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Lighting Strike Test Results
number represents nominal original thickness. 2 = 0.002" (0.051 mm). Letters are chemical symbol for material. CU = Copper. Number immediately following letters represents strand width. 4 = 0.004" (0.102 mm). Last number indicates the long way of the diamond. 100 = 0.100" (2.54 mm). Any letters
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Emissivity Tables for Infrared Thermometers
-.90. Ice, Smooth. 32 (0). 0.97. Ice, Rough. 32 (0). 0.98. Lacquer. Black. 200 (93). 0.96. Blue, on Al Foil. 100 (38). 0.78. Clear, on Al Foil (2 coats). 200 (93). .08-.09. Clear, on Bright Cu. 200 (93). 0.66. Clear, on Tarnished Cu. 200 (93). 0.64. Red, on Al Foil (2 coats). 100 (38). .60-.74. White
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Building a Reliable VFD System (.pdf)
designed for. designed for VFD applications. VFD applications. · Three Conductor #12. · Four Conductor (three conductors plus. · XLPE Insulation (.030 in. wall). green/yellow ground). · (2) .002" Cu Tapes Spiral Wrapped. · XLPE Insulation (.045 in. wal ) 100% Foil. with 20% overlap. +85% Tinned
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Colossal Carbon Supersaturation in Austenitic Stainless Steels Carburized at Low Temperature (.pdf)
to the. temperature carburization, we have studied bulk. carburization times listed in Table 2. specimens, thin foils, and powders of several dif-. All specimens were examined before and after. ferent low-temperature-carburized 316 stainless. carburization by XRD with monochromated Cu. steels
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Zinc
workable and highly forgeable wrought-zinc alloys containing Ti, Al, Pb, Cd, Cu, or Fe in various quantities are easily machined. Forged or extruded parts are free from porosity and have good detail. Want to use this article? Click here for options!. (C) 2011 Penton Media Inc. Email this page
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Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment (.pdf)
m e i m a g e Image degradation. la. u. d e g r ad a t i on wi th wi t h s e v e r a l b a d. m 5. Standard. c. u. scratches visible; columns and white. Spin-On PI, bad columns likely bands; PI teared-off. 6µm. 0. to be generated, PI a n d p a s s i v a t i o n. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10
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Microstructural Characterization of Thin Film Photovoltaics using Electron Backscatter Diffraction (.pdf)
. applications. Two promising thin film materials are based on Cadmium Tel uride (CdTe) and chalcopyrite-. structured materials such as Cu(In,Ga)Se2 (CIGS). These materials have near-optimal band. gaps, high optical absorption, and good conversion efficiencies. Solar modules manufactured. from these materials
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Common-sense cabling
the best shielding is the semirigid type. Most semirigid cable employs either tin-plated copper (TP/CU) or annealed aluminum (TP/AL) jackets and has an appearance resembling that of automotive brake lines. The latter is sometimes called easy bend type and is also inexpensive. Also available