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  • RFID Tag and COB Development Guide with Microchip's RFID Devices
    A passive RFID tag contains an RFID integrated circuit (IC), resonant capacitor (C), and antenna (L), as shown in Figure 1. The antenna and capacitor form a parallel LC resonant circuit. The LC circuit must be tuned to the reader?s carrier frequency for maximum performance (read range).
  • High Reliability LED Chip-on-Board Assemblies
    LED chip-on-board applications (COB) typically involve assembling an LED die stack directly on to a substrate such as Metal Core PCB (MCPCB), FR4 etc. This schematic is shown in Figure 1 and compared to a typical LED Package-on-Board stack.
  • Honey, I shrunk the circuit board
    of the earliest methods was the Chip On Board (COB) technique. At the core of COB is the use of integrated circuits (ICs) in unpackaged form. After being sawed from completed IC wafers, the unpackaged integrated circuits are glued to a circuit-board substrate with the contact pads facing away from the substrate
  • Chip Scale Package (CSP)
    Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies
  • Medical Device Link .
    be attached with epoxy or solder and are suitable for hybrids or COB applications. Precision metal parts as small as 1 mm diam are produced using CNC machines. Many metals can

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