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Supplier: Quist Electronics
Description: High bond strength with long term exposure to heat and high humidity
- Compound Type: Thermally Conductive
- Material Form: Die Bonding Adhesive / Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Industry Applications: OEM / Industrial, Other
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Supplier: Master Bond, Inc.
Description: used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries wherever electrically conductive bonds must be achieved quickly. It is suggested that Master Bond EP51N be mixed in small quantities because of its fast gelling properties
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
- Industry: Automotive, Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging, Building / Construction
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
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Description: adhesives loaded with thermally conductive ceramic fillers. Pressure is needed to form a bond. Heat and pressure may be needed on some substrates to achieve an acceptable bond. • The specialized acrylic chemistry of these tapes provide for good thermal stability of the base polymer. &bull
- Industry: Electronics
- Features: UL Approved
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Composition: Filled
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Compound EP45HTN is a two component electrically conductive epoxy compound for high pertormance structural bonding, and casting suitable for applications where long term exposure to temperatures from -60° to +500°F is required. lt is 100% reactive and does not contain
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product, Other
- Dissimilar Substrates: Yes
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging, Building / Construction, Other
- Chemical / Polymer System Type: Epoxy (EP)
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Description: Covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place.
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Supplier: Quist Electronics
Description: Maintains structural bond in severe-environment applications
- Compound Type: Thermally Conductive
- Material Form: Die Bonding Adhesive / Compound
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Howard Computers
Description: Thermal Conductive Grease for Heatsink creates a thermal bond between CPU and heatsink for maximum cooling capacity.
- Compound Type: Thermally Conductive
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Supplier: Quist Electronics
Description: Provides a mechanical bond, eliminating the need for fasteners or screws
- Industry: Electronics, OEM / Industrial, Other
- Cure Type / Technology: Contact / Pressure Sensitive (PSA)
- Features: Electrical Insulation / Dielectric Material, Flame Retardant (e.g. UL 94 Rated), Thermal Compound / Interface (Thermally Conductive), UL Approved
- Chemical / Polymer System Type: Polyamide, Acrylic / Polyacrylate
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Supplier: SAE International
Description: This specification covers an electrically-conductive adhesive supplied as two components, a paste of silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid. This adhesive has been used typically for providing an electrically-conductive bond between surfaces
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Supplier: item America, LLC
Description: Wall Profiles and Lid Profiles can be secured in position by means of Self-Tapping Screw St 4.2x9.5. The Support Profiles must be provided with a bore ⌀ 3.5 mm in the marking groove for this purpose. The screw connection creates a conductive bond between the conduit elements.
- Material: Aluminum
- Units of Measure: Metric Size
- Features: Rigid Conduit
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Description: Anisotropic Conductive Film (ACF) Adhesive 5363 is a heat-bondable, electrically condutive adhesive film. Used to bond a flexible printed circuit to another flexible printed circuit or a printed circuit board.
- Features: Electrically Conductive
- Type: Electronics (PCB, Semiconductor)
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Supplier: Master Bond, Inc.
Description: Master Bond X-5TC is an aluminum oxide filled, thermally conductive elastomer-based, one component adhesive for high performance bonding and sealing. This thermally conductive adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Rubber Based / Elastomeric: Yes
- Composition: Unfilled, Filled
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Supplier: Protavic America, Inc.
Description: Opaque UV material for use in die attachand other high-reliability applications. This material is unique in that it can be pre-activated with UV light and will dark cure after assembly. It offers low viscosity for thin bond lines and high shear strength.
- Use: Die Bonding Adhesive / Compound, Gap Filling Compound
- Form: Liquid
- Chemical / Polymer System Type: Specialty / Other
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
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Description: Resists thermal stress Meets conductivity requirements of NFPA 99/ASTM F150 Excellent bond strength RECOMMENDED USAGE CoroBond™ Conductive Vinyl Ester Primer is used in immersion or atmospheric exposure as a conductive primer for polyester and vinyl ester tank lining and secondary
- Substrate / Material Compatibility: Concrete / Masonry, Metal
- Chemical / Polymer System Type: Vinyl, Specialty / Other, Epoxy (EP), Polyester / Vinyl Ester
- Solvent Based (Volatile Organic): Yes
- Cure Type / Technology: Air Setting / Film Drying, Thermosetting / Crosslinking, Single Component System
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Supplier: Hi-Tech Seals, Inc.
Description: preparation and bond well to dirty and oily surfaces. Other acrylic features include the ability to bond a wide range of materials, excellent gap fills and fast fixturing times. HERNON® offers two families of acrylic adhesives: the ReAct® bonding systems, and the Dissipator® thermally conductive
- Material Type: Grease / Paste
- Industry: Electronics
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Cure Type / Technology: Two Component System
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Supplier: Newson Gale Inc.
Description: The Earth-Rite FIBC system monitors the resistance of Type C FIBC bags ensuring that the conductive elements of the bag are capable of dissipating static charges in compliance with Cenelec CLC/TR: 50404. The FIBC system can be setup to ensure that operators ground the bag before operations
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Supplier: Sauereisen, Inc.
Description: Sauereisen Insa-Lute Adhesive Cement No. 1 is specified throughout the automotive, appliance and assembly industries for bonding, insulating, and encapsulating applications. A thermally conductive and electrically insulating cement paste, the material bonds well to metal, ceramics and glass. Upon
- Substrate / Material Compatibility: Ceramic / Glass, Metal
- Industry: Automotive, OEM / Industrial, Other
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Water Based / Latex Dispersion: Yes
Find Suppliers by Category Top
Featured Products for Conductive Bond Top
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Master Bond, Inc.
Medical Grade Electrically Conductive Epoxy
Master Bond has introduced a highly conductive epoxy adhesive which meets USP Class VI specifications for medical applications. The high performance, two component epoxy EP21TDCS Medical, is silver filled to achieve an exceptionally low volume resistivity. Yet, adhesive properties, including high peel strength and superior epoxy toughness, have not been compromised. EP21TDCS Medical is a silver filled, electrically conductive epoxy adhesive that is FDA approved as a medical device adhesive... (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
Quist Electronics
Bergquist (Thermal Conductive) Gap Filler 2000
Gap Filler 2000 is a high performance, thermally conductive, liquid gap filling material supplied as a two-component, room or elevated temperature curing system.The material provides a balance of cured material properties and good compression set (memory).The result is a soft, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease.After cure, it won't pump from... (read more)
Browse Conductive Compounds Datasheets for Quist Electronics -
Master Bond, Inc.
Looking for An Electrically Conductive Adhesive?
Master Bond Polymer System EP79 is a novel, cost effective, silver coated nickel filled epoxy featuring exceptionally low electrical resistance. Volume resistivity is less than 0.04 ohm-cm at room temperature. EP79 has a convenient 1:1 mix ratio and cures readily at room temperature or more rapidly at elevated temperatures. When cured, it forms strong, tough bonds with high shear and peel strengths. These high strength bonds are resistant to severe thermal cycling as well as mechanical shock... (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Can-Do National Tape
3M RITE-LOK™
part, silver-filled epoxy designed to produce electrically conductive bonds. • Good adhesion to a variety of substrates. • Ideal for making and repairing electrical and electronic connections... (read more)
Browse Industrial Adhesives Datasheets for Can-Do National Tape -
Quist Electronics
Bergquist Liqui-Bond SA 1000
Features and Benefits. High thermal performance. Eliminates need for mechanical fasteners. Low viscosity for ease of screening or stenciling. Can achieve a very thin bond line. Mechanical and chemical stability. Maintains structural bond in severe-environment applications. Heat cure. Liqui-Bond SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond SA 1000 features a high thermal performance and maintains it's structure even... (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics -
Quist Electronics
Bergquist Sil Pad 1500T Thermally Conductive
Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates. Sil Pad 1500T. Thermal impedance: 0.23°C-in²/W (@50 psi). Inherent surface tack on both sides. Pad is re-positionable. Excellent thermal performance... (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
Conduct Research Top
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Thermally Conductive Adhesives Keep Things Cool
are an important. weapon in the war against heat raging within. today's powerful electronic devices. Master Bond Inc. 154 Hobart Street, Hackensack, NJ 07601 USA. Phone +1.201.343.8983 | Fax +1.201.343.2132 | WhitePaper@masterbond.com. T E C H S P O T L I G H T. Thermally Conductive. Adhesives Keep Things Cool
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Ground Bond or Ground Continuity Testing (.pdf)
ground conductor. Why is this important? The earth ground. conductor is tied directly to the chassis of a Class I product (a product with a metallic or. other conductive enclosure) in order to direct any fault current back to ground in case of. an insulation failure. Determining that there is continuity
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Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
This paper presents a case history of a failure analysis performed on a die bond adhesion failures. Silicone contamination caused intermittent adhesive failures at the die back metallization/conductive epoxy interface. The source of the silicone contamination was identified as the adhesive film
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Electrostatic Terminology, Technical Standards & Glossary
The process of connecting two or more conductive objects together by means of a conductor so that they are at the same electrical potential, but not necessarily at the same potential as the earth. The process of bonding one or more conductive objects to the ground, so that all objects are at zero
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Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications (.pdf)
. moderate concentrations. They will yield lower. alumina. 30. viscosity adhesives, resulting in thinner. boron nitride. 600. adhesive bond-lines. Silver, alumina, and boron. nitride fillers are used most commonly while. organics. copper is avoided. conductive epoxy. 5. Some formulations exist
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An Advanced Steering Wheel Sensor
A steering wheel sensor combining thick film conductive plastic and a. novel optoelectronics technology outputs both analog and digital data. for use by the General Motors StabiliTRAK system. Sensors - February 2000 - An Advanced Steering Wheel Sensor. An Advanced Steering Wheel Sensor A steering
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Tin Vs. Bare
to oxidize the materials properties (conductive, tensile, thermal, etc.) will begin to change. As we said above, if the metal is thick enough and it just has a little surface rust, it will maintain its structural integrity. But we aren't talking about structural integrity when it comes to passing
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Managing Heat Transfer With Potting Compounds
and thermal expansion and more security and protection of intellectual property. A. thermally conductive adhesive will provide a permanent bond between a power supply or IC. and a heat sink. The selection of the appropriate thermally conductive potting solution involves many factors: · Temperature range
Engineering Web Search: Conductive Bond Top
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MasterBond.com | Adhesives, Sealants & Coatings
Electrically Conductive Graphite Filled Adhesives Thermally Conductive Other Properties Biocompatible
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Master Bond Thermally Conductive Compounds
Master Bond Inc. offers a wide range of thermally conductive, electrically insulative systems which offer effective solutions to demanding heat
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Conductive Adhesives, Cho Bond, Chomerics
Conductive Adhesives CHO-BOND Conductive Adhesives
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GE Silicones, RTV Silicone, Momentive, 3M Tapes
Conductive Adhesives CHO-BOND Conductive Adhesives
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Master Bond, Inc. Conductive Compounds Data Sheets
GlobalSpec Electronics > Datasheets > Conductive Compounds > Master Bond, Inc. Master Bond, Inc. Data Sheets for Conductive Compounds
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Master Bond, Inc. Epoxy Adhesives Data Sheets
Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a
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Aremco-Bond 860 Thermally Conductive Epoxy Now Available |...
Aremco-Bond 860 Thermally Conductive Epoxy Now Available
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Aremco-Bond 614 Electrically Conductive Adhesive Now Available...
Aremco-Bond 614 Electrically Conductive Adhesive Now Available