Products/Services for Cu Stud Bump
No Image AvailableStud Welders - (36 companies)
Bolt Tensioners - (39 companies)
Studs - (375 companies)
Wire Rope Fittings and Cable Fittings - (281 companies)
Leveling Feet, Pads, and Glides - (125 companies)
Cam Followers - (158 companies)
Soldering Irons, Stations, and Accessories - (301 companies)
Product News for Cu Stud Bump
Resistance Welding - W/Cu Mi-Tech's composites are manufactured by the powder metallurgy techniques of pressing, sintering, and infiltrating of Tungsten with Copper or Silver. The high physical and mechanical properties, as well as the thermal and electrical conductivity of refractory metal composites, make these materials very suitable for die inserts and electrode facings, flash and butt welding dies, and hot upsetting. They can also solve your heat balance problems. (read more)
CU - Helical Bevel Speed Reducers The WATT Drive helical bevel reducer offers a unique offset input design for mounting the unit closer to the load than standard designs. Available with output shaft or hollow bore for shaft mounting. Input options include shaft, motor adapters, or integral motors. Specifications: •Power Capacities from 0.16 to 60 HP. •Gear ratios from 5:1 to 2600:1. •Torque capabilities to 6000 ft/lbs. Features and Benifits: •Class 12 Gears - Provides higher efficiencies and greater... (read more)
Nelson Stud Welding
NCD+ Stud Welding System Data Sheet. Specifically designed for light gauge metal working applications, the NCD+ stud welding system from Nelson Stud Welding delivers reliability and repeatability in a compact lightweight (handheld) design unrivaled in the industry. This robust capacitor discharge system diminishes reverse side marking while providing overall savings with the elimination of drilling, tapping, grinding and polishing operations. Typical applications include: Thin sheet metal fabrication with minimal heat... (read more)Browse Welding, Brazing, and Soldering Equipment Datasheets for Nelson Stud Welding
Parameter Generation & Control, Inc.
40 Cu Ft Reach-In Stability Chamber PARAMETER 40 CF REACH-IN CHAMBER. The 7911 series chamber has been designed with an exceptional heat exchange system that takes the refrigeration coil out of the process air stream to enhance the long-term performance of this chamber. These test chambers are designed to accurately produce those temperature and humidity conditions required for applications such as stability studies, package testing, TAPPI, MIL-SPEC, and vapor transmission. Applications are found in such diverse industries... (read more)Browse Environmental Test Chambers and Rooms Datasheets for Parameter Generation & Control, Inc.
Spectral Dynamics, Inc.
Pneumatic Shock and Bump Machine Spectral Dynamics Inc. - The Shock and Bump (SD B) Series Machines are used to simulate and evaluate the design and destructive testing of components, circuits, hybrids,and complete assemblies.There are 5 standard shock and bump machine test systems available or we can also customize one to meet your needs. All our shock and bump machines are pneumatically powered shock testers for accurate/repeatable laboratory and production impact testing. With suitable pulse generators, these shock and bump... (read more)Browse Shock and Vibration Testing Shakers Datasheets for Spectral Dynamics, Inc.
Federal Equipment Company
24 CU FT SPEEDWAY RIBBON BLENDER, S/S, 10 HP One (1) used 24 cu ft Speedway ribbon, blender stainless steel construction, 28" wide x 72" long trough, double ribbon, onboard roller bearings, 8" X 8" center bottom discharge with manual slide gate valve on legs, belt driven with torque arm gearbox rated 25:1 ratio, 10 hp motor drive. GET QUOTE NOW (read more)
Nelson Stud Welding
One Stud Welding Head for Different Studs One Stud Welding Head for Different Studs. From a simple stud with a 5mm shaft to a large-flange stud or a ground stud, the KSE 55 LS from Nelson Stud Welding can feed and weld all standard stud shapes. Highlights. Only one weld head for almost all welding tasks. Until now you needed a separate weld head for each stud type. KSE 55 LS permits different stud shapes to be welded with a single weld head. Stud welding without a chuck. The KSE 55 LS is equipped... (read more)Browse Welding, Brazing, and Soldering Equipment Datasheets for Nelson Stud Welding
Nelson Stud Welding
1/2 Inch, Portable, Compact, Inverter Stud Welder By no means light in power & precision, this new, dependable, compact and lightweight stud welder from Nelson Stud Welding can deliver up to 800 amps for 1/2" (12mm) full base diameter stud welding. Propelling stud welding into the 21st century the Nelweld ® N800i ™ is Nelson's third generation inverter technology and boasts some great features, including: Friendly User Interface. 10* preset buttons. Bright alpha-numeric displays. Graphic gun. Weld quality indicator detects bad... (read more)Browse Stud Welders Datasheets for Nelson Stud Welding
KieTek International, Inc.
Stud mounted, Flange mounted & pipe ball transfers Product Category: Flange Mount Ball Transfer. Part Number: BT254-1. Specifications: 2-hole flange mount ball transfer. 1" ball diameter main carbon steel ball, HRC60. (65) 1/8" diameter carbon steel sub-balls, HRC60. 75 pound load capacity. Zinc plated. Interchange: Matthews # B4500. Product Category: Stud Mount Ball Transfer. Part Number: BT254-3. Specifications: Stud mount ball transfer. 1" ball diameter main steel ball, HRC60. (65) 1/8" diameter carbon steel sub-balls, HRC60. 75 pound load... (read more)
Accurate Bushing Company, Inc.
Roller Bearings...V-Groove Stud Type Accurate Bearing - The SMITH-TRAX ® special-duty track roller bearings are machined from high-alloy steel and are case-hardened for maximum longevity. These bearings are fitted with deep-groove ball bearings or tapered roller bearings to handle both high radial and thrust load applications. . CLICK HERE to see the Series VCR V-Groove Stud Type roller bearings. (read more)
Engineering Web Search: Cu Stud Bump
The effect of Cu stud structure and eutectic solder...
The effect of Cu stud structure and eutectic solder electroplating on intermetallic growth and reliability of flip-chip solder bump
Electroless Ni Plating to Compensate for Bump Height Variation...
Item Title: Electroless Ni Plating to Compensate for Bump Height Variation in Cu–Cu 3-D Packaging Publisher Name: IEEE Country: USA Issue: 6
Technological offer overview Technological modules definitions...
Wafer size : 200 & 300 mm Customer Top passivation TSV type : via last / Cu liner Minimum pitch : 80 ?m Customer Metal 1 TSV diameter : 40 to 100 ?m
A Year of Broadening Possibilities 3D Integration High-Lights...
Solder alloy Cu stud/ SnAg solder Cu stud Min. pitch: 50 ?m Top passivation Solder pillar ?: 25 ?m Top metal Solder pillar thickness: Cu 17?m / SnAg
Amkor Technology: Copper Pillar Fine Pitch Flip Chip | Cu...
Copper (Cu) pillar bump is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future ROHS
See Amkor Technology Information
ARTICLE IN PRESS Nuclear Instruments and Methods in Physics...
Research A 565 (2006) 290?295 Table 2 Overview of different FC bump constructions Bump Wafer Wafer size UBM Bumping technology Application Au Si GaAs
Development of Flexible Bumped Tape Interposer by Kazuhito...
fil ed with metals such as Cu or solder, and chips are mounted by flip-chip bonding the SnAg-solder bumps with the Au stud bumps on Si chips.
See Furukawa Electric Company Ltd. Information
Microstructure Characterization of Sn-Ag Solder Joints between...
the consumption of the Au stud seems to be affected by the initial solder-paste volume; the fraction of the Au stud bump that remained after reaction
Effects of Pd Addition on Au Stud Bumps/Al Pads Interfacial...
Mechanism of Interfacial Reaction for the Sn-Pb Solder Bump with Ni/Cu Under-Bump Metallization in Flip-Chip Technology by Jang, Guh-Yaw; Huang,