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  • Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
    surfaces. The wafer mounting film is analyzed by Fourier Transform Infrared Spectroscopy. A process related failure in conductive die attach systems is described and corrective actions are presented. This analytical approach can be extended to other epoxy attach materials systems.
  • Medical Device Link .
    a very short interface between the die-bond pads and the uZ ball-stack package substrate. (click to enlarge). The example of the through-slot wire-bond package unit shown in Figure 3 is for a high-performance DRAM die with center-located bond pads. Following die attach and wire-bond, the bond
  • Spin-Coating Waferbumping Fluxes for Semiconductor Assembly: Ensuring Pristine Microbumps in Dimensional Devices
    As semiconductor nodes and die shrink, the. number of I/Os will either increase or. remain relatively constant, leading to a. need for finer pitches. With device-device. interconnect pitches shrinking below the. 100micron level, plated copper pillars with. plated solder microbumps have supplanted
  • An Advanced Steering Wheel Sensor
    . The discrete components are reflow soldered. The ASIC is attached by using conventional die attach and wire bond followed by encapsulation of the exposed wires and chip. Two screws fasten the front and rear housings. Electrical connection is accomplished by soldering the five exposed terminals
  • Medical Device Link .
    of adhesives suppliers appears here. Lite Fast UV adhesive from MLT is 100% solvent free and 100% solid systems. Reduced drying times allow the product to be immediately handled and packaged. Silver-Filled Epoxy Die-Attach Adhesive. A one-component, silver-filled epoxy adhesive from Huntsman Advanced
  • The Miracle of Soldering - an Historical Perspective
    . Indium8.9 Series. Lead-Free. Tin-Lead. Package-on-Package Paste. Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder
  • Humidity and Solder Paste - Avoid Issues
    /High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste and Powders. Wire
  • Adding Solder to a NanoBond (R) Assembly
    . Package-on-Package Paste. Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel
  • Solder Powder: IPC
    . Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste

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