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Conductive Die Bonder
-related products, suppliers, datasheets and CAD.|
Product Announcements
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Epoxies Etc... 
TAICA Corporation (formerly Geltec Co., Ltd.) 
Sanchem, Inc. 
Device Technologies, Inc.
Quist Electronics
Sanchem, Inc. |
Products/Services for Conductive Die Bonder
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Conductive Compounds - (156 companies)...gap fill, melt flow index (MFI), and water absorption. Melt flow index (MFI) is the output flow occurring in a 10-minute period through a standard die while a fixed pressure is applied via a piston to a 190 C melt. Mechanical properties... Search by Specification | Learn More -
Thermal Compounds and Thermal Interface Materials - (147 companies)...or particulates. Adhesives and die bonding compounds are thermal compounds and thermal interface materials that are used to join components. Typically, adhesives require a clean surface. Grease and oil compounds seal joints, openings, and fittings. Vacuum... Search by Specification | Learn More -
Electrical and Electronic Resins - (451 companies)...properties. Physical properties include viscosity, gap fill, melt flow index (MFI), and water absorption. Melt flow index (MFI) is the output flow occurring in a 10-minute period through a standard die while a fixed pressure is applied via a piston... Search by Specification | Learn More -
Encapsulants and Potting Compounds - (221 companies)...or spaces between two surfaces to be bonded or sealed. Glob top or daub-type compounds are used to insulate semiconductor dies or other electronic components on printed circuit boards (PCB) without encapsulating the entire assembly. Low viscosity resins... Search by Specification | Learn More -
Die Sets - (48 companies)...without incurring higher levels of heat and friction, and provide operators with a relatively easy way to separate the upper and lower dies shoes. Die sets include components called heel blocks, heel plates, screws, dowels and keys. Heel blocks are made... Learn More -
Die Cutters and Die Cutting Machines - (136 companies)...and full head machines are used for more demanding applications. Rotary die cutters or roller press die cutters are used in the high-speed conversion of web and sheet materials. These machines press roller-shaped cutting dies against a web. As the roller... Search by Specification | Learn More
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Die Cutting Services - (624 companies)How to Select Die Cutting Services. Image Credit: Can-Do National Tape. Die cutting services use a variety of die cutting methods to fashion materials into predefined shapes or sizes. Die cutting is a process used to shear and cut materials using... Search by Specification | Learn More
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Threading Dies - (248 companies)Threading dies are used to form or cut male threads on the outside of rod or bars. Threading dies are used to form or cut a male thread on the outside of rod or bars. Threading dies provide precision in cutting and extend the life of a die... Learn More
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Mold and Die Change Equipment - (47 companies)Die change equipment and mold change equipment is used to quickly remove or change molds and/or dies. This equipment includes all aspects related to the transportation, alignment and changing of a die or mold. Mold change equipment and die change... Learn More
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Wire Drawing Dies - (27 companies)...dies, TC wire drawing dies, and enameling wire drawing dies. Standard wire drawing dies have a well-defined reduction angle that reduces drawing force and provides uniform die-formation with a consistent surface finish. PCD wire drawing dies use... Learn More
Product News for Conductive Die Bonder
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Epoxy Technology
New Electrically Conductive AdhesiveEPO-TEK ED1021 is a newly developed silver-filled, one component adhesive that achieves good thermal conductivity while curing at lower temperatures (125°C). It also has a very low modulus (while maintaining strong die shear strength) which reduces stress on large die and sensitive parts. ED1021 has a low modulus of 25,850 psi along with a long pot life (3 months). DATA SHEET (read more)Browse Conductive Compounds Datasheets for Epoxy Technology -
Device Technologies, Inc.
Conductive Cushion Gasket EMI Shieldingselection of conductive foam, conductive fabric and a conductive pressure sensitive adhesive tape. The foam is plated with either Copper/Nickel or Silver and remains very flexible while providing excellent shielding effectiveness. ( >70dB). Conductive pressure sensitive adhesive eases installation on an infinite number of substrates. Conductive foam cushions can be easily die cut, kiss cut etc. to whatever the end application requires. Applications. EMI shielding for all electronics including... (read more)Browse Conductive Compounds Datasheets for Device Technologies, Inc. -
Ferro Corporation
Conductive PastesFerro produces a wide variety of silver pastes and special products for automotive glass applications, including heating grids and antennas. Furthermore, Ferro, as a producer of enamels, frits and pigments, is in a position to also provide customers with. suitably formulated ceramic based materials, such as glass enamels which are compatible to our conductive coatings range. Ferro's Customer Service group will be pleased to discuss your requirements and recommend suitable products. tailored... (read more)Browse Conductive Compounds Datasheets for Ferro Corporation -
Blueridge Films, Inc. (BFI)
Conductive FilmsVolume conductive films meet electrical requirements of MIL-P-82646A made from a single layer of carbon-loaded polyethylene. Available in bags, tubing, sheeting. For packaging of static sensitive components, chemical and powder explosives. Conductivity does not depend on humidity. It is non-sloughing, does not contaminate components it comes in contact with despite repeated use, and is groundable. Blueridge Films, Inc. (BFI) is a manufacturer of custom and stock high quality plastic films... (read more) -
Quist Electronics
Gap Pad Thermally Conductive Gap Filling MaterialsGap Pad VO is a cost-effective, thermally conductive interface material.The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling.The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis. Note: Resultant thickness is defined as the final gap thickness of the application. Features and Benefits. Thermal conductivity: 0.8 W/m-K. Enhanced puncture, shear... (read more)Browse Conductive Compounds Datasheets for Quist Electronics -
Quist Electronics
Thermally Conductive, Liquid Gap Filler - BerquistGap Filler 1000 is a thermally conductive, liquid gap filling material. It is supplied as a twocomponent, room or elevated temperature curing system.The material is formulated to provide a balance of cured material properties highlighted by a low modulus and good compression set (memory).The result is a soft, thermally conductive, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, Gap Filler 1000... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics -
TAICA Corporation (formerly Geltec Co., Ltd.)
Silokinon (Siloxane free) thermal conductive sheetNew product : Silokinon series.] *Characteristic performance. -Siloxane free products. -Excellent electric insulation. -Custom die-cut service is available. *Successful and Possibility Application of Silokinon. -Automobile / Hybrid car, LED for TV / Lightning, Mobile / Touch panel PC, Optical transceiver, Automobile / Hybrid car, Mobile phone, Mobile Game, Digital Camera, Router, e.t.c … Silokinon adhere to rough surfaces and drive out all air gaps. we, Taica are R &D oriented... (read more)Browse Electrical Insulation and Dielectric Materials Datasheets for TAICA Corporation (formerly Geltec Co., Ltd.) -
Quist Electronics
Sil Pad Thermally Conductive Insulator - BergquistSil-Pad 400 is a composite of silicone rubber and fiberglass.The material is flame retardant and is specially formulated for use as a thermally conductive insulator.The primary use for Sil-Pad 400 is to electrically isolate power sources from heat sinks. Sil-Pad 400 has excellent mechanical and physical characteristics. Surfaces are pliable and allow complete surface contact with excellent heat dissipation. Sil-Pad 400 actually improves its thermal resistance with age. The reinforcing... (read more)Browse Conductive Compounds Datasheets for Quist Electronics -
Quist Electronics
Bergquist (Thermal Conductive) Gap Filler 2000Gap Filler 2000 is a high performance, thermally conductive, liquid gap filling material supplied as a two-component, room or elevated temperature curing system.The material provides a balance of cured material properties and good compression set (memory).The result is a soft, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease.After cure, it won't pump from... (read more)Browse Conductive Compounds Datasheets for Quist Electronics -
Quist Electronics
Bergquist Gap Pad HC1000 Thermal Conductive Fillreinforced for puncture, shear and tear resistance. Typical Applications Include: Computer and peripherals. Telecommunications. Heat interfaces to frames, chassis, or other heat spreading devices. RDRAM ™ memory modules / chip scale packages. CDROM / DVD cooling. Areas where irregular surfaces need to make a thermal interface to a heat sink. DDR SDRAM memory modules. FBDIMM modules. Configurations Available: Sheet form, die-cut parts, and roll form (converted or unconverted). Data Sheet... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
Conduct Research
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Visible LEDs Application Notes
located at the center. It is mounted to the top of the cathode lead frame with solder or conductive paste to apply voltage. (For GaAlAs and InGaAIP, it is mounted to the top of the anode lead frame.) A fine Au wire in diameter of 25 to 30 um is routed between the LEDs chip and anode lead and bonded...
Engineering Web Search: Conductive Die Bonder
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Assembly of a prototype flip-chip-on-glass liquid crystal... ICs anisotropically conductive adhesive die attach system reliability tests glass panels large area panel flip chip bonder Journal articles provided |
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Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs)... Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection |
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Simultaneous Chip-Join and Underfill Assembly Technology for... Die Test die were used with different bump metal material. |
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Untitled side of a carrier to form top portions of a lead array and a die attach surface of a die attach pad, wherein the lead array includes at least one |
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ETH - FIRST - List of FIRST-Equipment Wafer Bonder Wafer Scribers Wetbenches Wire Bonder XRD Chemicals Processes and Processing |
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Current and reliable Bonding Machines news stories IConnPS High Performance Wire Bonder features Auto BITS, programmable focus optics for complex stacked die packages, and advanced looping processes. |
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Soldering Tech Papers on die bonder | White Papers | Indium... die attach (2) die bonder (2) dip transfer (1) See Indium Corporation Profile & Catalog |
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HYBOND, Inc. - Die Bonders Model EDB-140B Epoxy Die Bonder The EDB-140B Semi-automatic Epoxy Die Bonder can See Hybond, Inc. Information |
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TOSHIBA MICROWAVE POWER GaAs FET APPLICATION NOTES Recommended... 2. A heater stage for die attaching, a wire bonder, tweezers and the operators should be grounded to avoid damage due to electrostatic discharge. See Toshiba America Electronic Components, Inc. Information |
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Semiconductor Equipment Corporation - Articles - Gearing up... On the other hand, just by the nature of the dipping process, less conductive adhesive ends up on the contact surface. Dipping also requires more See Semiconductor Equipment Corporation Information |
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