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Description: 3M™ Electrically Conductive Acrylic Pads (eCAP), 7830N Series, provide a good electrical conductive path for EMI shielding and grounding in electronic devices. eCAP is a conductive fabric laminate coated on one side with an acrylic adhesive which contains aligned conductive filler, providing
- Compound Type: Electrically Conductive
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Chemical / Polymer System Type: Acrylic / Polyacrylate
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Supplier: 3M Industrial Adhesives and Tapes
Description: This lengendary family of 3M™ VHB™ Tapes is a proven performer in harsh environments and in extreme applications. 3M has documented performance in extensive applications.
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Supplier: Digi-Key Corporation
Description: INSULATOR MICA .860X.520" .115"
- Material Type: Pad
- Compound Type: Thermally Conductive
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Supplier: Quist Electronics
Description: Supplied on a reinforcing mesh for added electrical isolation
- Material Form: Composite, Gap Filling Sealant / Gasket
- Features: Electronics / Semiconductors, UL Approved
- Material Type: Gap Filling Compound
- Industry: Electronics, OEM / Industrial, Other
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Supplier: RS Electronics
Description: Thermal interface material designed for use will all three phase panel mount SSR's (53TP/53RV). Excellent alternative to thermal grease. Features - Color: White; Thickness: .003; Adhesive: No.
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Supplier: Hassel Material Handling Co.
Description: Design your own customized stock-picking cart. Start with the basic cart, choose the casters, and add the options that meet your specific needs. Or, choose one of the combination carts we have pre-built for you. All-welded, 12-gauge steel construction. Shelves include 2"D lips. Ergonomic handle
- Type: Hand / Appliance Truck
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Supplier: Howard Computers
Description: Heat is the enemy of your processor. If you have used a traditional heatsink paste for your CPU installations, you know that it is messy and difficult to apply. An uneven application can reduce the effectiveness of your heatsink and raise the operating temperature of your processor, increasing the
- Compound Type: Thermally Conductive
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Supplier: Epoxy Technology
Description: Product Description: EPO-TEK® H81 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid micro-electronic and semiconductor packaging. EPO-TEK® H81 Advantages & Application Notes: Gold filled epoxy allows for anti-oxidation
- Compound Type: Electrically Conductive
- Material Form: Grease / Paste
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Description: 3M™ Thermally Conductive Interface Pad 5589H is a thermally conductive acrylic elastomer based interface pad. It has very high thermal conductivity, good electrical insulation properties and is ideally suited for applications that require non-silicone properties. 2.0 W/mK
- Material Type: Pad
- Form: Film / Sheet, Pad
- Substrate / Material Compatibility: Metal
- Industry: Electronics
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Supplier: PENCOM
Description: For heat sinks/spreaders in virtually any commercially available material
- Features: Thermally Conductive
- Industry: Electronics
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Supplier: Quist Electronics
Description: Polyester based, for application requiring non-silicone conformal coatings
- Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors, Electrical Power / HV
- Coating Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Industry Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Automotive, OEM / Industrial
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Supplier: Ellsworth Adhesives
Description: Fiberglass-reinforced, cost-competitive and thermally conductive soft gel pad. This flame retardant and electrically insulating pad provides shock absorption and easy handling, with moderate tackiness on one side.
- Industry: OEM / Industrial
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Supplier: Seal Science, Inc.
Description: environment, at the rate you require. We stock many sizes and can manufacture vacuum cups of almost any size and dimension. Our range of elastomeric compounds allows us to choose a vacuum cup that will meet your conductive and dissipative specifications, ESD needs, or low tack and non marking
- Vacuum Pad Type: Ring
- Material: Polyurethane, Silicone, Vinyl, Other
- Vacuum Porting: Top Port
- Connection: Threaded
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Supplier: Quist Electronics
Description: Thermally conductive insulation for clip-mounted plastic power packages
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
- Industry: Electronics, OEM / Industrial, Semiconductors / IC Packaging, Other
- Chemical / Polymer System Type: Silicone
- Features: Thermal / Heat Conductive, UL Approved, Electrically Insulating / Dielectric, Flame Retardant (e.g. UL 94 Rated)
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Supplier: Newark / element14
Description: CONDUCTIVE COATING, TUBE, 2G; Coating Type:Conductive; Series:CaiKote 44; Coating Applications:Keyboard Buttons / Membrane Pads / Silver & Carbon Based Surfaces; Dispensing Method:Tube; Weight:2g
- Form: Paste / Mastic
- Industry: Electronics
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Supplier: Digi-Key Corporation
Description: THERMAL PAD TO-220 .009" SP600
- Material Type: Pad
- Compound Type: Thermal Compound / Heat Conductive
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
Find Suppliers by Category Top
Featured Products for Conductive Pad Top
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Quist Electronics
Sil Pad Thermally Conductive Insulator - Bergquist
Sil-Pad 400 is a composite of silicone rubber and fiberglass.The material is flame retardant and is specially formulated for use as a thermally conductive insulator.The primary use for Sil-Pad 400 is to electrically isolate power sources from heat sinks. Sil-Pad 400 has excellent mechanical and physical characteristics. Surfaces are pliable and allow complete surface contact with excellent heat dissipation. Sil-Pad 400 actually improves its thermal resistance with age. The reinforcing... (read more)
Browse Conductive Compounds Datasheets for Quist Electronics -
Quist Electronics
Gap Pad Thermally Conductive Gap Filling Materials
Gap Pad VO is a cost-effective, thermally conductive interface material.The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling.The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis. Note: Resultant thickness is defined as the final gap thickness of the application. Features and Benefits. Thermal conductivity: 0.8 W/m-K. Enhanced puncture, shear... (read more)
Browse Conductive Compounds Datasheets for Quist Electronics -
Quist Electronics
Bergquist Sil Pad 1500T Thermally Conductive
Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates. Sil Pad 1500T. Thermal impedance: 0.23°C-in²/W (@50 psi). Inherent surface tack on both sides. Pad is re-positionable. Excellent thermal performance (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics -
Quist Electronics
Bergquist Gap Pad VO Ultimate
Features and Benefits. Thermal conductivity: 1.3 W/m-K. Ultra conformability. Gel-like modulus. Excellent rebound. Decreased strain. Remarkable handling. Electrically isolating. Gap Pad® VO Ultimate is a robust, highly compliant product that is ideal for both small and large gap designs. The fiberglass carrier on one side of the material allows ease of rework, excellent handling characteristics and puncture resistance. Additionally the fiberglass carrier has a slight inherent tack, minimizing... (read more)
Browse Conductive Compounds Datasheets for Quist Electronics -
Quist Electronics
Bergquist Gap Pad HC1000 Thermal Conductive Fill
Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks.The "gel-like" modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad HC1000 is offered with removable protective liners on both sides of the material. Features and Benefits: Thermal conductivity: 1.0 W/m-K. Highly conformable, low hardness. "Gel-Like" modulus. Fiberglass... (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics -
Quist Electronics
Bergquist (Thermal Conductive) Gap Filler 2000
Gap Filler 2000 is a high performance, thermally conductive, liquid gap filling material supplied as a two-component, room or elevated temperature curing system.The material provides a balance of cured material properties and good compression set (memory).The result is a soft, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease.After cure, it won't pump from... (read more)
Browse Conductive Compounds Datasheets for Quist Electronics -
Quist Electronics
Bergquist Gap Pad 1000SF
Thermally Conductive, Silicone-Free Gap Filling Material. Features and Benefits. Thermal conductivity: 0.9 W/m-K. No silicone outgassing. No silicone extraction. Reduced tack on one side to aid in application assembly. Electrically isolating. The new Gap Pad 1000SF is a thermally conductive, electrically insulating, siliconefree polymer specially designed for silicone-sensitive applications.The material is ideal for applications with high standoff and flatness tolerances. Gap Pad 1000SF... (read more)
Browse Leveling and Filling Compounds Datasheets for Quist Electronics -
East Coast Shielding
Metalized Fabric Over Foam Series 200
Metalized Fabric over Foam Gasketing 200 Series combines the use of highly flexible Nickel over Copper Plated Polyester Fabric over a open celled polyurethane foam core to provide an economical, non-corrosive highly effective conductive pad. The bottom surface is supplied with a pressure sensitive adhesive (PSA) strip with release liner if required. Download PDF of FULL product specifications... Click Here (read more)
Browse Gaskets and Gasketing Datasheets for East Coast Shielding
Parts by Number for Conductive Pad Top
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 750S01012 | ASAP Semiconductor | ACTELIS NETWORKS | Not Provided | Thermal Conductive Pad |
| 1777745 | RS Components, Ltd. | Bergquist | Thermally Conductive Insulators | Not Provided |
| HEATSINK-PAD-1P | Allied Electronics, Inc. | CARLO GAVAZZI INC | Not Provided | CONDUCTIVE HEATSINK PAD |
| 2058329-1 | ASAP Semiconductor | TE CONNECTIVITY | Not Provided | Pad, Thermally Conductive |
| SSR-THERMOPAD | Allied Electronics, Inc. | OPTO 22 | Not Provided | Heatsink, Thermal Conductive Pad for Power Series Heatsink, Pack of 10 |
| KK071CUT-1 | Allied Electronics, Inc. | CARLO GAVAZZI INC | Not Provided | Thermal Heatsink Pad, Conductive, Graphite, Cut to 35mm x 42mm, 1 Piece |
Conduct Research Top
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Bright ideas
by LEDs, don't require an inverter to convert ac to dc voltage, reducing cost and consumed power. Now, newer fiber-optic panels incorporate conductive pads for backlighting membrane switches. The pads are integrated into the switches for use in keypads, keyboards, and membrane switches. The light
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Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications (.pdf)
thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. Thermally Conductive Epoxies ADVANCED BORON NITRIDE EPOXY
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Layout and Physical Design Guidelines for Capacitive Sensing
beneath a pad clear of traces if possible;. ety of conditions. Thicker, 5 mm Plexiglas has also. instead, route traces around the outside of a pad and. been found to work acceptably. the gaps between pads. When using a 2-layer PCB, it. Conductive materials, such as metal, will not work as a. is best
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Capacitive Touch Using Only an ADC (CVD) (.pdf)
. charging the internal sample-and-hold cap for the ADC. conductive pad for sensing. The sensor will be tied. to VDD. The sensor channel is then prepared to a. directly to an ADC channel. The rest of the process is. known state by grounding it. In Figure 1, it is shown. done by configuring the ADC and I/O
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Switch Tips: Membrane-switch basics
for membrane keypads is silver conductive ink screen printed on a polyester substrate. The
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Mix & match for theperfect switch panel
such as pushbutton, rotary, sliding-type encoders, and directional switches. These get connected using wire harnesses, solder, or conductive adhesives. The connections, however, often break down from normal wear and tear. A new switch assembly technique promises to eliminate these interconnect woes
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A cleaner path to cool chips
conductor. One scheme fills these gaps with a highly thermally conductive material such as thermal grease, which is effective but messy. Elastomer-based thermal pads are another, cleaner option. They consist of a binder such as silicone filled with fine particles of heat-conducting ceramic. Elastomer
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The Impact of Conductor Surface Profile (Rrms) on Total Circuit Attenuation in Microstrip and Stripline
Transmission line attenuation is known to be influenced by conductor surface profile (Rrms), an effect that worsens as frequency increases. Using microstrip transmission lines, copper conductive losses are characterized from 0.03 - 30 GHz in low loss materials incorporating various copper types
Engineering Web Search: Conductive Pad Top
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Thermal Conductive Pad | Portable copmputer
Home > laptops > Thermal Conductive Pad Thermal Conductive Pad October 27th, 2008 admin Leave a comment Go to comments
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Thermally conductive pad - Wikipedia, the free encyclopedia
Thermally conductive pad From Wikipedia, the free encyclopedia
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Touchpad - Wikipedia, the free encyclopedia
desktop touchpad to a mouse and mat; tapping the top right corner of the pad is the equivalent of a right-click on a mouse
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Thermal Interface Material, Thermal Management ~ The Bergquist...
Liqui-Form 2000??? is a new thermally conductive, one-part liquid formable Material.
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Bergquist Sil Pad Tube from Quist Electronics
Bergquist Sil Pad 1500T Thermally Conductive Bergquist Gap Pad HC1000 Thermal Conductive Fill
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ASUS - - ASUS M4A88T-M
ASUS MeMO Pad Nexus ASUS Transformer Pad ASUS Slider Pad ASUS Fonepad Desktop & AiO PCs
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ASUS - - ASUS P7P55D
ASUS MeMO Pad Nexus ASUS Transformer Pad ASUS Slider Pad ASUS Fonepad Desktop & AiO PCs
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LSUB Vishay Electro-Films Ceramic Submount for High Power LED...
an offset version where the filled via is located to the side of the die pad.