
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Integration Packaging & Interconnection
CMOS (SI) Platform Meeting Minutes Documents Integration, Packaging & ... Meeting Minutes
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Cypress Semiconductor
Packaging Product Change Notices (PCN)
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Electronic Packaging « Electronics Cooling Magazine...
Tags: CMOS, Component Temperature, Electronic Packaging, PBGA, PCB, Thermal Performance
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Computer-related thermal packaging at the millenial divide...
Tags: Air Cooling, CMOS, Cold Plates, Heat Sink, Microelectronics, refrigeration, Thermal Management, Thermal Packaging
