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  • Blasted away
    . This may produce an hourglass effect, which may help certain applications. An example of an etched glass substrate shows the taper effect of deep etching. This was etched to 1/4-in. depth. Quartz/glass etches quickly and this part was done within 5 min. Texturing roughens surfaces for subsequent
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    technology. Mitsubishi preps electrochemical etching process Mitsubishi Electric Corp. has developed a single-step, hydrofluoric acid electrochemical etching process that can achieve an aspect ratio greater than 60:1 at potentially a tenth of the cost of conventional deep dry etching. Mentor overhauls
  • MICRO: Special Apps
    have finally achieved their long-promised potential as a disruptive technology. A key process used to fabricate many MEMS devices is deep reactive-ion etching (DRIE) of silicon, which enables the creation of vertical trenches or holes that are typically in the 10- to 750- um range. These deep trenches
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Heard on the Beat (July 13) Commentary & analysis of week's chip news Applied offers deep-trench silicon etch chamber for sub-100-nm DRAM processes SANTA CLARA, Calif.--Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching
  • MICRO:Product Technology News (Jan '2000)
    An automated deep-UV spectrophotometer measures samples of thin-film coatings, photoresists, silicon wafers, deep-UV optics, dry fused silica, and calcium fluoride under vacuum or purged conditions. The CAMS-507 DUV provides precise, repeatable reflectance, absorption, and transmission measurements
  • Integrated cooling system lets chips beat the heat
    . In contrast, Georgia Tech's CMOS-compatible technique works at temperatures <260 C and builds microfluidiccooling channels without damaging attached circuits. The scheme works on gigascale integrated (GSI) chips and is fully compatible with conventional flip-chip packaging. Researchers begin by etching
  • MICRO: Products
    Designed for deep-oxide etching in MEMS and MOEMS applications, the AMS 200 DE (dielectric etcher) meets the requirements of using SiO quartz and other glasslike materials, which are often better adapted than silicon or silicon on insulator for microoptical elements and microfluidic components
  • MICRO: Critical Materials?Wafers
    , the wafer is lapped, etched, and polished. Lapping planarizes the wafer and removes most of the deep damage caused by slicing, while etching removes the damage caused by lapping. Lastly, polishing produces the final, top-quality

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