Products/Services for Cr:sapphire Wafer
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No Image AvailableWafer Cassettes - (11 companies)Wafer cassettes are used to transport and store wafers during semiconductor manifacturing operations. They are designed to house or carry several wafers of the same size and are available in a range of materials to support specific applications... Learn More
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Wafer and Thin Film Instrumentation - (369 companies)Wafer and Thin Film Instrumentation Information. Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ... Search by Specification | Learn More -
Semiconductor Cluster Tools - (73 companies)...chambers with a wafer handling robot to minimize contact with the wafers. The semiconductor cluster tool control system then manages the wafer 's travel between each chamber. The type of chambers used can include process, transport, buffer and cassette... Search by Specification | Learn More -
Vacuum Manipulators - (55 companies)Vacuum manipulators include components for moving or positioning wafers or items in vacuum chambers or systems such as mounting devices, load locks, wobble sticks or wafer robots. Vacuum Manipulators Information. Vacuum manipulators are used to move... Learn More -
Sapphire Materials and Components - (66 companies)...properties. Applications include jewel bearings, lasing rods, wear parts, wafer substrates and optics. Manufacture and Growth. Single crystals of sapphire materials and sapphire components are manufactured or grown in melting and deposition processes... Search by Specification | Learn More -
Semiconductor Foundry Services - (190 companies)...semiconductor chips on a contract basis, in prototype to production quantities. Some companies produce silicon wafers for analog devices, application-specific integrated circuits (ASIC), high voltage components, logic gates, microprocessors, or computer... Search by Specification | Learn More
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Semiconductor Metrology Instruments - (194 companies)Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers... Search by Specification | Learn More
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MEMS Devices - (37 companies)MEMS devices integrate mechanical components, electronics, sensors and actuators on a semiconductor material, chip, or wafer. They are built with advanced microfabrication and micromachining techniques to support a system-on-a-chip (SoC... Learn More
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Thin Film Equipment - (338 companies)...of material from a substrate or wafer for cleaning purposes. In rapid thermal processing (RTP), silicon wafers are rapidly oxidized to form a silicon dioxide dielectric layer by a brief exposure to high temperature steam. Vacuum annealing... Search by Specification | Learn More
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MEMS Processing Equipment - (44 companies)A geophone is used in seismic sensing applications or to monitor the vibration of machinery and predict component failures. MEMS sensors are also used in pacemakers and pressure and temperature sensors. Wafer fabrication involves creating thin wafers from... Search by Specification | Learn More
Product News for Cr:sapphire Wafer
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Precitec, Inc.
Measurement of Doped Wafers and TSVs Modifications have been made to several existing CHRocodile sensors to enable measurement on unique semiconductor materials, ranging from glass, sapphire and highly doped wafers, to TSVs and other structured devices. Capable of measuring wafer thickness, topography or film thickness at high speeds, CHRocodile sensors are available for nearly all materials and applications. With the semiconductor and electronic industries dependant on high quality standards, the high precision of the CHRocodile... (read more)Browse Wafer and Thin Film Instrumentation Datasheets for Precitec, Inc. -
JST Manufacturing, Inc.
For precision drying of silicon wafers IPA Vapor Dryer. JST's "CLV" Dryer utilizes a patented, environmentally friendly, ultra clean technology for precision drying of silicon wafers, III-V Compound wafers, glass substrates, disc drives, optic lenses and many other products. Precision drying is critical for maintaining the cleaning process. JST's CLV is a hybrid of two proven technologies: vacuum drying and isopropyl alcohol (IPA) drying. JST's CLV Dryer utilizing the best features of both in an effective... (read more)Browse Semiconductor Wet Process Equipment Datasheets for JST Manufacturing, Inc. -
Marktech Optoelectronics
InP/InGaAs Epitaxial Wafers for PD and PD Arrays One of the many technologies that Marktech has recently introduced are customized 1.7 µm InP/InGaAs Epitaxial Wafers for use in PIN Photodiodes, APD and PD arrays. Based on the application needs, these high speed, high sensitivity wafers can be offered in a number of array and aperature sizes. Custom PD Array Capability Ranges: Cell Active Area: 40 µm x 40 µm. Pitch: 50 µm. 1D array: 2 x 64 (390 µm x 3531 µm); 2 x 128 (390 µm x 6960 µm... (read more)Browse Photodiodes Datasheets for Marktech Optoelectronics -
Thermal Circuits, Inc.
Designed To Quickly Bathe Wafers & Other Parts Etched Foil Heaters for the Semiconductor & Wafers industries from Thermal Circuits. In the early 1980's, Thermal Circuits introduced HTB etched foil element heaters to the Semiconductor industry to heat acid in portable wafer processing baths. It replaced hot plates that only heated from the bottom. The five-sided etched foil heater wraps the corresponding five-sided inner bath vessel with a combination of uniform and profiled heat. The etched foil heating process is designed to quickly... (read more) -
Saint-Gobain Surface Conditioning Group
Lapping Vehicle for C Plane Sapphire Wafers Saint-Gobain's Lapping Vehicle, 79372189F, for the sapphire market is used with B4C or SiC grain. This is a lapping vehicle which suspends either boron carbide, B4C or silicon carbide, SiC abrasive particles in a slurry for the lapping of C plane sapphire wafers used principally in the fabrication of LED (light emitting diode) devices. The sapphire wafers have to be lapped flat and extremely smooth without surface defects. The final polishing process produces an epi-ready surface -- an almost... (read more)Browse Abrasive Compounds and Abrasive Slurries Datasheets for Saint-Gobain Surface Conditioning Group -
DCM Tech Corp
Grind Saphire Cores & Wafers in Minutes not Hours! Grind sapphire cores with ease!. Grind sapphire cores and wafers in minutes not hours. DCM customers have experienced as much as 14X productivity increase in grinding over conventional reciprocating surface grinding. DCM is a US machine tool builder of blanchard style grinders with factory direct sales and service. DCM offers grinder packages with small footprints, automatic feed and process repeatability that lends itself to lean manufacturing. (read more)Browse Milling Machines Datasheets for DCM Tech Corp -
Olympus IMS
AL120 Wafer Handler The NEW AL120 wafer handler series transfers both silicon and compound semiconductor wafers from the cassette to the microscope stage with enhanced capabilities and flexibility, while maintaining an ergonomic design. Continuing the world-renowned performance and reliability of previous Olympus wafer handlers, the AL120 now transfers wafers with thicknesses down to 90µm to specifically meet the demands of thin wafer manufacturers. The new system offers 360-degree rotation, for full macro... (read more)Browse Specialty Microscopes Datasheets for Olympus IMS -
MTI Instruments Inc.
Semiconductor Wafer Thickness Gage The ProformaTM 300 Advantage... One Package for ALL Wafer Sizes and Materials. Based on MTI Instruments' proprietary capacitance technology, the Proforma 300 can be used on all wafer materials including: · Silicon. · Gallium-Arsenide. · Indium Phosphide. · Germanium. ... without recalibrating or electrically grounding the wafer!. Fast, Accurate, and Reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV). Portable and Easy... (read more)Browse Semiconductor Metrology Instruments Datasheets for MTI Instruments Inc. -
Insaco, Inc.
Semiconductor Wafer Processing Nesting Specialty custom machining of sapphire and ceramic wafers allows Insaco to respond to customer needs for nesting of wafers in larger carriers. Insaco capability to machine and jig grind precise features to extreme tolerance in ceramic materials allows developmental engineers in the semiconductor and compound semiconductor industries to handle small process wafers on a large wafer line. Insaco is a precision machining company that fabricates parts from all technical ceramics, sapphire and quartz... (read more)Browse Glass Fabrication Services Datasheets for Insaco, Inc. -
MTI Instruments Inc.
Wafer Metrology Measurement Tool The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 150mm, 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns... (read more)Browse Wafer and Thin Film Instrumentation Datasheets for MTI Instruments Inc.
