CMP Dispersion

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• Recent Advances in Ceria-Based Slurries for STI and ILD CMP Applications (.pdf)
  of the CMP slurries exhibit consistent manufacturability,. excellent dispersion characteristics, long shelf life and produce low. defectivity. 1. INTRODUCTION. This paper describes the development of ceria-based CMP slurries used in two. process steps in the production of sub-90nm technology node...
• MICRO: green mfg
  demonstrated the feasibility of regenerating slurry.1,2 One study in particular showed that high-purity colloidal silica could be reclaimed because of its higher dispersion and lower tendency to clog than fumed silica.3 For these reasons, fumed silica slurry used in interlayer dielectric (ILD) CMP...
• MICRO: STI Process Control
  Ayelet Dag and Vladimir M. Rubinstein, Tevet Process Control Technologies; and Yitzhak Gilboa and Steven Hedayati, Cypress Semiconductor ontrolling oxide-layer thickness following chemical-mechanical polishing (CMP) is critical to die yield and device reliability. In addition to experiencing normal...
• MICRO: Tech Emergent
  of such materials is that they are mechanically weak and therefore do not withstand the stresses of postdeposition processing steps as well as silicon dioxide does. Problems are most likely to arise during chemical-mechanical polishing (CMP) of copper and during packaging of the finished chips. The materials' low...
• PRODUCT ALLSTARS
  Top 40 Product All-Stars for 1997, as selected by reader response. The products range from carriers to cleanroom window film, CMP tools to transducers. Congratulations to this year's winners! Wafer and substrate carriers can be molded from various PTFE or PTFM formulations and machined with slots...
• Low Defect Ceria-Based Slurries: Novel Selectivity, Slurry Characterization, and Polishing Mechanisms (.pdf)
  particle. 2. Extremely High Selectivity STI CMP Slurry. The low defect slurry for STI CMP shows extremely high oxide to nitride selectivity, low. dishing and exhibits excellent within wafer (WIW) and within die (WID) performance. Typical. blanket selectivities for this slurry platform exceeds 100:1.2...
• MICRO: Product Extra!
  , Booth 11722). Matec Applied Sciences has been granted a patent for its acoustic particle sizer, which simultaneously measures particle-size distribution, percent solids, acoustic attenuation and sound speed spectra, pH, temperature, and conductivity of various types of colloids, such as CMP...
• MICRO:Top 40 Product Allstars page 2 (Nov/Dec '98)
  of a diode-emitting energy in the infrared spectrum. As the turbine wheel rotates in response to the flow rate, electrical pulses are generated. The sensor can replace ball and glass tube flowmeters in applications in which an electrical signal proportional to flow rate is desirable. CMP Slurry...
• MICRO: Product Extras (June '2000)
  semiconductor fabs and OEMs, the graphite provided longer life, faster pump down speeds, and improved yields than other graphites. Information: http://www. egraph.com. New cleaners from J.T. Baker remove slurry particles and trace metals from substrates after CMP processing. The pCMP-800 and pCMP-850...
• MICRO: The 300-mm Imperative - Griessing (July 2000)
  and 0.0145 particles/cm2, respectively. For Class 1000 investigations, the air return in the CMP area was chosen, a location which normally varies between Class 1000 and 10,000 conditions. It should also be noted that particle sizes of 0.16 to 0.2 um were very close to the resolution limit of the particle...

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