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  • Description: This PVC-1 plating tank has inside dimensions of 24"L X 4"W X 30"H and a wall thickness of 1/4". Tank is self-supporting and of welded construction and able to withstand temperatures up to 140F. Cover for this tank is #11055. On this 30" deep tank use angle iron or 2 x 4s, plus plywood or

    • Material: Plastic
    • Type: General Purpose/ Bulk Storage Tank

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  • Description: This PVC-1 plating tank has inside dimensions of 24"L X 8"W X 30"H and a wall thickness of 1/4". This tank holds approximately 20 gallons. Tank is self-supporting and of welded construction and able to withstand temperatures up to 140F. Cover for this tank is #11058. On this 30" deep tank use

    • Material: Plastic
    • Type: General Purpose/ Bulk Storage Tank

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  • Description: This PVC-1 plating tank has inside dimensions of 18"L X 4"W X 30"H and a wall thickness of 1/4". This tank holds approximately 9.3 gallons. Tank is self-supporting and of welded construction and able to withstand temperatures up to 140F. Cover for this tank is #11052. On this 30" deep tank

    • Material: Plastic
    • Type: General Purpose/ Bulk Storage Tank

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  • Description: This natural, translucent polypropylene plating tank has inside dimensions of 18" L x 4" W x 30" H and a wall thickness of 1/4". This tank holds approximately 9.3 gallons. Tank is self-supporting and of welded construction and able to withstand temperatures up to 200F. On all this 30" deep

    • Material: Plastic

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  • Description: The largest in the VLS platform line, the VLS6.60 has a wide and deep engraving area that can accommodate a variety of materials. The VLS6.60 offers a choice of six laser cartridges ranging in power from 10-60 watts. The material processing envelope of 32" x 18" x 9", 5,184 in3 (813 x

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  • Description: We are an independent metal fabricating company specializing in the burr-free abrasive cut-off of metal parts and the related capabilities required to meet all of our customers' tight tolerance requirements. You can find us in Cedar Grove, New Jersey, USA at our modern manufacturing facility

    • Additional Services: CAD / CAM Support, Design Assistance, Just-in-Time Delivery, Prototype Services, Low Volume Production, High Volume Production
    • Capabilities: Deep Hole Drilling, Drilling, Etching / Chemical Milling, Honing, Milling, Turning, Wire EDM
    • Location: North America, United States Only, Northeast US Only
    • Materials: Aluminum, Brass, Bronze, Cast Iron, Copper, Hardened Metals, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium

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  • Supplier: Tanfel

    Description: Tanfel offers a full solution for your custom fabricated metal part needs. A variety of materials and finishes are available along with tool fabrication, design support, stocking and warehousing options and a variety of other value added services. Prototype - Small Production - Large Production

    • Additional Services: CAD / CAM Support, Design Assistance, Just-in-Time Delivery, Prototype Services, Low Volume Production, High Volume Production, Reverse Engineering
    • Capabilities: Deep Hole Drilling, Drilling, Etching / Chemical Milling, Honing, Jig Boring, Milling, Screw Machining, Turning, Wire EDM
    • Diameter Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48"
    • Length Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48"

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  • Description: , sputtering, CVD, plasma strippers, and epitaxial reactors. Our specially patented ThermaBond technique is utilized to ceramically bond the deeply immersed thermocouple into a re-entrant cavity in the silicon to improve heat transfer and bond strength. The 1530 allows you to measure wafer

    • Applications: Semiconductor Wafers, CVD / PVD Films, Etching - Plasma / Wet
    • Form Factor: Wafer Probing System
    • Maximum Wafer / Part Size: 50 to 300 mm
    • Measurement Capability: Other

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  • Description: Not all machining services providers are created equal- For outstanding Customer Service, Quality, Cost and Delivery- Trust Bullen Unique and innovative ultrasonic machining Prototype through production- scalable with a breadth of machining options to fit your specific requirement Technical staff to

    • Location: North America, United States Only, Midwest US Only
    • Machining Capabilities: Drilling, Milling, Turning, Water / Abrasive Jet Machining, Deep Hole Drilling, ID / Internal Grinding, OD / External Grinding, Jig Grinding, Surface Grinding, Laser Machining, Electrode EDM, Wire EDM, Etching / Chemical Milling, Other
    • Materials: Carbide, Ceramics, Composites, Diamond / PCD, Glass, Glass Ceramics, Ultra-hard Materials, Quartz, Other
    • Secondary Operations: Lapping / Polishing, Other

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  • Description: ranging from off-plane X-ray gratings to toroidal VLS gratings for the VUV and transmission deep groove gratings for the IR range. For example, HORIBA Jobin Yvon produced the four gratings for NASA/JHU FUSE spectrograph. The gratings are 5800 gr/mm, aberration corrected, holographically ruled

    • Grating Design: Transmission
    • Grating Type: Ruled Grating, Holographic
    • Ion Etched: Yes
    • Wavelength Range: UV, Visible, IR

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  • Supplier: Cir-Q-Tek

    Description: Cir-Q-Tek has extensive knowledge and capabilities to be your first choice for machined, finished, heat treated, or assembled castings. Our engineering and production team will work from your specifications and develop a process for producing quality parts within your budget. Our services utilize

    • Location: North America, Europe Only
    • Machining Capabilities: Drilling, Milling, Turning, Screw Machining, Swiss Machining, Jig Boring, Deep Hole Drilling, Honing, Laser Machining, Electrode EDM, Wire EDM, Etching / Chemical Milling
    • Materials: Aluminum, Brass, Bronze, Cast Iron, Composites, Copper, Hardened Metals, Magnesium, Nickel / Nickel Alloys, Plastics, Stainless Steel, Steel / Steel Alloys
    • Secondary Operations: Anodizing, Black Oxide, Electroplating, Heat Treating / Stress Relieving, Lapping / Polishing, Painting / Powder Coating, Welding

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  • Description: Excellent Transmission from 120nm to 7 Micron Rugged and Durable Resistant to Chemical Etching TECHSPEC® Magnesium Fluoride (MgF2) Windows offer excellent broadband transmission from the deep-UV to the mid-infrared. DUV transmission makes

    • Diameter, Square Side, or Rectangular Length: 50 mm
    • Materials: Specialty / Other
    • Parallelism or Wedge Angle: 1 arcmin
    • Surface Flatness: λ/2

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  • Description: Excellent Transmission from 120nm to 7 Micron Rugged and Durable Resistant to Chemical Etching TECHSPEC® Magnesium Fluoride (MgF2) Windows offer excellent broadband transmission from the deep-UV to the mid-infrared. DUV transmission makes

    • Diameter, Square Side, or Rectangular Length: 25 mm
    • Materials: Specialty / Other
    • Parallelism or Wedge Angle: 1 arcmin
    • Surface Flatness: λ/2

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  • Description: Excellent Transmission from 120nm to 7 Micron Rugged and Durable Resistant to Chemical Etching TECHSPEC® Magnesium Fluoride (MgF2) Windows offer excellent broadband transmission from the deep-UV to the mid-infrared. DUV transmission makes

    • Diameter, Square Side, or Rectangular Length: 12.5 mm
    • Materials: Specialty / Other
    • Parallelism or Wedge Angle: 1 arcmin
    • Surface Flatness: λ/2

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  • Description: Excellent Transmission from 120nm to 7 Micron Rugged and Durable Resistant to Chemical Etching TECHSPEC® Magnesium Fluoride (MgF2) Windows offer excellent broadband transmission from the deep-UV to the mid-infrared. DUV transmission makes

    • Diameter, Square Side, or Rectangular Length: 5 mm
    • Materials: Specialty / Other
    • Parallelism or Wedge Angle: 1 arcmin
    • Surface Flatness: λ/2

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  • Supplier: Vexos

    Description: STACI offers customers high quality, cost-effective Sheet Metal and Machined Parts Fabrication. In doing so, STACI takes pride in being extremely flexible and responsive to all of its customers’ needs. The company assists in managing specific customer requirements as well as providing a full range

    • Location: North America, United States Only, Midwest US Only, Europe Only, East Asia / Pacific Only
    • Machining Capabilities: Drilling, Milling, Turning, Screw Machining, Jig Boring, Broaching, Deep Hole Drilling, Centerless Grinding, OD / External Grinding, Jig Grinding, Surface Grinding, Laser Machining, Electrode EDM, Wire EDM, Etching / Chemical Milling
    • Materials: Aluminum, Brass, Bronze, Cast Iron, Copper, Nickel / Nickel Alloys, Plastics, Stainless Steel, Steel / Steel Alloys, Titanium, Stone / Marble / Granite
    • Secondary Operations: Anodizing, Black Oxide, Electroplating, Heat Treating / Stress Relieving, Lapping / Polishing, Painting / Powder Coating, Welding

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  • Supplier: PENCOM

    Description: No Description Provided

    • Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only, Other
    • Machining Capabilities: Drilling, Milling, Turning, Screw Machining, Swiss Machining, Jig Boring, Broaching, Deep Hole Drilling, Centerless Grinding, Creep Feed Grinding, Double-disc Grinding, OD / External Grinding, Surface Grinding, Honing, Laser Machining, Electrode EDM, Wire EDM, Etching / Chemical
    • Materials: Aluminum, Brass, Bronze, Cast Iron, Composites, Copper, Hardened Metals, Nickel / Nickel Alloys, Plastics, Precious Metals, Rubber, Stainless Steel, Steel / Steel Alloys, Titanium
    • Secondary Operations: Anodizing, Black Oxide, Electroplating, Heat Treating / Stress Relieving, Lapping / Polishing, Painting / Powder Coating, Welding

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  • Description: No Description Provided

    • Location: North America, United States Only, Northeast US Only
    • Machining Capabilities: Drilling, Milling, Turning, Screw Machining, Swiss Machining, Water / Abrasive Jet Machining, Jig Boring, Broaching, Deep Hole Drilling, Centerless Grinding, Creep Feed Grinding, Double-disc Grinding, ID / Internal Grinding, OD / External Grinding, Jig Grinding, Surface Grinding, Honing,
    • Materials: Aluminum, Brass, Bronze, Carbide, Cast Iron, Ceramics, Composites, Copper, Diamond / PCD, Glass, Glass Ceramics, Hardened Metals, Nickel / Nickel Alloys, Plastics, Precious Metals, Rubber, Stainless Steel, Steel / Steel Alloys, Titanium, Stone / Marble / Granite, Ultra-hard Materials, Quartz, Wood
    • Secondary Operations: Anodizing, Black Oxide, Electroplating, Heat Treating / Stress Relieving, Lapping / Polishing, Painting / Powder Coating, Welding

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  • Description: Momentum draws together key technologies from around the world into a solution that works for you. You get familiar U.S. based design and customer service while gaining access to the most competitive manufacturing locations around the world. Design Manufacturing Assembly Logistics/Distribution

    • Additional Services: Assembly Services, High Volume Production, Other
    • Capabilities: Broaching, Deep Hole Drilling, Drilling, Electrode EDM, Etching / Chemical Milling, Honing, Jig Boring, Milling, Screw Machining, Turning, Wire EDM, Other
    • Diameter Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48", Greater than 48"
    • Length Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48", Greater than 48"

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  • Description: No Description Provided

    • Additional Services: Assembly Services, CAD / CAM Support, Design Assistance, Just-in-Time Delivery, Prototype Services, Low Volume Production, High Volume Production, Reverse Engineering
    • Capabilities: Deep Hole Drilling, Drilling, Electrode EDM, Etching / Chemical Milling, Milling, Screw Machining, Turning, Wire EDM, Other
    • Diameter Capacity: Less than 1", 1" - 3", 3" - 6"
    • Length Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48", Greater than 48"

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  • Description: the saftey-enclosed Class 2 laser cabinet. Incredibly Fast 2m/sec Marking Speeds Take advantage of the G2 laser's high-speed etching with marking speeds up to 2 meters per second for the highest quality at the fastest speeds. Easily Change Between Deep and Surface

    • CDRH Classification: Class II
    • Laser Output: Pulsed
    • Laser Power: 20000 to 50000 milliwatts
    • Laser Type: Fiber Lasers

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  • Description: As an ISO 9001 -2008 certified machine shop, Paravis Monroe combines highend equipment along with experienced, skilled and dedicated toolmakers to offer superior advanced CNC machining to our customers. Our on going training of experienced toolmakers sets Paravis Monroe above the average shop that

    • Location: North America, United States Only, Midwest US Only
    • Machining Capabilities: Drilling, Milling, Turning, Screw Machining, Swiss Machining, Abrasive Flow Machining, Water / Abrasive Jet Machining, Jig Boring, Broaching, Deep Hole Drilling, Centerless Grinding, Creep Feed Grinding, Double-disc Grinding, ID / Internal Grinding, OD / External Grinding, Jig Grinding,
    • Materials: Aluminum, Brass, Bronze, Cast Iron, Composites, Copper, Glass, Glass Ceramics, Hardened Metals, Magnesium, Nickel / Nickel Alloys, Plastics, Precious Metals, Rubber, Stainless Steel, Steel / Steel Alloys, Titanium, Stone / Marble / Granite, Ultra-hard Materials, Wood
    • Secondary Operations: Anodizing, Black Oxide, Electroplating, Heat Treating / Stress Relieving, Lapping / Polishing, Painting / Powder Coating, Welding

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  • Description: CM International Industries is a leader in global contract manufacturing since 1995. We are totally committed to satisfying our customers through our talent, experience and quality systems. Our goal is to provide every customer with the best price, quality and service. Engineering support (pre and

    • Location: North America, United States Only, Midwest US Only, East Asia / Pacific Only
    • Machining Capabilities: Drilling, Milling, Turning, Screw Machining, Swiss Machining, Water / Abrasive Jet Machining, Jig Boring, Broaching, Deep Hole Drilling, Centerless Grinding, Creep Feed Grinding, Double-disc Grinding, ID / Internal Grinding, OD / External Grinding, Jig Grinding, Surface Grinding, Honing,
    • Materials: Aluminum, Brass, Bronze, Cast Iron, Copper, Hardened Metals, Magnesium, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium
    • Secondary Operations: Anodizing, Black Oxide, Electroplating, Heat Treating / Stress Relieving, Lapping / Polishing, Painting / Powder Coating, Welding

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  • Description: package. The sensor element is fabricated from single-crystal silicon with proprietary Deep Reactive Ion Etching (DRIE) processes and is protected from the environment by a hermetically-sealed silicon cap at the wafer level. The sensor element functions on the principle of differential

    • Number of Axes: Triaxial
    • Operating Temperature: -40 to 185 F

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  • Description: CM International Industries is a leader in global contract manufacturing since 1995. We are totally committed to satisfying our customers through our talent, experience and quality systems. Our goal is to provide every customer with the best price, quality and service. Engineering support (pre and

    • Additional Services: Assembly Services, CAD / CAM Support, Design Assistance, Just-in-Time Delivery, Prototype Services, High Volume Production, Reverse Engineering
    • Capabilities: Broaching, Deep Hole Drilling, Drilling, Electrode EDM, Etching / Chemical Milling, Honing, Jig Boring, Laser Machining, Milling, Screw Machining, Superabrasive Machining, Swiss Machining, Turning, Wire EDM
    • Diameter Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48", Greater than 48"
    • Length Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48", Greater than 48"

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  • Supplier: Kionix, Inc.

    Description: These high-performance silicon micromachined linear accelerometersand inclinometers consist of a sensor element and an ASIC packaged in a3x3x0.9mm Land Grid Array (LGA). The sensor element is fabricated fromsingle-crystal silicon with proprietary Deep Reactive Ion Etching(DRIE)

    • Input (Supply) Voltage: 2.8 volts
    • Operating Temperature: -40 to 85 C
    • Package Type / Mounting: Surface Mount (SMD)
    • RoHS Compliant: Yes

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  • Supplier: Kionix, Inc.

    Description: These high-performance silicon micromachined linear accelerometersand inclinometers consist of a sensor element and an ASIC packaged in a3x5x0.9mm Land Grid Array (LGA). The sensor element is fabricated fromsingle-crystal silicon with proprietary Deep Reactive Ion Etching(DRIE)

    • Input (Supply) Voltage: 3.3 volts
    • Operating Temperature: -40 to 85 C
    • Package Type / Mounting: Surface Mount (SMD)
    • RoHS Compliant: Yes

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  • Supplier: Kionix, Inc.

    Description: These high-performance silicon micromachined linear accelerometers and inclinometers consist of a sensor element and an ASIC packaged in a 5x5x1.2mm Dual Flat No-lead (DFN). The sensor element is fabricated from single-crystal silicon with proprietary Deep Reactive Ion Etching (DRIE)

    • Input (Supply) Voltage: 5 volts
    • Operating Temperature: -40 to 125 C
    • Package Type / Mounting: Surface Mount (SMD)
    • RoHS Compliant: Yes

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  • Supplier: Kionix, Inc.

    Description: proprietary Deep Reactive Ion Etching (DRIE) processes and is protected from the environment by a hermetically-sealed silicon cap at the wafer level.The sensor element functions on the principle of differential capacitance. Acceleration causes displacement of a silicon structure

    • Input (Supply) Voltage: 3.3 volts
    • Operating Temperature: -40 to 85 C
    • Package Type / Mounting: Surface Mount (SMD)
    • RoHS Compliant: Yes

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  • Description: JST's Quartz Tubewash Station allows etching and washing of quartz tubes and miscellaneous quartz components. The unit includes two baths which are identical except one unit comes equipped with a rotation system. This rotation system provides a uniform cleaning process

    • System Type: Immersion Systems - Ultrasonic

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Conduct Research Top

  • Blasted away
    . This may produce an hourglass effect, which may help certain applications. An example of an etched glass substrate shows the taper effect of deep etching. This was etched to 1/4-in. depth. Quartz/glass etches quickly and this part was done within 5 min. Texturing roughens surfaces for subsequent
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    technology. Mitsubishi preps electrochemical etching process Mitsubishi Electric Corp. has developed a single-step, hydrofluoric acid electrochemical etching process that can achieve an aspect ratio greater than 60:1 at potentially a tenth of the cost of conventional deep dry etching. Mentor overhauls
  • MICRO:Product Technology News (Jan '2000)
    An automated deep-UV spectrophotometer measures samples of thin-film coatings, photoresists, silicon wafers, deep-UV optics, dry fused silica, and calcium fluoride under vacuum or purged conditions. The CAMS-507 DUV provides precise, repeatable reflectance, absorption, and transmission measurements
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Heard on the Beat (July 13) Commentary & analysis of week's chip news Applied offers deep-trench silicon etch chamber for sub-100-nm DRAM processes SANTA CLARA, Calif.--Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching
  • MICRO: Special Apps
    have finally achieved their long-promised potential as a disruptive technology. A key process used to fabricate many MEMS devices is deep reactive-ion etching (DRIE) of silicon, which enables the creation of vertical trenches or holes that are typically in the 10- to 750- um range. These deep trenches
  • Integrated cooling system lets chips beat the heat
    . In contrast, Georgia Tech's CMOS-compatible technique works at temperatures <260 C and builds microfluidiccooling channels without damaging attached circuits. The scheme works on gigascale integrated (GSI) chips and is fully compatible with conventional flip-chip packaging. Researchers begin by etching
  • MICRO: Products
    Designed for deep-oxide etching in MEMS and MOEMS applications, the AMS 200 DE (dielectric etcher) meets the requirements of using SiO quartz and other glasslike materials, which are often better adapted than silicon or silicon on insulator for microoptical elements and microfluidic components
  • MICRO: Critical Materials?Wafers
    , the wafer is lapped, etched, and polished. Lapping planarizes the wafer and removes most of the deep damage caused by slicing, while etching removes the damage caused by lapping. Lastly, polishing produces the final, top-quality

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