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  • MICRO: Characterizing CMP
    A case study investigates how conditioning CMP pads with different diamond abrasives affects film removal rates, wafer-to-wafer nonuniformity, wafer defects, and pad lifetime. hemical-mechanical polishing (CMP) has enabled the production of advanced semiconductor devices by producing a globally
  • MICRO:Product News
    of elasticity, fracture behavior, and other mechanical properties to be calculated. An optional vacuum-mount system ensures that the wafer stays in good condition for additional tests. A CMP unit for 300-mm wafer processing features automatic process control, automatic wafer rework, low-stress dry-in
  • MICRO: Brave New Materials
    Edit Braunstein, Daniele Gilkes, Steven Lippy, Stephen Reid, and Ricky Adebanjo, Agere Systems A series of in-house experiments demonstrates that methods for reclaiming copper control wafers involving CMP or a universal chemistry can restore wafers to near-pristine condition. uring the development

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