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  • M567: CR-15 Packaging Handling and Mounting Procedures
    -cobalt leads. The finish consists of electrolytic gold over nickel plate. After component installation, the package is hermetically sealed using a ceramic lid and an 80/20 gold/tin eutectic solder. This bolt down style package provides a robust interface between a highly integrated GaAs MMIC device
  • U.S. Patents | August 2005 | A B T |
    ., Quick Cable Corp. U.S. 6,902,587 (20050607), Method for manufacturing electrode plate group for prismatic battery, Jun Matsumura and Kohei Suzuki, Matsushita Electric Industrial Co., Ltd. (JP) and Toyota Jidosha Kabushiki Kaisha (JP). U.S. 6,902,588 (20050607), Manufacturing method of metal hydride
  • Metrigraphics Article in Today's Medical Developments
    more precision than stamping, but it can only go down to about the 75µm or 100µm range.". So, the next option is electroforming. Electroforming is somewhat a subset of electrochemical deposition; it is a typical cathode electrolyte system. "An automobile manufacturer will plate bumpers

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