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A three-element technique provides data for production monitoring and process fingerprinting, development, and diagnostic applications. mong the many challenges presented by the adoption of copper damascene and dual-damascene metallization processes for the creation of next-generation interconnects...

As the features of integrated circuitry (IC) chips are scaled down to submicron dimensions, the manufacturer demands new technology to meet performance and reliability requirements for the electronic interconnects. According to these technical demands, the copper damascene process became...

...products. Technicians at Enthone's New Haven research facility at work in a copper-additive blending area. The blue tanks hold high-purity electrolyte used in dual damascene copper deposition. Photomicrographs reveal how copper builds up in 0.12 m trenches after 8 sec (left) and 30 sec. Use...

...in the International Technology Roadmap for Semiconductors , are scheduled to evolve from 0.18 um today to 0.13 um by 2002 and an even more aggressive 0.1 um by 2005. At the same time, the semiconductor manufacturing industry is being driven by three trends: the introduction of copper as an interconnect...

SAN FRANCISCO In a move aimed directly at archcompetitor Applied Materials, Novellus Systems introduced its Damascus copper damascene production system at a press conference here in early June. The announcement followed news of a multicompany strategic alliance for copper processing, which links...

Technology (LPT) that addresses current pattern density effects as well as dishing and erosion problems, Lam says. Solving these problems will help chipmakers in CMP applications such as shallow trench isolation and copper damascene. The vendor claims two key yield-related benefits. The Teres tool...

In another project, Sematech has fabricated first-level copper damascene test structures using Applied Materials' Black Diamond low-k dielectric film. The success with the SEZ Group came about with the use of a technique the supplier calls SpCE for spin-process contamination elimination. Introduced in 1999...

009;International Sematech has completed first-phase evaluations of low-k dielectric films for processing advanced interconnect structures in devices with sub-0.18- um linewidths. During the preliminary phase the consortium made one-level copper damascene test structures. The films used...

...the main source of overall device delay for silicon dioxide/aluminum architectures. Because resistance-capacitance (RC) delay directly limits device speed, the semiconductor industry has been prompted to adopt new materials and architectures. Low-k dielectric/copper damascene and dual-damascene...

...is to be incorporated successfully into wafer metallization processes, many challenges must be overcome. One such challenge relates to the patterning of copper features. Because of the difficulty of dry-etching copper, a damascene or dual-damascene metallization technique that includes chemical-mechanical...

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