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  • Description: This PVC-1 plating tank has inside dimensions of 24"L X 4"W X 30"H and a wall thickness of 1/4". Tank is self-supporting and of welded construction and able to withstand temperatures up to 140°F. Cover for this tank is #11055. On this 30" deep tank use angle iron or 2 x 4’s, plus plywood

    • Type: General Purpose/ Bulk Storage Tank
    • Material: Plastic

  • Description: question you may have. And our manufacturing engineers can support tooling design and development for all the metal working methods we offer. Machining Shaping Electric discharge Milling Reaming Five-axis milling Chemical Deep hole drilling Machined castings Micro-drilling Turning Swiss

    • Diameter: Less than 1", 1" - 3", 3" - 6", Greater than 6"
    • Materials: Aluminum, Brass, Bronze, Copper, Hardened Metals, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium
    • Services: CAD / CAM Support, Just-in-Time Delivery, Prototype Services, Low Volume Production, High Volume Production
    • Location: North America, United States Only, Northeast US Only

  • Description: The largest in the VLS platform line, the VLS6.60 has a wide and deep engraving area that can accommodate a variety of materials. The VLS6.60 offers a choice of six laser cartridges ranging in power from 10-60 watts. The material processing envelope of 32" x 18" x 9", 5,184 in3 (813 x 457 x 229mm

  • Description: off-plane X-ray gratings to toroidal VLS gratings for the VUV and transmission deep groove gratings for the IR range. For example, HORIBA Jobin Yvon produced the four gratings for NASA/JHU FUSE spectrograph. The gratings are 5800 gr/mm, aberration corrected, holographically ruled on 300x300 mm

    • Grating Type: Ruled Grating, Holographic
    • Grating Design: Transmission
    • Ion Etched: Yes
    • Wavelength Range: UV, Visible, IR

  • Description: We are an independent metal fabricating company specializing in the burr-free abrasive cut-off of metal parts and the related capabilities required to meet all of our customers' tight tolerance requirements. You can find us in Cedar Grove, New Jersey, USA at our modern manufacturing facility

    • Capabilities: Deep Hole Drilling, Drilling, Etching / Chemical Milling, Honing, Milling, Turning, Wire EDM
    • Number of Axes: 4-axis Machining
    • Micro Machining: Yes
    • Materials: Aluminum, Brass, Bronze, Cast Iron, Copper, Hardened Metals, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium

  • Supplier: AP Labs, Inc.

    Description: No Description Provided

    • Capabilities: Deep Hole Drilling, Drilling, Etching / Chemical Milling, Jig Boring, Milling, Screw Machining, Turning
    • Number of Axes: 3-axis Machining
    • Specialty Machining: Casting Machining, Jigs and Fixtures
    • Length Capacity: 1" - 3", 3" - 6", 6" - 48"

  • Supplier: Kionix, Inc.

    Description: These high-performance silicon micromachined linear accelerometers and inclinometers consist of a sensor element and an ASIC packaged in a 5x5x1.2mm Dual Flat No-lead (DFN). The sensor element is fabricated from single-crystal silicon with proprietary Deep Reactive Ion Etching (DRIE) processes

    • Acceleration: 10 g
    • Frequency Range: 800 Hz
    • Number of Axes: Single Axis, Biaxial, Triaxial
    • Sensor Technology: MEMS

  • Supplier: Kionix, Inc.

    Description: These high-performance silicon micromachined linear accelerometers and inclinometers consist of a sensor element and an ASIC packaged in a 5x5x1.2mm Dual Flat No-lead (DFN). The sensor element is fabricated from single-crystal silicon with proprietary Deep Reactive Ion Etching (DRIE) processes

    • Acceleration: 2 g
    • Frequency Range: 800 Hz
    • Number of Axes: Single Axis, Biaxial, Triaxial
    • Sensor Technology: MEMS

  • Supplier: Kionix, Inc.

    Description: with proprietary Deep Reactive Ion Etching (DRIE) processes and is protected from the environment by a hermetically-sealed silicon cap at the wafer level.The sensor element functions on the principle of differential capacitance. Acceleration causes displacement of a silicon structure resulting in a change

    • Sensor Type: Acceleration Sensor
    • Sensor Grade / Operating Range: Medical, Industrial, Consumer
    • Package Type / Mounting: Surface Mount (SMD)
    • Input (Supply) Voltage: 3.3 volts

  • Description: CM International Industries is a leader in global contract manufacturing since 1995. We are totally committed to satisfying our customers through our talent, experience and quality systems. Our goal is to provide every customer with the best price, quality and service. Engineering support (pre and

    • Capabilities: Broaching, Deep Hole Drilling, Drilling, Electrode EDM, Etching / Chemical Milling, Honing, Jig Boring, Laser Machining, Milling, Screw Machining, Superabrasive Machining, Swiss Machining, Turning, Wire EDM
    • Number of Axes: 2-axis Machining, 3-axis Machining, 4-axis Machining, 5-axis Machining
    • Specialty Machining: Casting Machining, Extrusion Machining, Forging Machining, Gear Manufacturing, Jigs and Fixtures, Rotary Transfer Machining, Tool & Die Manufacturing
    • Length Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48", Greater than 48"

  • Description: Excellent Transmission from 120nm to 7 Micron Rugged and Durable Resistant to Chemical Etching TECHSPEC® Magnesium Fluoride (MgF2) Windows offer excellent broadband transmission from the deep-UV to the mid-infrared. DUV transmission makes them ideal for use at the Hydrogen Lyman-alpha line

    • Window Type: Plane Windows
    • Window Shape: Circular
    • Diameter, Square Side, or Rectangular Length: 1.97 inch
    • Thickness: 0.1181 inch

  • Description: As an ISO 9001 -2008 certified machine shop, Paravis Monroe combines highend equipment along with experienced, skilled and dedicated toolmakers to offer superior advanced CNC machining to our customers. Our on going training of experienced toolmakers sets Paravis Monroe above the average shop that

    • Diameter: Less than 1", 1" - 3", 3" - 6", Greater than 6"
    • Materials: Aluminum, Brass, Bronze, Cast Iron, Composites, Copper, Glass, Glass Ceramics, Hardened Metals, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium
    • Services: CAD / CAM Support, Design Assistance, Just-in-Time Delivery, Prototype Services, Low Volume Production, High Volume Production
    • Location: North America, United States Only, Midwest US Only

  • Supplier: Cir-Q-Tek

    Description: Cir-Q-Tek has extensive knowledge and capabilities to be your first choice for machined, finished, heat treated, or assembled castings. Our engineering and production team will work from your specifications and develop a process for producing quality parts within your budget. Our services utilize

    • Capabilities: Deep Hole Drilling, Drilling, Electrode EDM, Etching / Chemical Milling, Honing, Jig Boring, Laser Machining, Milling, Screw Machining, Swiss Machining, Turning, Wire EDM
    • Number of Axes: 2-axis Machining, 3-axis Machining, 4-axis Machining, 5-axis Machining
    • Specialty Machining: Casting Machining, Extrusion Machining, Forging Machining, Jigs and Fixtures
    • Length Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48"

  • Supplier: STACI

    Description: STACI offers customers high quality, cost-effective Sheet Metal and Machined Parts Fabrication. In doing so, STACI takes pride in being extremely flexible and responsive to all of its customers’ needs. The company assists in managing specific customer requirements as well as providing a full

    • Machining Capabilities: Drilling, Milling, Turning, Screw Machining, Jig Boring, Broaching, Deep Hole Drilling, Centerless Grinding, OD / External Grinding, Jig Grinding, Surface Grinding, Laser Machining, Electrode EDM, Wire EDM, Etching / Chemical Milling
    • Secondary Operations: Anodizing, Black Oxide, Electroplating, Heat Treating / Stress Relieving, Lapping / Polishing, Painting / Powder Coating, Welding
    • Specialty Machining: Casting Machining, CNC Machining, Forging Machining, Gear Manufacturing, Jigs and Fixtures, Tool & Die Manufacturing
    • Materials: Aluminum, Brass, Bronze, Cast Iron, Copper, Nickel / Nickel Alloys, Plastics, Stainless Steel, Steel / Steel Alloys, Titanium, Stone / Marble / Granite

  • Description: Not all machining services providers are created equal- For outstanding Customer Service, Quality, Cost and Delivery- Trust Bullen Unique and innovative ultrasonic machining Prototype through production- scalable with a breadth of machining options to fit your specific requirement Technical

    • Machining Capabilities: Drilling, Milling, Turning, Water / Abrasive Jet Machining, Deep Hole Drilling, ID / Internal Grinding, OD / External Grinding, Jig Grinding, Surface Grinding, Laser Machining, Electrode EDM, Wire EDM, Etching / Chemical Milling, Other
    • Secondary Operations: Lapping / Polishing, Other
    • Specialty Machining: CNC Machining, Micro Machining
    • Materials: Carbide, Ceramics, Composites, Diamond / PCD, Glass, Glass Ceramics, Ultra-hard Materials, Quartz, Other

  • Description: CM International Industries is a leader in global contract manufacturing since 1995. We are totally committed to satisfying our customers through our talent, experience and quality systems. Our goal is to provide every customer with the best price, quality and service. Engineering support (pre and

    • Materials: Aluminum, Brass, Bronze, Copper, Hardened Metals, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium
    • Services: CAD / CAM Support, Design Assistance, Just-in-Time Delivery, High Volume Production
    • Location: North America, United States Only, Midwest US Only, East Asia / Pacific Only

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Conduct Research Top

  • Blasted away
    . This may produce an hourglass effect, which may help certain applications. An example of an etched glass substrate shows the taper effect of deep etching. This was etched to 1/4-in. depth. Quartz/glass etches quickly and this part was done within 5 min. Texturing roughens surfaces for subsequent
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    technology. Mitsubishi preps electrochemical etching process Mitsubishi Electric Corp. has developed a single-step, hydrofluoric acid electrochemical etching process that can achieve an aspect ratio greater than 60:1 at potentially a tenth of the cost of conventional deep dry etching. Mentor overhauls
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Heard on the Beat (July 13) Commentary & analysis of week's chip news Applied offers deep-trench silicon etch chamber for sub-100-nm DRAM processes SANTA CLARA, Calif.--Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching
  • MICRO: Special Apps
    have finally achieved their long-promised potential as a disruptive technology. A key process used to fabricate many MEMS devices is deep reactive-ion etching (DRIE) of silicon, which enables the creation of vertical trenches or holes that are typically in the 10- to 750- um range. These deep trenches
  • MICRO:Product Technology News (Jan '2000)
    An automated deep-UV spectrophotometer measures samples of thin-film coatings, photoresists, silicon wafers, deep-UV optics, dry fused silica, and calcium fluoride under vacuum or purged conditions. The CAMS-507 DUV provides precise, repeatable reflectance, absorption, and transmission measurements
  • Integrated cooling system lets chips beat the heat
    trenches about 100- m deep on back of a silicon wafer. A sacrificial layer of high-viscosity polymer fills in the trenches. Next, a polishing step removes excess polymer. A porous overcoat covers the filled trenches and the chip is gradually heated in a nitrogen atmosphere. The heating decomposes
  • MICRO: Critical Materials?Wafers
    , the wafer is lapped, etched, and polished. Lapping planarizes the wafer and removes most of the deep damage caused by slicing, while etching removes the damage caused by lapping. Lastly, polishing produces the final, top-quality
  • MICRO:Building Copperopolis, by Ted Cacouris, p.43 (July '99)
    that help prevent copper contamination. Copper diffusion in silicon devices can lead to two main types of failures: the deterioration of insulators at the interconnect levels, leading to shorts or leaky paths between conductors; and, because copper is a deep-level trap in the silicon bandgap, high

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