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  • Bonding Dissimilar CTE Materials
    When bonding materials that have different Coefficient of Thermal Expansions (CTE), there are several factors that have to be addressed to ensure long term adhesive joint integrity. Matching the CTE values of each substrate as closely as possible will make life easier but this may not be possible
  • Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
    Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other assembly operations. These epoxies are used for a variety of different applications such as encapsulation
  • Thermal-Mechanical Decoupling by a Thermal Interface Material
    -. decoupling -- The PCB and aluminum. mechanical decoupling. heat sink have different Coefficients of. Technology Enabling Innovation. 1. Revision Date: 12/12/2005. SILICONE TECHNOLOGIES DIVISION. 1100 Governor Lea Road, Bear, DE 19701. (302) 834-2100 (302) 834-4021 (Fax). Thermal Expansion (CTE). During
  • Silicone Rubber Thermal Interface Materials: Applications and Performance Considerations
    shear modulus allow for the decoupling of stress. t. i. v 1.0. induced by differences in the coefficient of thermal. uc 0.8. expansion (CTE) at a minimum of thickness [6]. 1.53. 1.60. nd 0.6. 1.09. 1.00. 0.4. a. l Co. 0.2. e. r. m. 0.0. Th. Arlon A. Competitor. Arlon B. Competitor. A. B. Figure 2
  • Medical Device Link .
    , UV-cured adhesives were believed to have limitations, when compared with heat-cured adhesives, such as shadowing effects, CTE mismatch, and shrinkage on cure. With the development of new UV curing systems and improved adhesive formulations (e.g., delay-cure adhesives), many of these issues have been
  • Using Thermally Conductive Materials
    generating sources (such as power supplies and power ICs) to heat sinks • Better thermal cycle and thermal shock resistance due to the high filler loading usually employed • Lower Coefficient of Thermal Expansion (CTE) for improved performance with dissimilar materials due to the high filler loading
  • PTFE And Hybrid Multilayer Bonding And Fabrication
    of the PTFE material for the RF signal layer(s). Taconic TLC and TLE materials were specifically designed for multilayer applications. Their combination of low loss (<0.003 @ 10 GHz) and low coefficient of thermal expansion (CTE) in the Z-axis (50-70 ppm/ºC 25- 250°C) make them well suited to 4-10 layer
  • Medical Device Link .
    , creates stress between dissimilar substrates that comprise the chip package. This stress is created by mismatches in each material 's coefficient of thermal expansion (CTE). Silicones have high CTE values (200 to 500 parts per million per degrees Celcius), but their low modulus ( <350 megapascals

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