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  • Bonding Dissimilar CTE Materials
    When bonding materials that have different Coefficient of Thermal Expansions (CTE), there are several factors that have to be addressed to ensure long term adhesive joint integrity. Matching the CTE values of each substrate as closely as possible will make life easier but this may not be possible
  • Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
    Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other assembly operations. These epoxies are used for a variety of different applications such as encapsulation
  • Using Thermally Conductive Materials
    generating sources (such as power supplies and power ICs) to heat sinks • Better thermal cycle and thermal shock resistance due to the high filler loading usually employed • Lower Coefficient of Thermal Expansion (CTE) for improved performance with dissimilar materials due to the high filler loading

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