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  • Description: Abstract A unique system focus that presents specific solutions for specific appliances This publication presents state-of-the-art power management techniques for modern electronic appliances that rely on such very large-scale integration (VLSI) chips as CPUs and DSPs. The author thoroughly covers

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  • Description: These are isolated type DC/DC converters, which require only few external devices to achieve switching power supplies.Best matching to drivers of micro-computers, relays and LEDs.

    • IC Package Type: Other
    • Output Voltage (Volt): 12 volts
    • Input Voltage (VIN): 4.5 to 5.5 volts
    • Output Current (IOUT): 0.2500 amps

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  • Description: These are AC/DC converters for obtaining DC output from commercial power supplies without transformer. They realize simple switching power supplies with few external devices, suitable for driving micro-computers and LEDs .

    • IC Package Type: Other
    • Input Voltage (VIN): 113 to 170 volts
    • Output Current (IOUT): 1 amps

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  • Description: With PREMA you have the opportunity to design your ASIC yourself. The data can be exchanged via the GDSII format. Components libraries are available in this format and also PREMA´s mask shop proceeds GDSII data. Features 32-bit power of Windows XP/NT - workstation performance on a PC Switch

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  • Supplier: Sensirion AG

    Description: signal processing circuitry on a single CMOS silicon chip. The sensor signal is converted into a fully calibrated and temperature compensated digital signal directly on the chip. The new mass flow controllers feature both analog and digital interfaces. Furthermore, they enable new optional features

    • Number of Control Outputs: 1 outputs
    • Controller Inputs: Serial / Digital Input
    • Control Signal Output: Serial / Digital
    • Control Technique: Limit / Set Point Control

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  • Description: and 0201 package types Chip Scale Package (CSP) BGA and uBGA double-sided/mirrored BGA assembly COB and MCM Direct and multiple chip attach High pin count press fit Gold and aluminum wedge-bonding Wire-bonding Flex Circuits Wave solder Selective soldering Aqueous cleaning

    • Services: Computer Aided Design (CAD) / Solid Modeling, Design / Development, Just-in-Time Delivery, Kitting, Low Volume Production, High Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing / Stocking
    • Capabilities: Ceramic Manufacturing, Electrical and Electromechanical Assembly, Electronic Manufacturing, Mechanical Assembly
    • Industry Served: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Energy / Utility, Food / Beverage, Industrial / Commercial, Instruments / Sensors, Marine, Material Handling, Medical / Health Care, Military / Defense, Pharmaceutical / Biotech, Telecommunications
    • Location: North America, United States Only, Northeast US Only

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  • Description: Lines. · Dual Wave, Wave Soldering machine. · Fine Pitch QFP to .02" (0.5mm). · BGA to .01" (0.3mm). · Chip components 0201. · PCB size 1.18"-20" (30-510mm). · Mixed technology assembly. · Mechanical and box build assembly. Testing · MDA (Bed of Nails using HP3065 & HP3070). · Full

    • Services: Computer Aided Design (CAD) / Solid Modeling, Computer Aided Machining (CAM), Just-in-Time Delivery, Kitting, Low Volume Production, High Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing
    • Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Extrusion, Mechanical Assembly, Molding, Plastic Fabrication, Sheet Metal Fabrication
    • Industry Served: Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Instruments / Sensors, Telecommunications
    • Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only

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  • Description: to 3.6 V Low power, 1 µA (standby < 0.15 µA) Pb-free & RoHS-compatible No external components (Internal oscillator) TYPICAL USES Mobile altimeter / barometer systems Bike computers Adventure or multi-mode watches Variometers Dataloggers MS5611-01BA01 With LCP Cap Datasheet

    • Sensor Grade / Operating Range: Automotive, Consumer
    • Package Type / Mounting: Surface Mount (SMD)
    • Input (Supply) Voltage: -0.3000 to 4 volts
    • Operating Temperature: -40 to 185 F

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  • Supplier: Cir-Q-Tek

    Description: to worldwide customers is essentially guaranteed. Think of us as your global partner for reliable EMS solutions. OUR SERVICES INCLUDE: SMT Through-hole PCB assembly Chip on board Relay and CAR-CD mechanism RoHS compliant "lead-free" assembly Cir-Q-Tek invests in state of the art machinery

    • Services: Computer Aided Machining (CAM), Design / Development, Just-in-Time Delivery, Kitting, Low Volume Production, High Volume Production, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing / Stocking
    • Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Extrusion, Machining, Mechanical Assembly, Metal Casting, Plastic Fabrication, Sheet Metal Fabrication, Stamping, Welding and Fabrication
    • Industry Served: Aerospace / Avionics, Automotive, Electronics / Semiconductors, Industrial / Commercial, Instruments / Sensors, Marine, Telecommunications
    • Location: North America, Europe Only

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Conduct Research Top

  • Coming to a computer near you: Magnetic Memory
    demonstrated a 256-kbit magnetic RAM. The chip had a read/write cycle time of 35 nsec and consumed 24 mW at 3V. Motorola believes such chips may one day replace all existing semiconductor memories. Some day soon, we may have trouble explaining to our kids the concept of a computer booting up. Just
  • Computer Power User Article - What's Happening
    Intel recently demonstrated a Pentium 4 processor that runs at 3.5GHz, almost double the speed of the fastest chip currently available, as well as a so-called Hyper-Threading chip. While the first chip's 3.5GHz speed is noteworthy, Intel has played down that hype and claims the Pentium 4 will scale
  • Computer Power User Article - Under Development
    ( ) proved nanotubes could outperform silicon. In traditional silicon and metal chip technology, individual wires are subject to many resistive forces that interfere with electron movement, thus requiring more power and generating more heat. Because nanotubes are so thin, interfering forces can't bump
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    of week's chip news, Aug. 27-31 No quick industry fixes emerge at Intel Developer Forum SAN JOSE -- At last year's Intel Developer Forum (IDF), the personal computer community and Intel Corp. were in high spirits amid strong growth in the worldwide computer and semiconductor markets. Intel develops
  • MICRO: 'Round the Circuit
    Fast IC uses light beams Bypassing the use of metal wires, researchers at Johns Hopkins University have created an extremely fast semiconductor incorporating fiber-optic technology. The team of researchers in the Department of Electrical and Computer Engineering has combined silicon and thin slices
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Micron enters chip set market, in major strategy shift Intel's Willamette MPU to infiltrate midrange PC market Rambus availability, yields could dictate Intel chip performance Intel's Willamette MPU to infiltrate midrange PC market Semiconductor Alert! for May 1-5 Silterra to outsource photomask
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    TSMC executive proposes standardizing design rules The extreme cost and complexity of next-generation semiconductor designs will force chip makers to standardize their manufacturing processes, in some cases turning rivals into collaborators, according to one foundry executive. Semiconductor Alert
  • Smart Computing Article - Laplink to latency
    of IC (integrated circuit). An IC is considered a building block of computer hardware, combining a number of miniaturized transistors, resistors, and their connecting wires onto one single chip to perform a particular function or series of functions. ICs were revolutionary in that they decreased

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  • Events
    The structures in the Submikron region find also the BesonderesInteressediirfte fact daB uber the semiconductor chips in computers are read equally, e.g., fur like iiber such with several meters dimension in the aviation technique.
  • Technique turns computer chip defects into an advantage
    The technique, which they describe in the journal Science, involves rearranging the holes left by missing atoms to tune the properties of dopants ? the chemical impurities that give the semiconductors in computer chips their special properties.
  • Applied Spectroscopy and the Science of Nanomaterials
    Graphene combines both semiconductor and metal properties and hence offers prospects as a replacement for the currently used semiconductors in computer chips .
  • Experimental measurements and theoretical calculations of the atomic structure of materials with subangstrom resolution and picometer precision
    ’’ Different types of materials are required for different applications, such as steel in cars, polymers in clothing, semiconductors in computer chips , and catalysts in envi- ronmental protection.
  • Scanning Electron Microscope, A valuable NDT Method
    In today's world of semiconductor chips in computers as well as the literally thousands of other integrated circuit chips that find their way into our everyday lives: in the house, in the automobile, cell phones, in all of our never-ending …
  • Plastics
    … chain conductor polymers served PBI with heterocyclic modules many years as Kleb- and impregnating resin of printed for carrier circuits in the microelectronics and as strahlungsvernetzender photoresist-lacquer for printed circuits on semiconductor chips of the computer technique that can mechanically …
  • Plastics
    … chain conductor polymers served PBI with heterocyclic modules many years as Kleb- and impregnating resin of printed for carrier circuits in the microelectronics and as strahlungsvernetzender photoresist-lacquer for printed circuits on semiconductor chips of the computer technique that can mechanically …
  • Management of Technology and Operations
    Even though much of our modem production technology at the end of the 20th century is anchored deeply in relatively recently developed scientific research in computers and semiconductor chips , the story of technology goes way back to ancient civilization.