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Compound Packaging
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Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Supplier: DME CompanyDescription: SuperNova™ No Ammonia Vapor No Powder Residue No Problem for Operators If excessive downtime due to changeovers and contamination is your problem, SuperNova™ purging compound is your answer. No product performs better on color or material changes. And with regular use
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Supplier: Milliken & CompanyDescription: resistance. ClearTint allows manufacturers to enjoy polypropylene's sustainability benefits while still seeing good processing (non-warping) in their product. Applications ClearTint is applied in a variety of products, from typical FMCG transparent polypropylene packaging to a broad range of indoor
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Supplier: BioAmber, Inc.Description: razors, toothbrushes, diaper pants, bibs Cosmetics/Medical: Bottles, tubes, caps, other packaging Electronics and Business Equipment Automotive Components
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Supplier: Saint-Gobain Plastic Films and TapesDescription: of its two components, as well as improvements in productivity and reduced cost. Higher productivity -- Fewer wrinkles during lamination and precise alignment of the two layers facilitate faster, trouble-free fabrication. Lower cost -- Reduced packaging and shipping costs improve
- Material Type / Grade: Thermoplastic
- Industry: Energy Conversion (Battery/Fuel Cell/PV), Other
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Supplier: Ellsworth AdhesivesDescription: x
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Semiconductors / IC Packaging
- Polymer / Chemical Type: Acrylic / Polyacrylate
- Filler Material: Unfilled
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Supplier: Quist ElectronicsDescription: Acts as thermal interface between a heat sink and an electronic device
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
- Industry: Electronics
- Filled / Reinforced: Yes
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Epoxy TechnologyDescription: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK® 320 for increased electrical insulation. It is also more viscous and thixotropic. Can be used
- Compound Type: Optical Grade / Material
- Material Form: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Optoelectronics / Photonics, Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Aremco Products, Inc.Description: Exceptional mechanical and thermal properties
- Substrate / Material Compatibility: Ceramic / Glass, Metal
- Industry: Electronics, OEM / Industrial, Semiconductors / IC Packaging
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
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Supplier: Master Bond, Inc.Description: Master Bond Polymer System EP3ANHT is a new superior and cost effective epoxy resin system for electrical potting, encapsulation and bonding which combines high physical strength properties, remarkable abrasion, thermal shock and heat resistance, thermal conductivity, inertness to water and
- Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
- Material Form: Conformal Coating, Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Epoxies Etc...Description: 50-2370 is a new thermally conductive polyurethane potting compound. This system is designed for low stress on sensitive components during and after cure. It is formulated for applications requiring low exotherm, low shrinkage, excellent electrical properties and a rapid 5 minute gel time.
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Substrate / Material Compatibility: Composites, Metal, Plastic
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Features: Filled, Flame Retardant (e.g. UL 94 Rated)
Featured Products for Compound Packaging Top
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Plastics Color Corporation (PCC), headquartered in Calumet City, Illinois, is a global provider of custom polymer compounds, solutions, colorants, and additive masterbatches in an extensive range of markets; from pharmaceuticals packaging to medical devices to consumer packaging to sporting goods and many more. (read more)Browse Resins and Compounds Datasheets for Plastics Color Corporation -
Plastics Color Corporation (PCC), headquartered in Calumet City, Illinois, is a global provider of custom polymer compounds, solutions, colorants, and additive masterbatches in an extensive range of markets; from pharmaceuticals packaging to medical devices to consumer packaging to sporting goods and many more. (read more)Browse Molding Compounds and Resins Datasheets for Plastics Color Corporation
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Epoxies, Etc. has engineered a new series of polyurethane Potting, Encapsulating, & Casting compounds. There are four products in this low durometer series ranging from an Enter-able Gel to a Shore A 80. For ease of use, all of the products were formulated for packaging in the convenient TriggerBond dual barrel cartridge system. These elastomeric systems are suitable for a variety of electronic insulating applications. They are low in viscosity, low in toxicity, and have convenient mix... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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to bottom of containers. Cured surface has air bubbles. Only packaged in difficult to use bulky containers. Due to fillers and mix ratio difficult to use in Meter Mix Machines. 20-3001 NC. Low viscosity, 1,000 cps. 1:1 by volume ratio. No fillers. Smooth glass like finish. Available in TriggerBond cartridges and bulk packaging. Simple and less expensive Meter Mix Machines may be used. This product was developed after listening to the complaints of design and manufacturing engineers... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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PCC is working diligently in this highly technical and sophisticated industry to develop and produce engineering-grade materials for medical devices, consumables and medical packaging. Our understanding of FDA requirements and the capabilities of our clean compounding facilities in North Carolina and Southern California ensure products that are free from contamination and can be manufactured in any lot size. (read more)Browse Molding Compounds and Resins Datasheets for Plastics Color Corporation
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properties for their particular need. Compounding companies fine tune and tailor specific resins for desired end use needs. For example, the commodity resins benefit from the multiple uses they serve through the additives, processing and specific packages they contain through compounding. Polyethylene without slip and antiblock would never allow a film to be used at high speeds in packaging lines. Custom compounds are the life blood of compounding companies where making materials for new uses... (read more)Browse Thermoplastics and Thermoplastic Materials Datasheets for 3M Energy and Advanced Materials Division
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The overwhelming critical need in producing plastic containers and other packaging for the pharmaceutical and nutraceutical markets is cleanliness and elimination of any possible contamination. Plastics Color is a leader in the development and production of colorants and additives for this market. In 2007 we introduced our Plant Within A Plant segregated manufacturing facility contained within our Asheboro, North Carolina campus. It was a resounding success and the industry took notice. From... (read more)Browse Resins and Compounds Datasheets for Plastics Color Corporation
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When the job has been completed, the entire package is disposed of: no clean up or physical contact with the resin. Cost savings are achieved by reducing labor and material waste. Reliability is increased with accurate compound ratios, complete mixing and proper application techniques. Three types of kits are available: Barrier, Injection and Barrier/Injection types. Barrier Type. For compounds with a volumetric ratio greater than 10 parts per 100. The catalyst and base are separated... (read more)Browse Syringes and Needles Datasheets for Techcon Systems, Inc.
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Chemfilm® DF1100 is a multilayer cast PTFE film, fully fused, with one surface modified to render it receptive to many conventional adhesives, elastomers, resins and potting compounds. The surface treatment was developed to assure that its application over pure PTFE would not degrade or discolor the basic film. After surface treatment, the PTFE film loses none of its excellent physical and electrical characteristics, except that the surface treatment results in a natural color which does... (read more)Browse Plastic Sheet and Plastic Film Datasheets for Saint-Gobain Plastic Films and Tapes
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to improve its characteristics. SBS prevents the asphalt from softening in the summer, when the temperature of the applied material may exceed 150°F. EVA prevents the cracking that occurs when the material contracts during the winter months. Precise ratio control of these additives is achieved by using a Max meter in both batch-blending operations and as part of an on-the-fly blending and packaging operation. Max's line of helical rotor meters, the Model 241, 242 & 243 are the key to tight recipe... (read more)Browse Flow Meters Datasheets for Max Machinery, Inc.
Parts by Number for Compound Packaging Top
| Partb # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| DL524P1 | Global Equipment Company, Inc. | BOX PACKAGING INC | Labels | 4 X 4 3 / 4 "Compounds, Cleaning Liquids" |
| DL512P1 | Global Equipment Company, Inc. | BOX PACKAGING INC | Labels | 4 X 4 3 / 4 "Compounds Cleaning Liquids" |
| 33011631 | Amazon | ICON | Automotive Parts and Accessories | ICON COMPOUND MESH SHORT GLOVES (SMALL) (BLACK) |
| 10D829 | Grainger Industrial Supply | JET-LUBE, INC. | Anti-Seize Compounds | Anti Seize Compound, High Purity Nickel, Size 1/4 lb., Temp. Range -65 to 2600 F, Flash Point (F) Greater Than 430, Nickel Based, Threaded Connections, Package Quantity 24 |
| 10D818 | Grainger Industrial Supply | JET-LUBE, INC. | Anti-Seize Compounds | Anti Seize Compound, Copper/Graphite, Size 1/2 lb., Temp. Range -65 to 1800 F, Flash Point (F) Greater Than 450, Copper Based, Threaded Connections, Package Quantity 12 |
Conduct Research Top
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The Right Compound
Parts. Nitrile Parts. SBR Parts. Silicone Parts. Thermoplastics. Capabilities. Capabilities. Die Cutting. Dual Durometers. FEA. Flocking. Logistics. Mold Details. Packaging. Slip Coating. Splicing. Adhesive Systems. Technical Info. Technical Info. Choosing An Adhesive. Choosing A Material. Color
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Can Packaging Materials Foil RFID Success?
By Paul Thomas, Managing Editor If there s anything that s well understood about how drug packaging materials impact the success of RFID applications, it is that nothing is well understood. Some materials, such as metal foils, can compromise signal strength and significantly reduce the read-rate
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Plastic Packaging and the Effects of Surface Mount Soldering Techniques
profile is provided as a reference. later. Moisture sensitivity of plastic packages has been a. concern for semiconductor manufacturers. Moisture. The electronics industry has moved to smaller and. can and will permeate any molding compound. The. thinner surface mount packaging in the progress. rate
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Packaging Equipment Manufacturer Finds Better Way to Bust Dust (.pdf)
With more than 3,000 processing and packaging machines in operation throughout the world, an established Minneapolis-based packaging manufacturer is well-known for the reliability of it's machines in the pharmaceutical, nutraceutical and related industries. In fact, some machines have been running
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Metal Based Wafer Bonding Techniques for Wafer Level Packaging (.pdf)
packaging operations. A primary differentiator is the via size and therefore the placement accuracy needed to obtain production yields. Meanwhile gold and aluminum diffusion bonding and numerous eutectic alloys are replacing traditional MEMS glass based bonding methods and allow for higher degrees
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Air-Handling With Care Compound Exposure Limit Short-Term Exposure Limit OSHA Standard
Excellence & Lean Six Sigma. Packaging. Process Operations. Quality Assurance Control. Unit Operations. Career Center. Solution Providers. Hamilton Company. Rapid Micro Biosystems. Thermo Scientific. OpEd. From the Editor. PharmaView. Digital Insights. Therapeutic Dose. Community. Login. On Pharma Blog
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Medical Device Link . Identifying and Preventing Contamination from Pharmaceutical Packaging
in serious allergic reactions. This article presents several case studies in which elastomeric components were found to have a negative influence on the performance of pharmaceutical packaging and/or drug formulations. The forensic methods used to identify the root cause of these problems and the corrective
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Medical Device Link . Packaging Technology for Miniature IVD Instrumentation
that MEMS will become a $14-billion industry, in part because of its expected impact on analytical instrumentation. THE CHALLENGE OF MEMS PACKAGING MEMS are produced using the microfabrication techniques pioneered by the integrated circuit (IC) manufacturing industry. These fabrication processes enable
Engineering Web Search: Compound Packaging Top
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AeroShell Products Packaging | Shell Aviation
AeroShell Products Packaging Safety Data Sheets for AeroShell Products AeroShell Products Packaging The full range of product packaging
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LM5112 - Tiny 7A MOSFET Gate Driver
Packaging Tools Reliability Videos Features Compound CMOS and bipolar outputs reduce output current variation
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Xerox Packaging Printing - Custom Label Printing Solution -...
Packaging Printing The digital packaging industry is expected to have a compound annual growth rate of 15.7% between 2009 and 2014.
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Sandia MEMS Home Page
design, fabrication technologies for silicon and compound semiconductor devices, advanced packaging technologies, reliability, failure analysis and
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Polyethylene - Wikipedia, the free encyclopedia
is approximately 80 million metric tons.[1 Its primary use is within packaging (plastic bag, plastic films, geomembranes, etc.). Many kinds of
- Carbon monoxide - Wikipedia, the free encyclopedia
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Productivity Transfer Propels Further Growth of China...
companies have also supplied to other packaging materials segments including bonding wire, molding compound, leadframes, and other materials.
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Growing Packaging Materials Market under Pressure | SEMI.ORG
Growing Packaging Materials Market under Pressure Growing Packaging Materials Market under Pressure
