CMP Polishing Compound

Conduct Research

• Using surfactants in iron-based CMP slurries to minimize residual particles
  During recent years, the use of chemical-mechanical planarization (CMP) to remove excess coating material from wafer surfaces has increased dramatically, as has the literature on CMP research. Basically, the CMP process involves polishing wafers using a slurry that combines a chemical component...
• MICRO: Wet Surface Technologies
  defect-removal mechanisms, the article also highlights the impact of various processes on copper-surface roughness and scratches. Most barrier slurries contain benzotriazole (BTA), which provides copper corrosion protection during and after the polishing process. In addition, some processes use a BTA...
• MICRO: The Hot Button
  ? Will future CMP tools minimize dishing and erosion adequately without damaging or degrading the mechanical strength and properties of porous low-k and ultra-low-k dielectric materials? Is electro-chemical-mechanical polishing (ECMP) a legitimate mainstream contender, and if so, when...
• MICRO: Products
  The LuminaCu RL-CMP, a 300-mm system for copper planarization processes at the 90-nm technology node and below, is a single-wafer processing tool for polishing copper on soft ultra-low-k dielectrics. Combining a high-linear-velocity component that provides high polishing rates with a low-downforce...
• MICRO:Top 40 (Nov '00)
  planarization (CMP) system combines rotational and orbital technologies, providing the stability of an advanced solid polishing platen with the flexibility of orbital system architecture. Designed for logic and ASIC applications, the Momentum dry-in/dry-out wafer processing system integrates four...
• MICRO:Top 40 (Nov '00)
  planarization (CMP) system combines rotational and orbital technologies, providing the stability of an advanced solid polishing platen with the flexibility of orbital system architecture. Designed for logic and ASIC applications, the Momentum dry-in/dry-out wafer processing system integrates four...
• TUCSON, AZ Have you ever wondered about the use of flex-tensional ejectors to deposit photoresist on a wafer, or about self-refreshing, "popping" chemical-mechanical polishing (CMP) pads? What about the role of supercritical CO ) in a variety of IC processes? Or the possibility of reducing waste...
• MICRO:Building Copperopolis (Jan '99)
  chemical-mechanical planarization (CMP) of dual-damascene copper structures therefore will require highly efficient removal of both the copper and barrier layers. But achieving this goal is a challenge because the barrier materials are typically more difficult than copper to planarize using standard polishing...
• MICRO: Products
  materials such as glass, quartz, sapphire, and silicon carbide. CMP Monitor. Tekscan. Boston, MA. A monitoring device for chemical-mechanical planarization applications provides rapid insight into the pressures applied during the polishing process and supplies data directly to personal computers...
• MICRO:Product Technology News (April '2000)
  slurries at the point of dispense for CMP tools. It features a gradient-density polypropylene media that removes wafer-damaging agglomerations and particles without adversely affecting the distribution of the polishing slurry. Capsules with absolute retention ratings of 0.45 70 um are available...

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