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  • Description: No Description Provided

    • Substrate / Material Compatibility: Concrete / Masonry, Metal, Plastic, Porous Surfaces
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: true
    • Features: Leveling / Filling Compound

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  • Description: No Description Provided

    • Substrate / Material Compatibility: Concrete / Masonry, Metal, Plastic, Porous Surfaces
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: true
    • Features: Leveling / Filling Compound

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  • Description: Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: true

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  • Description: Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity is required. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease), Electrical Insulation / Dielectric Material, EMI / RFI Shielding Material, Encapsulanting / Potting, Flexible / Dampening

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  • Description: No Description Provided

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Porous Surfaces, Wood / Wood Product
    • Chemical / Polymer System Type: Epoxy (EP)
    • Industry: OEM / Industrial, Building / Construction

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  • Description: Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one to one mix ratio. Upon curing the EP21TDCHT offers high shear and peel strength which

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
    • Filled / Reinforced: true

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  • Description: and unexcelled resistance to boiling water exposures as well as to many other aggressive chemicals. It is a prime candidate for premium clear decorative wood and metal coatings, maintenance finishes, linings for metal, concrete, cement, fiberglass, composites and plastics, tanks, drums, pipes

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Other
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Electrical Insulation / Dielectric Material

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  • Description: EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
    • Filled / Reinforced: true

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  • Description: Master Bond Polymer System represents a truly remarkable technical advance in the field of electrical insulation materials offering the first easily processable one component semi-solid epoxy resin based compound with high flexibility, outstanding electrical insulation and mechanical properties at

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease), Electrical Insulation / Dielectric Material, EMI / RFI Shielding Material, Encapsulanting / Potting, Flexible / Dampening

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  • Description: Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
    • Filled / Reinforced: true

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  • Description: well suited for filament windings as well as bonding to glass, graphite and Kevlar fibers. Systems based on EP34CA exhibit good retention of mechanical properties at elevated temperatures. The cured adhesive meets the requirements of military specification MMM-A-132. EP34CA can be used up to

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Porous Surfaces, Other
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease), Electrical Insulation / Dielectric Material, EMI / RFI Shielding Material, Encapsulanting / Potting, Flexible / Dampening

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  • Description: called EP21TPFL-1ND are also available. EP21TPFL-1 is a superior nonhazardous alternative to traditional Mil Spec type polysulfide adhesives, sealants and coatings, which have long been specified in applications as demanding as fuel tank sealants and potting and sealing compounds for

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP), Polysulfide
    • Features: Encapsulanting / Potting, Flexible / Dampening, Laminating / Composites

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  • Description: Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease), Electrical Insulation / Dielectric Material, EMI / RFI Shielding Material, Flexible / Dampening
    • Industry: Electronics, Electrical Power / HV, OEM / Industrial, Photonics / Optoelectronics, Semiconductors / IC Packaging, Tooling / Mold Material

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  • Description: Master Bond Polymer System EP30-3 is a two component, low viscosity, epoxy resin system featuring optical clarity, high physical strength properties, outstanding chemical resistance and superior high temperature properties. Excellent mechanical strength characteristics and remarkably high heat

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Thermal Insulation / Heat Insulating, Electrical Insulation / Dielectric Material, Encapsulanting / Potting, Flexible / Dampening, Laminating / Composites, Non-corrosive Cure

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  • Description: Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
    • Filled / Reinforced: true

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  • Description: ELASTOSIL® E50 is a flowable silicone rubber with good mechanical properties, which cures at room temperature under the influence of atmospheric moisture. Special features acetic acid-curing system flowable solventless excellent primerless adhesion to many substrates Application Allround

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Paper / Paperboard, Plastic, Porous Surfaces, Rubber / Elastomer, Textiles / Fabrics, Wood / Wood Product
    • Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
    • Industry: OEM / Industrial
    • Viscosity: 50000 cps

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  • Description: ELASTOSIL® E41 is a flowable, one-component silicone rubber with very good mechanical properties, which cures at room temperature under the influence of atmospheric moisture. Special features acetic acid-curing system flowable contains toluene as a solvent excellent primerless adhesion to

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Paper / Paperboard, Plastic, Porous Surfaces, Rubber / Elastomer, Textiles / Fabrics, Wood / Wood Product
    • Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
    • Industry: OEM / Industrial
    • Viscosity: 65000 cps

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  • Description: ELASTOSIL® E47 is a non-slump one-component silicone rubber, which cures at room temperature under the influence of atmospheric moisture. Special features acetic acid-curing system non-slump excellent primerless adhesion to many substrates excellent adhesion to silicones accelerated

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Paper / Paperboard, Plastic, Porous Surfaces, Rubber / Elastomer, Textiles / Fabrics, Wood / Wood Product
    • Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
    • Industry: OEM / Industrial
    • Tensile Strength (Break): 653 psi

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  • Description: HYPERKOTE™ Sprayable Polyurethane Systems are high performance, protective coatings that can be used in virtually every industry sector. HYPERKOTE Polyurethane performs well on many substrates for use as high performance industrial maintenance applications and concrete. Some typical

    • Substrate / Material Compatibility: Concrete / Masonry
    • Chemical / Polymer System Type: Polyurethane (PU, PUR)
    • Industry: Building / Construction

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  • Description: Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Other
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: true

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  • Description: No Description Provided

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Paper / Paperboard, Porous Surfaces
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Encapsulanting / Potting

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  • Description: " This item can not be exported outside the United States"

    • Substrate / Material Compatibility: Concrete / Masonry, Metal, Plastic, Porous Surfaces
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: true
    • Features: Leveling / Filling Compound

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  • Description: " This item can not be exported outside the United States"

    • Substrate / Material Compatibility: Concrete / Masonry, Metal, Plastic, Porous Surfaces
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: true
    • Features: Leveling / Filling Compound

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  • Description: Hernon® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Porous Surfaces, Wood / Wood Product
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Thermal Insulation / Heat Insulating, Electrical Insulation / Dielectric Material, Laminating / Composites, Non-corrosive Cure, Phase Change

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  • Description: 3M™ Scotch-Weld™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M™ Scotch-Weld™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent

    • Substrate / Material Compatibility: Concrete / Masonry, Metal, Plastic, Wood / Wood Product
    • Chemical / Polymer System Type: Epoxy (EP)
    • Industry: Aerospace, OEM / Industrial
    • Viscosity: 6000 to 1.00E6 cps

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  • Description: Epoxies, Etc... has formulated its adhesives to bond a wide range of substrates such as glass, metal, plastic, and wood. We have also designed these materials to accommodate a large variety of production processes including, fast setting 5 minute room tem

    • Substrate / Material Compatibility: Concrete / Masonry, Metal, Porous Surfaces
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: true
    • Industry: OEM / Industrial, Building / Construction

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  • Description: 10-3508 is a steel filled repair and filling epoxy compound. This non-sag formulation will not drip on vertical surfaces and provides outstanding adhesion to metals, wood, concrete, glass and plastics.

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Plastic, Wood / Wood Product
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: true
    • Industry: OEM / Industrial, Building / Construction

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  • Description: 10-3033 is a room temperature curing, two component, epoxy. This system meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. When properly cured, these products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections

    • Substrate / Material Compatibility: Concrete / Masonry, Paper / Paperboard, Plastic, Rubber / Elastomer
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Industry: Medical / Food (Sanitary / FDA), OEM / Industrial

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  • Description: Tuffbond epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil.

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting, Laminating / Composites, Non-corrosive Cure, Phase Change

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  • Description: Tuffbond epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil.

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting, Laminating / Composites, Non-corrosive Cure, Phase Change

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  • Description: These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Plastic, Rubber / Elastomer, Textiles / Fabrics, Wood / Wood Product
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Electrical Insulation / Dielectric Material

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  • Description: Tuffbond epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil.

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Thermal Compound / Interface (Thermally Conductive), Thermal Insulation / Heat Insulating, Electrical Insulation / Dielectric Material, Encapsulanting / Potting, Laminating / Composites, Non-corrosive Cure, Phase Change

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  • Description: in the field. Applications include concrete repair and may be used in concrete, hollow block, brick, clay and stone. Perfect for vertical, horizontal, overhead and screen applications.

    • Substrate / Material Compatibility: Concrete / Masonry, Metal, Wood / Wood Product
    • Chemical / Polymer System Type: Epoxy (EP)
    • Industry: Building / Construction

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  • Description: , which cures when exposed to moisture in the air. Gap filling is excellent with these systems. Silastomer® adhesives are 100% silicone compounds and are excellent for weatherproofing. They offer excellent resistance to moisture, temperature extremes, vibration, weathering effects, ozone,

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Plastic
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Silicone, Specialty / Other
    • Features: Thermal Compound / Interface (Thermally Conductive), Thermal Insulation / Heat Insulating, Electrical Insulation / Dielectric Material, Non-corrosive Cure, Phase Change

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  • Description: HERNON® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Paper / Paperboard, Plastic, Porous Surfaces, Textiles / Fabrics, Wood / Wood Product, Other
    • Dissimilar Substrates: true
    • Chemical / Polymer System Type: Acrylic / Polyacrylate
    • Features: Thermal Compound / Interface (Thermally Conductive), Thermal Insulation / Heat Insulating, Electrical Insulation / Dielectric Material, Flexible / Dampening, Non-corrosive Cure, Phase Change

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