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  • EBSD characterization of twinned copper using pulsed electrodeposition
    [3] Popov K I, Keca D N and Vuksanovic B I 1977 Formation of powdered copper deposits by constant and pulsating overpotential electrolysis J. Appl. Electrochem... ...Gross M E 1998 Recrystallization kinetics of electroplated Cu in damascene trenches at room temperature...
  • Introduction to Microfabrication 2nd Edition
    23 Special Processes and Materials 283 Substrates other than Silicon, Pattern Generation, Patterning, Powder Blasting, Deposition, Porous Silicon, Molding with Lost Mold, Exercises References... ...357 28 Multilevel Metallization Two-Level Metallization, Planarized Multilevel Metallization, Copper Metallization, Dual Damascene Metallization, Low-k Dielectrics...
  • Electrodeposition
    ...acid, 261 Chronoamperometric, 109, 110 Coarseness, 23, 190–201, 206, 208–210 Composite electrodeposition, 130, 133, 144–146 Conductive coatings, 133 Conductive polymer electrodes, 138 CO oxidation, 73, 101–104, 106–108, 111–112 Copper grains, 10, 17, 18... ...63, 66, 67 Copper powder , 62–67 Corncob-like structures... Damascene copper, 270 Decorated, 71, 72, 76–77, 101, 103 .
  • Modern Electroplating 5th Edition
    ...alloys, plating rate increases and modification of, 483, 487 Cyano complex, 119 Cyclic pulse voltammetric stripping (CPVS), acid copper analysis, 41–42 Cyclic voltammetric stripping (CVS), 152, 534–535 acid copper analysis, 41 hysteresis in... ...impurities detection of, 61–62 Damascene copper electroplating: patterned electrodeposition... ...properties: thickness, electrodeposition kinetics, 9 1,3-Diaminopropane electrolyte, palladium electrodeposition, 340 Diamond powders : three-step activation...
  • Copper corrosion issue and analysis on copper damascene process
    Since copper dry etch is very difficult, copper metal- lization is created with damascene process [4]. In this step, corrosive slurries, which usually contain an oxidizer, abra- sive powder and etching chemicals are...
  • Copper corrosion issue and analysis on copper damascene process
    Since copper dry etch is very difficult, copper metallization is created with damascene process [4]. In this step, corrosive slurries, which usually contain an oxidizer, abrasive powder and etching chemicals are often...
  • Integration of High Aspect Ratio Tapered Silicon Via for Silicon Carrier Fabrication
    The main objective of this work is to address various critical technology challenges associated with integration of high aspect ratio through silicon via (TSV) to form a reliable through-silicon interconnect structure by deep damascene copper via filling, Chemical mechanical polishing (CMP... ...like Bosch etch process [8], cryogenic etch process [9], laser drilling [10], and powder blast microma- chining...
  • Temperature Induced Phase Transformation on the 4H-SiC(11-20) Surface
    Abstract: In damascene architecture, widely used both in flash memories and in DRAM as interconnect scheme since 90 nm node, copper surface is exposed... Corrosion Resistance of Ceramics and High-Temperature Phase Change of Powders on Cubic Silicon Nitride .
  • Stresses in copper blanket films and damascene lines : measurements and finite element analysis
    8/20 powder diffraction spectra (figure 2) indicate that all the samples are (I 11) oriented (lines as... Blanket films exhibit a (11 1) fiber texture hut damascene copper lines show an increasing tendency for in-plane orientation.
  • DSpace@MIT: Browsing Singapore-MIT Alliance (SMA) by Title
    An investigation has been carried out to determine the fundamental reliability unit of copper dual- damascene metallization. Aluminum based amorphous metallic glass powders were produced and tested as the anode materials for the lithium...
  • DSpace@MIT: Browsing Singapore-MIT Alliance (SMA) by Title
    An investigation has been carried out to determine the fundamental reliability unit of copper dual- damascene metallization. Aluminum based amorphous metallic glass powders were produced and tested as the anode materials for the lithium...
  • DSpace@MIT: Browsing Singapore-MIT Alliance (SMA) by Title
    An investigation has been carried out to determine the fundamental reliability unit of copper dual- damascene metallization. Aluminum based amorphous metallic glass powders were produced and tested as the anode materials for the lithium...
  • DSpace@MIT: Browsing Singapore-MIT Alliance (SMA) by Title
    An investigation has been carried out to determine the fundamental reliability unit of copper dual- damascene metallization. Aluminum based amorphous metallic glass powders were produced and tested as the anode materials for the lithium...
  • DSpace@MIT: Browsing Advanced Materials for Micro- and Nano-Systems (AMMNS) by Title
    An investigation has been carried out to determine the fundamental reliability unit of copper dual- damascene metallization. Aluminum based amorphous metallic glass powders were produced and tested as the anode materials for the lithium...
  • DSpace@MIT: Browsing Advanced Materials for Micro- and Nano-Systems (AMMNS) by Title
    An investigation has been carried out to determine the fundamental reliability unit of copper dual- damascene metallization. Aluminum based amorphous metallic glass powders were produced and tested as the anode materials for the lithium...


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