Products & Services

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  • Description: Deep and Surface Etching Quickly adjust your marking depth between surface marks and deep engraving by simply changing your laser's settings in the print driver. Etch a Full Table Full of Parts at One Time Engrave a large fixture full of parts at one time in less time than ever before using

    • Laser Output: Pulsed
    • Laser Wavelength: Red
    • Wavelength Range: 600 to 700 nm
    • Laser Power: 20000 to 50000 milliwatts

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  • Description: We are an independent metal fabricating company specializing in the burr-free abrasive cut-off of metal parts and the related capabilities required to meet all of our customers' tight tolerance requirements. You can find us in Cedar Grove, New Jersey, USA at our modern manufacturing facility

    • Capabilities: Deep Hole Drilling, Drilling, Etching / Chemical Milling, Honing, Milling, Turning, Wire EDM
    • Number of Axes: 4-axis Machining
    • Micro Machining: Yes
    • Materials: Aluminum, Brass, Bronze, Cast Iron, Copper, Hardened Metals, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium

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  • Description: off-plane X-ray gratings to toroidal VLS gratings for the VUV and transmission deep groove gratings for the IR range. For example, HORIBA Jobin Yvon produced the four gratings for NASA/JHU FUSE spectrograph. The gratings are 5800 gr/mm, aberration corrected, holographically ruled on 300x300 mm

    • Grating Type: Ruled Grating, Holographic
    • Grating Design: Transmission
    • Ion Etched: Yes
    • Wavelength Range: UV, Visible, IR

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  • Supplier: Kionix, Inc.

    Description: These high-performance silicon micromachined linear accelerometersand inclinometers consist of a sensor element and an ASIC packaged in a5x5x1.2mm Dual Flat No-lead (DFN). The sensor element is fabricatedfrom single-crystal silicon with proprietary Deep Reactive Ion Etching(DRIE) processes

    • Acceleration: 2 g
    • Frequency Range: 0.0 to 1700 Hz
    • Number of Axes: Single Axis, Biaxial, Triaxial
    • Sensor Technology: MEMS

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  • Supplier: Kionix, Inc.

    Description: These high-performance silicon micromachined linear accelerometers and inclinometers consist of a sensor element and an ASIC packaged in a 5x5x1.2mm Dual Flat No-lead (DFN). The sensor element is fabricated from single-crystal silicon with proprietary Deep Reactive Ion Etching (DRIE) processes

    • Acceleration: 2 g
    • Frequency Range: 800 Hz
    • Number of Axes: Single Axis, Biaxial, Triaxial
    • Sensor Technology: MEMS

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  • Supplier: Kionix, Inc.

    Description: These high-performance silicon micromachined linear accelerometers and inclinometers consist of a sensor element and an ASIC packaged in a 5x5x1.2mm Dual Flat No-lead (DFN). The sensor element is fabricated from single-crystal silicon with proprietary Deep Reactive Ion Etching (DRIE) processes

    • Sensor Type: Acceleration Sensor
    • Sensor Grade / Operating Range: Medical, Automotive, Industrial, Consumer
    • Package Type / Mounting: Surface Mount (SMD)
    • Input (Supply) Voltage: 5 volts

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  • Description: Excellent Transmission from 120nm to 7 Micron Rugged and Durable Resistant to Chemical Etching TECHSPEC® Magnesium Fluoride (MgF2) Windows offer excellent broadband transmission from the deep-UV to the mid-infrared. DUV transmission makes them ideal for use at the Hydrogen Lyman-alpha line

    • Window Type: Plane Windows
    • Window Shape: Circular
    • Diameter, Square Side, or Rectangular Length: 1.97 inch
    • Thickness: 0.1181 inch

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  • Description: No Description Provided

    • Capabilities: Deep Hole Drilling, Drilling, Electrode EDM, Etching / Chemical Milling, Milling, Screw Machining, Turning, Wire EDM, Other
    • Number of Axes: 3-axis Machining
    • Specialty Machining: Jigs and Fixtures, Tool & Die Manufacturing
    • Length Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48", Greater than 48"

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  • Description: CM International Industries is a leader in global contract manufacturing since 1995. We are totally committed to satisfying our customers through our talent, experience and quality systems. Our goal is to provide every customer with the best price, quality and service. Engineering support (pre and

    • Capabilities: Broaching, Deep Hole Drilling, Drilling, Electrode EDM, Etching / Chemical Milling, Honing, Jig Boring, Laser Machining, Milling, Screw Machining, Superabrasive Machining, Swiss Machining, Turning, Wire EDM
    • Number of Axes: 2-axis Machining, 3-axis Machining, 4-axis Machining, 5-axis Machining
    • Specialty Machining: Casting Machining, Extrusion Machining, Forging Machining, Gear Manufacturing, Jigs and Fixtures, Rotary Transfer Machining, Tool & Die Manufacturing
    • Length Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48", Greater than 48"

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  • Supplier: Cir-Q-Tek

    Description: Cir-Q-Tek has extensive knowledge and capabilities to be your first choice for machined, finished, heat treated, or assembled castings. Our engineering and production team will work from your specifications and develop a process for producing quality parts within your budget. Our services utilize

    • Capabilities: Deep Hole Drilling, Drilling, Electrode EDM, Etching / Chemical Milling, Honing, Jig Boring, Laser Machining, Milling, Screw Machining, Swiss Machining, Turning, Wire EDM
    • Number of Axes: 2-axis Machining, 3-axis Machining, 4-axis Machining, 5-axis Machining
    • Specialty Machining: Casting Machining, Extrusion Machining, Forging Machining, Jigs and Fixtures
    • Length Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48"

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  • Description: Not all machining services providers are created equal- For outstanding Customer Service, Quality, Cost and Delivery- Trust Bullen Unique and innovative ultrasonic machining Prototype through production- scalable with a breadth of machining options to fit your specific requirement Technical

    • Machining Capabilities: Drilling, Milling, Turning, Water / Abrasive Jet Machining, Deep Hole Drilling, ID / Internal Grinding, OD / External Grinding, Jig Grinding, Surface Grinding, Laser Machining, Electrode EDM, Wire EDM, Etching / Chemical Milling, Other
    • Secondary Operations: Lapping / Polishing, Other
    • Specialty Machining: CNC Machining, Micro Machining
    • Materials: Carbide, Ceramics, Composites, Diamond / PCD, Glass, Glass Ceramics, Ultra-hard Materials, Quartz, Other

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  • Supplier: Vexos

    Description: STACI offers customers high quality, cost-effective Sheet Metal and Machined Parts Fabrication. In doing so, STACI takes pride in being extremely flexible and responsive to all of its customers’ needs. The company assists in managing specific customer requirements as well as providing a full

    • Machining Capabilities: Drilling, Milling, Turning, Screw Machining, Jig Boring, Broaching, Deep Hole Drilling, Centerless Grinding, OD / External Grinding, Jig Grinding, Surface Grinding, Laser Machining, Electrode EDM, Wire EDM, Etching / Chemical Milling
    • Secondary Operations: Anodizing, Black Oxide, Electroplating, Heat Treating / Stress Relieving, Lapping / Polishing, Painting / Powder Coating, Welding
    • Specialty Machining: Casting Machining, CNC Machining, Forging Machining, Gear Manufacturing, Jigs and Fixtures, Tool & Die Manufacturing
    • Materials: Aluminum, Brass, Bronze, Cast Iron, Copper, Nickel / Nickel Alloys, Plastics, Stainless Steel, Steel / Steel Alloys, Titanium, Stone / Marble / Granite

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  • Description: CM International Industries is a leader in global contract manufacturing since 1995. We are totally committed to satisfying our customers through our talent, experience and quality systems. Our goal is to provide every customer with the best price, quality and service. Engineering support (pre and

    • Materials: Aluminum, Brass, Bronze, Copper, Hardened Metals, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium
    • Services: CAD / CAM Support, Design Assistance, Just-in-Time Delivery, High Volume Production
    • Location: North America, United States Only, Midwest US Only, East Asia / Pacific Only

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  • Description: JST's Quartz Tubewash Station allows etching and washing of quartz tubes and miscellaneous quartz components. The unit includes two baths which are identical except one unit comes equipped with a rotation system. This rotation system provides a uniform cleaning process while minimizing chemical

    • Machine Type: Immersion Systems - Ultrasonic

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  • Description: This natural, translucent polypropylene plating tank has inside dimensions of 24" L x 4" W x 30" H and a wall thickness of 1/4". Tank is self-supporting and of welded construction and able to withstand temperatures up to 200F. On all this 30" deep tank use angle iron or 2 x 4s, plus plywood

    • Material: Plastic

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  • Description: , sputtering, CVD, plasma strippers, and epitaxial reactors. Our specially patented ThermaBond technique is utilized to ceramically bond the deeply immersed thermocouple into a re-entrant cavity in the silicon to improve heat transfer and bond strength. The 1530 allows you to measure wafer temperatures

    • Form Factor: Wafer Probing System
    • Mounting / Loading: In-situ / System Mounted
    • Applications: Semiconductor Wafers, CVD / PVD Films, Etching - Plasma / Wet
    • Measurement Capability: Other

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Conduct Research Top

  • Blasted away
    . This may produce an hourglass effect, which may help certain applications. An example of an etched glass substrate shows the taper effect of deep etching. This was etched to 1/4-in. depth. Quartz/glass etches quickly and this part was done within 5 min. Texturing roughens surfaces for subsequent
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    technology. Mitsubishi preps electrochemical etching process Mitsubishi Electric Corp. has developed a single-step, hydrofluoric acid electrochemical etching process that can achieve an aspect ratio greater than 60:1 at potentially a tenth of the cost of conventional deep dry etching. Mentor overhauls
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Heard on the Beat (July 13) Commentary & analysis of week's chip news Applied offers deep-trench silicon etch chamber for sub-100-nm DRAM processes SANTA CLARA, Calif.--Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching
  • MICRO:Product Technology News (Jan '2000)
    An automated deep-UV spectrophotometer measures samples of thin-film coatings, photoresists, silicon wafers, deep-UV optics, dry fused silica, and calcium fluoride under vacuum or purged conditions. The CAMS-507 DUV provides precise, repeatable reflectance, absorption, and transmission measurements
  • MICRO: Special Apps
    have finally achieved their long-promised potential as a disruptive technology. A key process used to fabricate many MEMS devices is deep reactive-ion etching (DRIE) of silicon, which enables the creation of vertical trenches or holes that are typically in the 10- to 750- um range. These deep trenches
  • Integrated cooling system lets chips beat the heat
    . In contrast, Georgia Tech's CMOS-compatible technique works at temperatures <260 C and builds microfluidiccooling channels without damaging attached circuits. The scheme works on gigascale integrated (GSI) chips and is fully compatible with conventional flip-chip packaging. Researchers begin by etching
  • MICRO: Products
    Designed for deep-oxide etching in MEMS and MOEMS applications, the AMS 200 DE (dielectric etcher) meets the requirements of using SiO quartz and other glasslike materials, which are often better adapted than silicon or silicon on insulator for microoptical elements and microfluidic components
  • MICRO:Building Copperopolis, by Ted Cacouris, p.43 (July '99)
    The semiconductor industry's introduction of copper into the manufacturing process raises some important issues concerning copper contamination. Several key developments have fostered the transition from aluminum to copper interconnects: damascene processing to surmount the difficulties in etching

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