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Parts by Number for COB Top

Part # Distributor Manufacturer Product Category Description
COB3400011304 National Microchip Not Provided Not Provided Not Provided
COB1241 National Microchip AB Not Provided Not Provided
COB640 National Microchip ST Not Provided Not Provided
COB24BC PLC Radwell Mencom Not Provided 24 POL DIN RL CONN CARRIER
COB-L Straight Road Electronics, Inc. MENCOM CORPORATION Not Provided COB LVRS TO MATE TO ALUM HO
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Conduct Research Top

  • RFID Tag and COB Development Guide with Microchip's RFID Devices
    carrier. MCRF360 devices are made with silicon oxide. Their. frequency. The antenna is attached to the COB‘s two. tolerance is approximately less than 5% for the devices. external terminals by welding or soldering. Because. in the same wafer and within ~10% from different. most of the COBs are used
  • Medical Device Link .
    be attached with epoxy or solder and are suitable for hybrids or COB applications. Precision metal parts as small as 1 mm diam are produced using CNC machines. Many metals can. MPMN - October 2004 - Spotlight II. Skip to : [Content] [Navigation]. Medical Device Link. The Online Information Source
  • Honey, I shrunk the circuit board
    of the earliest methods was the Chip On Board (COB) technique. At the core of COB is the use of integrated circuits (ICs) in unpackaged form. After being sawed from completed IC wafers, the unpackaged integrated circuits are glued to a circuit-board substrate with the contact pads facing away from the substrate
  • Chip Scale Package (CSP)
    Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies
  • Medical Device Link . Advanced Electronic Packaging Techniques Enhance Function, Performance, and Portability
    difficult for COBs when used with multiple ICs having more than 200 pins each. A ball-grid array process implementation vehicle using a six-layer board. COB technology has not yet achieved widespread use, although the assembly processes and infrastructure are indeed mature in fact, the same basic
  • Medical Device Link .
    in space traditionally taken up by large packaging. Miniaturization is the result of adapted chip-on-board (COB) technology followed by chip-on-chip (COC) technology. These processes use a circuit board and fine wires to configure increasingly compact circuitry. COB and COC designs marked a noteworthy
  • Improving Ethanol Yield From Corn
    dating back more than 50 years. Recognizing the large amount of sugars in corn cobs and other agricultural residues, Dunning and Lathrop hydrolyzed hemicellulose with mild sulfuric acid treatments, forming a solution of mostly pentoses. But further costly processing, such as deacidifying and removing
  • what is grit blasting
    oxide. Silicon carbide. Plastic. Walnut shell. Corn cob. Baking soda. Ceramic grit. Copper slag. Media selection is a crucial decision in the engineering of abrasive blasting processes. The different media types have different hardness, shape, and density, and each is available in a wide range

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