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Diamond Slurry

 

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Abrasive compounds and abrasive slurries are used to improve surface finish or flatness. They often consist of fine abrasives in slurry, bar, powder or paste forms.
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Parts by Number for Diamond Slurry Top

Partb # Distributor Manufacturer Product Category Description
3155153 RS Components, Ltd. RS Components Diamond Pastes and Slurries Colour:Blue; Grade:1Micron; Type:Diamond Slurry; Micron Range:0 - 2
3155175 RS Components, Ltd. RS Components Diamond Pastes and Slurries Colour:Yellow; Grade:6Micron; Type:Diamond Slurry; Micron Range:4 - 8
3156140 RS Components, Ltd. RS Components Diamond Pastes and Slurries Colour:Green; Grade:3Micron; Type:Diamond Slurry; Micron Range:2 - 4
3155147 RS Components, Ltd. RS Components Diamond Pastes and Slurries Colour:Grey; Grade:1/4Micron; Type:Diamond Slurry; Micron Range:0 - 0.5
3155169 RS Components, Ltd. RS Components Diamond Pastes and Slurries Colour:Red; Grade:8Micron; Type:Diamond Slurry; Micron Range:6 - 10

Conduct Research Top

  • Low Defect Ceria-Based Slurries: Novel Selectivity, Slurry Characterization, and Polishing Mechanisms (.pdf)
    distribution analyzer. Infrared spectra were obtained. on a Nicolet Magna 560 FTIR equipped with a diamond ATR probe and were auto-baseline. corrected. Distortions due to diamond in the region of 1800-2400 cm-1 were blanked out. 5.3 Polish Results. Polishing was done on an Applied Materials 200mm Mirra
  • Thin-Film Sputtering Deposition Strain Sensors
    any material can be used as a substrate for the sensor including stainless steel, Inconel, Hastaloy, aluminium, sapphire, and titanium. The process begins by preparing the surface of the substrate with a diamond slurry to remove all surface pinholes and cracks. A dielectric layer is first deposited
  • MICRO: Characterizing CMP
    the wafer/slurry/polishing pad interaction and is a fairly good approximation of relatively mechanical processes such as STI and ILD CMP. To characterize CMP pad conditioning using diamond abrasives, researchers at SpeedFam-IPEC (Chandler, AZ) modified a tribometer from the Center for Engineering
  • MICRO: green mfg
    was performed using a 100-grit diamond disk at a pressure of 0.5 psi (3.5 kPa), a rotational velocity of 30 rpm, and a disk sweep frequency of 20 per minute. Conditioning was followed by a 2-minute pad break-in step using a silicon dummy wafer. Other experimental conditions included: * In situ conditioning
  • MICRO: Green and Clean
    diamond disk at a disk pressure of 0.5 psi, a rotational velocity of 30 rpm, and a disk oscillation frequency of 20 oscillations/min. Pad conditioning was followed by a 5-minute break-in with a dummy wafer. The rotational speed of the wafer was matched to the rotational speed of the pad, and the slurry
  • Substrates and Discs
    diamond core drills and diamond bandsaws. Craftsmen slice the rods or sections into discs that are roughly the size of the final component. The roughly plane-parallel surfaces of the discs are ground with a coarse diamond slurry to bring the optical surfaces into approximate conformance with the final
  • MICRO:Taking Control 2
    abrasion and chemical reactions to remove material from the wafer surface. Between wafer polishes, the pad must be conditioned. Conditioning typically involves applying an abrasive or cutting element, such as a diamond wheel, to the pad surface to restore its roughness. As with any manufacturing
  • AN0016 Micro-sectioning of Multilayer Ceramic Capacitors
    to determine in some cases whether faults are real or artifacts by changing the. grinding direction periodically, and examining the micro section at each stage. Polishing of Micro Section. It is common to use fine diamond slurries to polish micro sections. These may be of very fine. particle size (example

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