Products/Services for Copper Damascene Solution
Abrasive Compounds and Abrasive Slurries - (309 companies)
Copper, Brass, and Bronze Alloys - (605 companies)
No Image AvailableChemical Mechanical Planarization (CMP) Slurries - (16 companies)
EDM Electrode Materials - (60 companies)
Heat Sinks - (392 companies)
Metal Foils and Foil Stock - (166 companies)
Metal Extrusions - (135 companies)
Extrusion Services - (965 companies)
Product News for Copper Damascene Solution
Avins USA, Inc.
Formed Copper and Copper Alloys . Our regional warehouses offer JIT(Just-in-Time) programs and provide continuous supply insurance. Avins USA is the technological leader in the development, production and application of today's high precision engineered materials: the Advanced Industrial Solutions. Avins' Alloys The most complete chemistry range from pure copper to the highest performance copper alloys. Avins' Product Forms From bar, rod, wire, tubing, strip, forgings, castings, billet to custom extruded shapes, we combine... (read more)Browse Copper, Brass, and Bronze Alloys Datasheets for Avins USA, Inc.
Copper Tungsten Mi-Tech Metals' copper tungsten alloys are commonly used in EDM electrodes and other electrical and electrical/thermal applications. They are also used for facing and inserts for flash and butt welding dies, projection welding electrodes, seam welding bearing inserts and facing for electro-forming and electro-forging dies. Although they are somewhat more difficult to machine, tungsten carbide copper materials provide high mechanical properties and excellent resistance to erosion... (read more)Browse Nonferrous Metals and Alloys Datasheets for Mi-Tech Metals
Aerospace Defense Coatings Of Georgia
Copper Plating Services This procedure produces a layer of copper on a component by running an electric current through an alkaline or acid bath that it is immersed in. Aesthetic or decorative coating. Protection during heat treating. Frequently used in the electronics industry. Covers substrate defects. All copper plating processes are performed manually to ensure the proper care is given to each step. Process Approvals - For Copper Plating we adhere to: MIL-C-14450 (replaced by AMS 2418): Copper Plating (read more)Browse Plating Services Datasheets for Aerospace Defense Coatings Of Georgia
Freeport-McMoRan Copper & Gold, Inc. (FCX)
TIn-Coated Copper Wire Tin-Coated wire is produced in both round and rectanular sizes. The tin coating protects the copper from corrosion due to contact with insulating materials and may also promote solderability. Tinned wire uses include: power cable and motor armatures. Packaging. Tin Coated Wire. . Contact Freeport-McMoRan Copper & Gold: Bron Zienkiewicz. E-Mail: email@example.com. Freeport-McMoRan Copper & Gold. Bayway Operations. 48-94 Bayway Ave. Elizabeth, NJ, 07202. (P... (read more)Browse Metal Wire Datasheets for Freeport-McMoRan Copper & Gold, Inc. (FCX)
Can-Do National Tape
Copper Foil Tape Copper foil tapes are recommended for electro-static shielding, cable wrapping, and stained glass work. They may or may not be conductive, and their adhesive may also be conductive. Copper foil tape is chemically resistant and may or may not have a liner. Copper foil tapes are available in standard and custom slit widths as a self wound product or on a liner. The tape is available with an acrylic adhesive which can be conductive or non-conductive. Copper foil tapes are very conformable... (read more)Browse Foil Tapes Datasheets for Can-Do National Tape
Aluminum Bonded Copper Aluminum Bonded Copper or "ABC" represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC's product technology. Critical metal surfaces are cleaned then bonded without the use of an adhesive which could interfere with the subsequent outer layer processing of the multilayer. In short, use of ABC instead of the conventional component lay-up / wiping technique ensures... (read more)Browse Copper, Brass, and Bronze Alloys Datasheets for Oak-Mitsui, Inc.
BRIM Electronics, Inc.
Flat Tinned Copper Braid TlNNED COPPER conductors braided then rolled flat. Conductors are annealed for flexibility. Used as grounding cable, bonding strap for aircraft, marine equipment vehicles, etc. to eliminate ignition interference. Easily slides over wire and cables. Also used as a high current conductor at low voltages. (read more)Browse Bare Conductor Wire and Cable Datasheets for BRIM Electronics, Inc.
AMPCOLOY®83-BERYLLIUM COPPER AMPCOLOY ® 83 is a 2 % Beryllium copper alloy which displays very high mechanical properties with. a reasonably good electrical and thermal conductivity. Application. Wherever good wear resistance or high mechanical properties are desired coupled with a good electrical or. thermal conductivity, such as: Flash butt welding and butt welding. Parts for electrical components. In the plastic mould industry AMPCOLOY ® 83 is sometimes used as chill plates and inserts in the moulds, cooling... (read more)Browse Forgings and Forged Stock Datasheets for AMPCO METAL
Magnetic Lifting Technologies US
Lightweight Deepfield Copper The LDC magnet is manufactured for use in scrap yards where Overhead Cranes are used in processing scrap. The overhead cranes have a lifting capability compatible for the use of Copper wound magnets. They are an option to the use of aluminum wound L Series magnets. They are versatile, cost more than an equivalent aluminum wound L Series magnet and are recommended in 16 or more hour a day operations that have a crane capacity to handle the magnet weight / material weight ratio per lift. Usage... (read more)Browse Industrial Magnets Datasheets for Magnetic Lifting Technologies US
ERG Materials & Aerospace Corporation
Duocel® Copper Foam Why is Duocel ® copper foam so special?. Duocel ® copper foam is a true metal skeletal structure. It is not a sintered, coated, or plated product. Its purity is typically that of the parent alloy metal, with no voids, inclusions, or entrapments. The matrix of cells and ligaments is completely repeatable, regular, and uniform throughout the entirety of the material. Duocel ® copper foam is a rigid, highly porous and permeable structure and has a controlled density of metal per unit... (read more)Browse Foams and Foam Materials Datasheets for ERG Materials & Aerospace Corporation
A three-element technique provides data for production monitoring and process fingerprinting, development, and diagnostic applications. mong the many challenges presented by the adoption of copper damascene and dual-damascene metallization processes for the creation of next-generation interconnects...
As the features of integrated circuitry (IC) chips are scaled down to submicron dimensions, the manufacturer demands new technology to meet performance and reliability requirements for the electronic interconnects. According to these technical demands, the copper damascene process became...
...products. Technicians at Enthone's New Haven research facility at work in a copper-additive blending area. The blue tanks hold high-purity electrolyte used in dual damascene copper deposition. Photomicrographs reveal how copper builds up in 0.12 m trenches after 8 sec (left) and 30 sec. Use...
...in the International Technology Roadmap for Semiconductors , are scheduled to evolve from 0.18 um today to 0.13 um by 2002 and an even more aggressive 0.1 um by 2005. At the same time, the semiconductor manufacturing industry is being driven by three trends: the introduction of copper as an interconnect...
SAN FRANCISCO In a move aimed directly at archcompetitor Applied Materials, Novellus Systems introduced its Damascus copper damascene production system at a press conference here in early June. The announcement followed news of a multicompany strategic alliance for copper processing, which links...
Technology (LPT) that addresses current pattern density effects as well as dishing and erosion problems, Lam says. Solving these problems will help chipmakers in CMP applications such as shallow trench isolation and copper damascene. The vendor claims two key yield-related benefits. The Teres tool...
In another project, Sematech has fabricated first-level copper damascene test structures using Applied Materials' Black Diamond low-k dielectric film. The success with the SEZ Group came about with the use of a technique the supplier calls SpCE for spin-process contamination elimination. Introduced in 1999...
009;International Sematech has completed first-phase evaluations of low-k dielectric films for processing advanced interconnect structures in devices with sub-0.18- um linewidths. During the preliminary phase the consortium made one-level copper damascene test structures. The films used...
...the main source of overall device delay for silicon dioxide/aluminum architectures. Because resistance-capacitance (RC) delay directly limits device speed, the semiconductor industry has been prompted to adopt new materials and architectures. Low-k dielectric/copper damascene and dual-damascene...
...is to be incorporated successfully into wafer metallization processes, many challenges must be overcome. One such challenge relates to the patterning of copper features. Because of the difficulty of dry-etching copper, a damascene or dual-damascene metallization technique that includes chemical-mechanical...
Engineering Web Search: Copper Damascene Solution
Abs. 607, 204th Meeting, ? 2003 The Electrochemical Society,...
JOUY en JOSAS, France, between the impedance and the morphology of the copper deposit.4 M.C. Clech ALTIS Semiconductor; 224, Bd J. Kennedy 91105
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Abs. 621, 204th Meeting, ? 2003 The Electrochemical Society,...
As shown in Fig. 2(a), copper film is dissolved (a) (b) slowly into the alkali-based solution even without cyclic pulse voltages and it is dissolved
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Using Molecular Modeling to Understand Cleaner Efficiency for...
Using Molecular Modeling to Understand Cleaner Efficiency for Barc ("Bottom Anti-Reflective Coating") After Plasma Etch in Dual Damascene Structures
Fast copper plating process for TSV fill
Packaging, Assembly and Circuits Technology Conference Item Title: Fast copper plating process for TSV fill Publisher Name: IEEE Meeting Location:
Semiconductor device fabrication - Wikipedia, the free...
The exposed regions are washed away by a developer solution.
45 nanometer - Wikipedia, the free encyclopedia
Extensive use of dummy copper metal and dummy gates[6 Gate-last process using dummy polysilicon and damascene metal gate
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Copper Barrier Seed solution beyond 32nm
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Modeling of Pattern Dependencies in the Fabrication of...
Overview of Multilevel Copper Metallization........................................................ 15 1.1.1 Single Damascene
Post-Etch Residue Removers: HDA® Technology & Copper...
Post-Etch Residue Removers PlasmaSolv® - HDA® Technology Copper Integration Technology SAC? (semi-aqueous chemistry) Remover Photoresist Removers WLP