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  • Hydrogen Monitoring of CVD Process Tools
    Hydrogen and the hazards of hydrogen leaks are present in many areas of semiconductor manufacturing facilities. While the basic need to continuously monitor hydrogen leaks is clear, the proper selection and placement of hydrogen sensors requires careful consideration. Hydrogen, the lightest
  • Improving tungsten CVD performance with in situ particle monitoring
    affect film quality are accompanied by elevated particle levels, which can signal the nature of the problem. For example, a sudden increase in particle levels during the bulk deposition step can indicate a gas line leak. In situ particle monitoring can provide immediate feedback on such particle
  • MICRO: Brave New Materials
    of 0.12- and 0.13- um copper devices, it is imperative to use clean silicon wafers to monitor and characterize defects arising from processes and process tools, improvements, or modifications. Defects greater than 0.12 um in size can compromise the integrity of multilevel metal interconnect stacks
  • MICRO:Product Technology News (March '99)
    Equipped with a front-opening unified pod, the V 300-SL surface profiler enables users to monitor process wafers in a fully automated environment. Stylus-based measurement technology provides step height repeatability for monitoring the uniformity of etch and deposition processes. The profiler's
  • MICRO: Extreme Silicon - Sun (March 2000)
    Peng Sun and Martin Adams, formerly of Because their effects on semiconductor devices are numerous and destructive, organic contaminants on wafer surfaces must be monitored and controlled. It has been reported that the presence of organic contamination can change surface hydrophobicity, lower
  • MICRO: Extreme Silicon - Sun (March 2000)
    be monitored and controlled. It has been reported that the presence of organic contamination can change surface hydrophobicity, lower breakdown voltage, form silicon carbide, affect oxide growth and quality, cause unintentional doping, contribute to degradation haze formation, and generate post-CVD
  • MICRO: Prod Tech news
    proxy measurements and can monitor 300-mm thin-film processes in-line. The system provides robust, nondestructive measurements that accurately reflect process conditions at the die level, enabling manufacturers to achieve cost-effective production film control at the 65-nm node and beyond. The tool

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