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Cutting Laser Diode

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  • Laser Cutting Kapton
    and aerospace sectors and is commonly cut with Diode Pump solid state lasers. Although some thermal effects are visible, high process speeds are possible with the air-cooled 70W laser; faster cutting would be possible using the 200W laser.
  • Laser Cutting Now Takes On Intricate Microstructures
    -of-the-art diode-pumped fiber-laser cutting system excelling by speed, accuracy, and an outstanding level of process control capability.
  • Reliable Cooling of High-Power Laser Diode Arrays (.pdf)
    Northrop Grumman / Cutting Edge Optronics has developed a line of microchannel-cooled laser diode arrays in which the coolant is electrically isolated from the current path. As a result, these arrays do not require the use of deionized water. The thermal performance of these arrays is presented
  • High Density Pulsed Laser Diode Arrays for SSL Pumping (.pdf)
    pumping allows the diodes to be operated. at higher peak power than is possible with CW pumping. This leads to SSL systems with higher peak powers. Northrop Grumman Cutting Edge Optronics (NGCEO) has been manufacturing QCW laser diode arrays for over a. decade in a variety of configurations. A schematic
  • QCW Diode Array Reliability at 80x and 8xx nm
    Northrop Grumman Cutting Edge Optronics (NGCEO) has recently developed high-power laser diode arrays specifically. for long-life operation in quasi-CW applications. These arrays feature a new epitaxial wafer design that utilizes a large. optical cavity and are packaged using AuSn solder
  • Semiconductor Micromachining Using Diode-Pumped Solid-State Lasers
    Laser micromachining of semiconductor materials such as silicon and sapphire has attracted more and more attention in recent years. High precision laser cutting and drilling processes have been successfully used in semiconductor, photonics, optoelectronics, and microelectromechanical system (MEMS
  • Femtosecond and Nanosecond Laser Micromachining of Oxidized Multi-Walled Carbon Nanotube Doped Morthane
    laser-processing. parameters including laser pulse duration, pulse energy, beam scanning speed, and average power. The processing. consisted of cutting channels into the materials using 1048 nm wavelength at 400 fs pulse duration, 1064 nm wavelength. at 40 ns pulse duration, and 355 nm wavelength
  • Micromachining of Carbon Nanocomposites with Nd:YAG and Nd:YVO4 Frequency Converted Solid State Lasers
    the relationship between repetition rate, travel speed, and material removal rate. The processing consisted of cutting channels into the materials using an Nd:YVO4 laser at 1064, 532, and 355 nm wavelengths. þÿ Micromachining of Carbon Nanocomposites with Nd:YAG and. Nd:YVO4 Frequency Converted

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